公开(公告)号：US20090246910A1

公开(公告)日：2009-10-01

申请号：US12382412

申请日：2009-03-12

Applicant: Harutaka Taniguchi ,  Yoshinari Ikeda

Inventor： Harutaka Taniguchi ,  Yoshinari Ikeda

IPC: H01L21/60

CPC classification number: H05K3/34 ,  H01L23/5385 ,  H01L24/01 ,  H01L24/32 ,  H01L24/33 ,  H01L24/73 ,  H01L24/83 ,  H01L24/91 ,  H01L25/072 ,  H01L25/50 ,  H01L2224/26145 ,  H01L2224/27013 ,  H01L2224/291 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83365 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/0135 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/157 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/145 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10962 ,  H05K2201/10969 ,  H05K2203/0405 ,  H01L2924/00 ,  H01L2924/07025 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/01028

Abstract: A semiconductor device manufacturing method includes the steps of preparing a semiconductor element having a first electrode, a second electrode, and a third electrode facing the first electrode and second electrode, the first electrode and second electrode being electrically separated by an insulating layer; arranging a first conductive bonding material on a first metal foil and placing the semiconductor element on the first conductive bonding material; supporting a sheet-shape second conductive bonding material by the insulating layer; arranging a first post electrode and a second post electrode above the first and second electrodes respectively with the second conductive bonding material intervening therebetween; and forming a first conductive bonding layer for bonding the first electrode and the first post electrode, a second conductive bonding layer for bonding the second electrode and the second post electrode, and a third conductive bonding layer for bonding the third electrode and the first metal foil.

Abstract translation: 半导体器件制造方法包括以下步骤：制备具有第一电极，第二电极和与第一电极和第二电极相对的第三电极的半导体元件，所述第一电极和第二电极通过绝缘层电隔离; 在第一金属箔上布置第一导电接合材料并将半导体元件放置在第一导电接合材料上; 通过绝缘层支撑片状第二导电接合材料; 在所述第一和第二电极上方分别设置第一电极和第二电极，所述第二电极和第二电极分别与所述第二电极和所述第二电极之间插入所述第二电极和第二电极。 以及形成用于接合所述第一电极和所述第一电极的第一导电接合层，用于接合所述第二电极和所述第二电极的第二导电接合层，以及用于接合所述第三电极和所述第一金属箔的第三导电接合层 。

公开(公告)号：US20090233468A1

公开(公告)日：2009-09-17

申请号：US12285893

申请日：2008-10-16

Applicant: Shiro Yamashita ,  Hideto Yoshinari

Inventor： Shiro Yamashita ,  Hideto Yoshinari

IPC: H01R12/00

CPC classification number: H05K1/119 ,  H05K1/0366 ,  H05K1/056 ,  H05K1/141 ,  H05K3/308 ,  H05K3/42 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10803 ,  Y10S439/941

Abstract: In a module, press-fit connection using a pin terminal including a connection part separated into two parts and a flat plane parallel to the lengthwise direction in the separation part and perpendicular to the separation direction of the pin terminal is performed. A through-hole of a board is structured so that an inner diameter of the through-hole at a middle part in the thickness direction of the board is smaller than that at obverse and reverse surfaces of the board and the length of the middle part of the through-hole connected to the pin terminal is shorter than the length of the flat plane of the pin terminal.

Abstract translation: 在模块中，使用包括分离成两部分的连接部分的引脚端子和在分离部分中与长度方向平行的平面并且垂直于引脚端子的分离方向的压配合连接。 板的通孔的结构使得板的厚度方向中间部分处的通孔的内径小于板的正面和反面以及中间部分的长度 连接到引脚端子的通孔比引脚端子的平面的长度短。

公开(公告)号：US20090175012A1

公开(公告)日：2009-07-09

申请号：US11969401

申请日：2008-01-04

Applicant: Gary D. Frasco

Inventor： Gary D. Frasco

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H05K1/184 ,  H05K3/3442 ,  H05K3/4046 ,  H05K2201/10583 ,  H05K2201/1059 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49139

Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body.

Abstract translation: 压配合的无源部件，例如电阻器或电容器，适于装配在印刷电路板的通孔内或部分位于印刷电路板的通孔内。 在一个示例中，压配合无源部件具有在本体的任一端具有可焊接端子的圆柱形体，以及至少部分地围绕圆柱形主体设置的介电轴颈。

公开(公告)号：US07532484B1

公开(公告)日：2009-05-12

申请号：US12069469

申请日：2008-02-11

Applicant: Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

Inventor： Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

IPC: H01R9/00

CPC classification number: H01G2/06 ,  H01G2/103 ,  H01R12/585 ,  H05K3/301 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/10325 ,  H05K2201/1059 ,  H05K2201/10651

Abstract: An electronic component assembly includes an electrical component assembled to a base and mounted to a support. The component electrical leads protrude through holes, along a channel, and make contact with connectors on the base. The base is formed of a polymeric material and contains protrusions for mechanically supporting the electrical component. When the base is mounted to the support, the connectors complete the electrical connection between the electrical component and the support.

Abstract translation: 电子部件组件包括组装到基座并安装到支撑件的电气部件。 部件电气引线沿着通道突出穿过孔，并与基座上的连接器接触。 基座由聚合物材料形成并且包含用于机械地支撑电气部件的凸起。 当基座安装到支撑件上时，连接器完成电气部件和支撑件之间的电气连接。

公开(公告)号：US07500855B2

公开(公告)日：2009-03-10

申请号：US11554406

申请日：2006-10-30

Applicant: Thomas Andrew Kari

Inventor： Thomas Andrew Kari

IPC: H01R12/00

CPC classification number: H05K1/0243 ,  H01R12/725 ,  H01R24/50 ,  H01R2103/00 ,  H05K2201/09809 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/1059

Abstract: A self-fixturing, self-aligning coaxial connector assembly is provided. The coaxial connector assembly comprises a coaxial connector, a coaxial housing and a printed circuit board. The printed circuit board is aligned properly with the electrical end of the coaxial connector when mounted on the coaxial housing and is held in place while the printed circuit board is coupled to the coaxial housing.

Abstract translation: 提供自固定，自对准的同轴连接器组件。 同轴连接器组件包括同轴连接器，同轴壳体和印刷电路板。 当安装在同轴壳体上时，印刷电路板与同轴连接器的电端正确地对准，并且当印刷电路板耦合到同轴壳体时被固定就位。

公开(公告)号：US20090040736A1

公开(公告)日：2009-02-12

申请号：US12222072

申请日：2008-08-04

Applicant: Frank Becherer ,  Winfried Rauer ,  Ralf Koernle

Inventor： Frank Becherer ,  Winfried Rauer ,  Ralf Koernle

IPC: H05K1/14

CPC classification number: H01R12/52 ,  H05K1/14 ,  H05K1/148 ,  H05K3/366 ,  H05K2201/047 ,  H05K2201/048 ,  H05K2201/1059 ,  H05K2201/10598

Abstract: Multi-part circuit board comprising at least two partial boards (1, 2, 3, 4) and flexible signal lines (7), wherein at least one clamping element (10), which can be inserted into at least one clamping opening (12) of another partial board (4), is integrally molded onto at least one partial board (1).

Abstract translation: 包括至少两个部分板（1,2,3,4）和柔性信号线（7）的多部分电路板，其中至少一个夹紧元件（10）可插入至少一个夹紧开口（12） ）被一体地模制在至少一个局部板（1）上。

公开(公告)号：US07481671B1

公开(公告)日：2009-01-27

申请号：US11934276

申请日：2007-11-02

Applicant: Dominic Anthony Farole ,  Keith Edwin Miller

Inventor： Dominic Anthony Farole ,  Keith Edwin Miller

IPC: H01R31/08

CPC classification number: H01R13/405 ,  H01R12/58 ,  H05B3/24 ,  H05K3/222 ,  H05K3/308 ,  H05K2201/10212 ,  H05K2201/1028 ,  H05K2201/1059

Abstract: An array of thin metallic foil strips of predetermined thickness electrically connected to a printed circuit board, cables or attached to wires. An associated power source, on the printed circuit board, or attached to the circuit board, cables or wires, directs an electrical current through L-shaped contacts to one or more of the strips in the array of foil strips. The foil strips are in contact with horizontal legs of the L-shaped contacts. Depending upon the use of the circuit board, the foil strips can be used to start or to end an operation. The selection of the foil strip makes use of the electrical properties of the selected metal such as its resistivity as well as the thickness, length and width of the foil strips to provide a strip with characteristics required to achieve a preselected result. As an electric current is provided by a power source, it passes through one or more foil strips. The application of current through the metallic material can be used to achieve a number of results, such as to act as a heating element.

Abstract translation: 具有预定厚度的薄金属箔条的阵列电连接到印刷电路板，电缆或附接到电线。 在印刷电路板上或连接到电路板，电缆或电线上的相关电源将电流通过L形触点引导到箔条阵列中的一个或多个条。 箔条与L形触点的水平腿接触。 根据电路板的使用，箔条可用于启动或结束操作。 箔条的选择利用所选择的金属的电性质，例如其电阻率以及箔条的厚度，长度和宽度，以提供具有实现预选结果所需的特性的条带。 由于电源由电源提供，所以它通过一个或多个箔条。 可以使用通过金属材料的电流来实现多种结果，例如用作加热元件。

公开(公告)号：US20090001576A1

公开(公告)日：2009-01-01

申请号：US11771909

申请日：2007-06-29

Applicant: Surinder Tuli ,  Wayne Mulholland ,  Song-Hua Shi ,  Ioan Sauciuc ,  Patricia Brusso ,  Jacinta Aman Lim

Inventor： Surinder Tuli ,  Wayne Mulholland ,  Song-Hua Shi ,  Ioan Sauciuc ,  Patricia Brusso ,  Jacinta Aman Lim

IPC: H01L23/52 ,  H01L21/60

CPC classification number: H01L23/49827 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/16 ,  H01L2224/81191 ,  H01L2224/81801 ,  H01L2924/01079 ,  H01L2924/01087 ,  H05K3/32 ,  H05K2201/0367 ,  H05K2201/10378 ,  H05K2201/1059 ,  H05K2201/10734 ,  H05K2203/1147 ,  H05K2203/1189

Abstract: A semiconductor package comprises a substrate that has a first protruding interconnect and a semiconductor die that has a second protruding interconnect that faces the first protruding interconnect. The package further comprises a spacer provided between the substrate and the die, wherein the spacer comprises a hole filled with liquid metal to couple the first protruding interconnect to the second protruding interconnect.

Abstract translation: 半导体封装包括具有第一突出互连的衬底和具有面向第一突出互连的第二突出互连的半导体管芯。 所述封装还包括设置在所述基板和所述管芯之间的间隔件，其中所述间隔件包括填充有液态金属的孔，以将所述第一突出互连件耦合到所述第二突出互连件。

公开(公告)号：US20080278217A1

公开(公告)日：2008-11-13

申请号：US11745220

申请日：2007-05-07

Applicant: Johannes Hankhofer ,  Manfred Mengel ,  Stephan Schaecher

Inventor： Johannes Hankhofer ,  Manfred Mengel ,  Stephan Schaecher

IPC: H05K10/00

CPC classification number: H05K5/0208 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0275 ,  H05K1/0293 ,  H05K1/181 ,  H05K3/308 ,  H05K2201/09645 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2201/10371 ,  H05K2201/1059 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A system comprising a circuit board and an integrated circuit device mounted on the circuit board by means of an external contact, and comprising an anti-tamper device being connectable to the external contact to switch the integrated circuit device into a safe mode upon application of a predetermined electrical state at the external contact is described.

Abstract translation: 一种系统，包括电路板和通过外部接触件安装在电路板上的集成电路装置，并且包括可连接到外部触点的防篡改装置，以在应用一个外部触点时将集成电路装置切换到安全模式 描述外部接触处的预定电气状态。

公开(公告)号：US07442046B2

公开(公告)日：2008-10-28

申请号：US11433363

申请日：2006-05-15

Applicant: Olof Simon Simonsson ,  Omid Kazemifar ,  Mikael Pär-Oskar Häll ,  Maiko Anneli Karlsson ,  H{dot over (a)}kan Klas Petersson

Inventor： Olof Simon Simonsson ,  Omid Kazemifar ,  Mikael Pär-Oskar Häll ,  Maiko Anneli Karlsson ,  H{dot over (a)}kan Klas Petersson

IPC: H01R12/00

CPC classification number: H01R12/62 ,  H01R4/04 ,  H05K3/326 ,  H05K3/365 ,  H05K2201/10234 ,  H05K2201/10318 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/10734

Abstract: A system includes a first electrical device including a conductive structure, and a second electrical device including an opening and a conductor provided in the opening. The conductor contacts the conductive structure of the first electrical device to electrically interconnect the first electrical device to the second electrical device.

Abstract translation: 一种系统包括包括导电结构的第一电气装置和包括设置在开口中的开口和导体的第二电气装置。 导体接触第一电气装置的导电结构以使第一电气装置与第二电气装置电互连。