公开(公告)号：US5936843A

公开(公告)日：1999-08-10

申请号：US40393

申请日：1998-03-18

Applicant: Osamu Ohshima ,  Yoshiaki Udagawa ,  Masahiro Suzuki ,  Takeshi Nishiyama

Inventor： Osamu Ohshima ,  Yoshiaki Udagawa ,  Masahiro Suzuki ,  Takeshi Nishiyama

IPC: H01L23/12 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/141 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15322 ,  H05K2201/049 ,  H05K2201/10318 ,  H05K2201/10477 ,  H05K2201/10704 ,  H05K2203/1572 ,  H05K3/3426 ,  H05K3/3436 ,  H05K3/368 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49204 ,  Y10T29/49208 ,  Y10T29/49218

Abstract: A method and apparatus are provided for mounting circuit elements on a printed wiring board, wherein an integrated circuit having terminals with a first interterminal pitch are mounted onto a first surface of a terminal density conversion board which converts the first interterminal pitch of the integrated circuit to terminals with a second interterminal pitch larger than the first interterminal pitch on a second surface of the terminal density conversion board; and the terminals on the second surface of the terminal density conversion board with the second interterminal pitch are mounted onto the printed wiring board.

Abstract translation: 提供了一种用于将电路元件安装在印刷电路板上的方法和装置，其中具有第一间隔间距的端子的集成电路安装在终端密度转换板的第一表面上，该终端密度转换板将集成电路的第一interterminal pitch转换为 在终端密度转换板的第二表面上具有大于第一interterminal间距的第二interterminal间距的端子; 并且具有第二交间距的端子密度转换板的第二表面上的端子安装在印刷线路板上。

公开(公告)号：US5714789A

公开(公告)日：1998-02-03

申请号：US755388

申请日：1996-11-22

Applicant: Scott Estes ,  Deepak Swamy

Inventor： Scott Estes ,  Deepak Swamy

IPC: H01L23/367 ,  H01L23/42 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46 ,  H05K7/20 ,  H01L27/14

CPC classification number: H05K1/0207 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/10416 ,  H05K2201/10477 ,  H05K2201/10704 ,  H05K3/0061 ,  H05K3/429 ,  H05K3/4641

Abstract: In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes. In another embodiment of the assembly, the circuit board through holes are replaced with a circuit board opening through which a heat sink structure passes, the heat sink structure being thermally coupled on one side thereof to the die cavity lid. The other side of the heat sink structure engages a metal chassis section which interiorly engages the outer plastic housing wall of a computer.

Abstract translation: 在电路板/ IC封装组件中，IC封装主体部分中的模腔填充有导热液体，从而基本上有助于将操作模具热量传递到面向电路板的IC封装的内侧盖侧。 为了消散由模腔盖接收的模具热量，在电路板中形成间隔开的一系列金属镀通孔。 通孔的金属电镀部分与电路板内的内部接地平面结构接合，并且热耦合到IC封装模腔盖。 因此，在IC封装的工作过程中，模具热量依次通过模腔液体，空腔盖和金属镀通孔传导到接地平面结构。 在组件的另一实施例中，电路板通孔被替换为散热器结构通过的电路板开口，散热器结构在其一侧热耦合到模腔盖。 散热器结构的另一侧接合金属底盘部分，内部与计算机的外部塑料外壳壁接合。

公开(公告)号：US5643000A

公开(公告)日：1997-07-01

申请号：US691859

申请日：1996-07-31

Applicant: Dave Dent

Inventor： Dave Dent

IPC: H05K1/18 ,  H05K7/10 ,  H05K7/14 ,  H01R9/09

CPC classification number: H05K7/1438 ,  H05K1/18 ,  H05K7/1084 ,  H05K2201/09954 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2201/10704 ,  Y10T29/49144

Abstract: Certain critical dimensions of an original microprocessor package, an upgrade socket, and an upgrade microprocessor package are made complementary to one another, enabling the upgrade socket to be wave soldered onto an area of the motherboard that encircles the area on which the original microprocessor package is surface mounted, and the upgrade microprocessor package remains capable of mating with the upgrade socket. In an alternate embodiment, in addition to having the various critical dimensions of the original microprocessor package, the upgrade socket and the upgrade microprocessor package coordinated with one another, the bottom portion of the upgrade socket is modified to have a smaller center out than the top portion of the upgrade socket, allowing a step to be exposed around the perimeter of the center cut out, and the original microprocessor package to be first solder mounted onto the new step, before the entire original microprocessor package and upgrade socket combination is wave soldered onto the motherboard.

Abstract translation: 原始微处理器封装，升级插座和升级微处理器封装的某些关键尺寸彼此互补，使升级插座能够波形焊接到主板上的环绕原始微处理器封装区域的区域 表面安装，升级微处​​理器包仍然能够与升级插座配合。 在替代实施例中，除了具有原始微处理器封装的各种关键尺寸之外，升级插座和升级微处理器封装彼此协调，升级插座的底部被修改为具有比顶部更小的中心 升级插座的一部分，允许在中心周边暴露出一步，将原始微处理器封装首先焊接到新步骤上，之后将整个原始微处理器封装和升级插座组合波形焊接到 主板。

公开(公告)号：US5625227A

公开(公告)日：1997-04-29

申请号：US374320

申请日：1995-01-18

Applicant: Scott Estes ,  Deepak Swamy

Inventor： Scott Estes ,  Deepak Swamy

IPC: H01L23/367 ,  H01L23/42 ,  H05K1/02 ,  H05K3/42 ,  H05K3/46 ,  H05K7/20 ,  H01L23/34

CPC classification number: H05K1/0207 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15312 ,  H01L2924/1532 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/066 ,  H05K2201/10416 ,  H05K2201/10477 ,  H05K2201/10704 ,  H05K3/0061 ,  H05K3/429 ,  H05K3/4641

Abstract: In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat toward the inner, lid side of the IC package that faces the circuit board. To dissipate the die heat received by the die cavity lid, a spaced series of metal-plated through holes are formed in the circuit board. The metal plating portions of the through holes are engaged with an internal ground plane structure within the circuit board, and are thermally coupled to the IC package die cavity lid. Accordingly, during operation of the IC package, die heat is conducted to the ground plane structure sequentially through the die cavity liquid, the cavity lid, and the metal-plated through holes. In another embodiment of the assembly, the circuit board through holes are replaced with a circuit board opening through which a heat sink structure passes, the heat sink structure being thermally coupled on one side thereof to the die cavity lid. The other side of the heat sink structure engages a metal chassis section which interiorly engages the outer plastic housing wall of a computer.

Abstract translation: 在电路板/ IC封装组件中，IC封装主体部分中的模腔填充有导热液体，从而基本上有助于将操作模具热量传递到面向电路板的IC封装的内侧盖侧。 为了消散由模腔盖接收的模具热量，在电路板中形成间隔开的一系列金属镀通孔。 通孔的金属电镀部分与电路板内的内部接地平面结构接合，并且热耦合到IC封装模腔盖。 因此，在IC封装的工作过程中，模具热量依次通过模腔液体，空腔盖和金属镀通孔传导到接地平面结构。 在组件的另一实施例中，电路板通孔被替换为散热器结构通过的电路板开口，散热器结构在其一侧热耦合到模腔盖。 散热器结构的另一侧接合金属底盘部分，内部与计算机的外部塑料外壳壁接合。

公开(公告)号：US5533665A

公开(公告)日：1996-07-09

申请号：US360403

申请日：1994-12-21

Applicant: William Y. Sinclair ,  James P. Walter

Inventor： William Y. Sinclair ,  James P. Walter

IPC: H01R12/58 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H01R12/58 ,  H05K1/141 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K3/341 ,  H05K3/3447 ,  Y10T29/4914 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.

Abstract translation: 用于连接到印刷电路板的适配销包括细长的导电针，其具有与一端相邻的扩大部分，用于形成与通过电路板部分钻孔的机械过盈配合。 该销在销的扩大部分和相对端之间具有扩大的横截面焊接部分，以限制销进入电路板的孔的程度。 每个引脚的放大部分通过焊接电连接到电路板上的电路路径上。 通过这种布置，可实现销和电路板之间的刚性机械连接，因此用于将表面安装的芯片连接到板的相对侧的板的后续再加热将不会干扰适配器之间的电气和机械连接 引脚和电路板。

公开(公告)号：US5515241A

公开(公告)日：1996-05-07

申请号：US480115

申请日：1995-06-07

Applicant: William E. Werther

Inventor： William E. Werther

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10 ,  H05K1/11

CPC classification number: H05K1/141 ,  H05K3/3415 ,  H05K7/1084 ,  H05K7/1092 ,  H05K1/0262 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2203/1476 ,  H05K2203/1572 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract translation: 公开了用于互连集成电路，特别是预先包装的集成电路的组件和方法。 由引脚载体，一组焊盘（例如用于接收表面安装的集成电路）和耦合焊盘和引脚的一组导电路径组成的多电平电气组件可以将一个或多个集成电路连接到 插座或电路板的其他连接区域。 路径通过多层互连板，其可以被配置为允许将焊盘任意平移到引脚用于不同目的，或者允许附加电路元件（例如协处理器或无源电路）与路径的耦合。 还公开了用于形成组件的本发明的方法以及组件的实施例可用于增加电路板密度的本发明的系统。

公开(公告)号：US5481435A

公开(公告)日：1996-01-02

申请号：US278807

申请日：1994-07-22

Applicant: William E. Werther

Inventor： William E. Werther

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K7/10 ,  H05K1/11

CPC classification number: H05K1/141 ,  H05K3/3415 ,  H05K7/1084 ,  H05K7/1092 ,  H05K1/0262 ,  H05K2201/049 ,  H05K2201/10196 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2203/1476 ,  H05K2203/1572 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: Assemblies and methods for interconnecting integrated circuits, particularly prepackaged ones, are disclosed. A multi-level electrical assembly--composed of a pin carrier, a set of pads, such as for receiving a surface-mounted integrated circuit, and a set of conductive pathways coupling the pads and the pins--can connect one or more integrated circuits to the socket or other attachment area of a circuit board. The pathways pass through a multi-layered interconnect board, which can be configured to permit any translation of pads to pins for different purposes, or to permit the coupling of additional circuit elements, such as a coprocessor or passive circuits, to the pathways. Inventive methods for forming the assemblies, and inventive systems in which the embodiment of the assembly can be used to increase circuit board density, are also disclosed.

Abstract translation: 公开了用于互连集成电路，特别是预先包装的集成电路的组件和方法。 由引脚载体，一组焊盘（例如用于接收表面安装的集成电路）和耦合焊盘和引脚的一组导电路径组成的多电平电气组件可以将一个或多个集成电路连接到 插座或电路板的其他连接区域。 路径通过多层互连板，其可以被配置为允许将焊盘任意平移到引脚用于不同目的，或者允许附加电路元件（例如协处理器或无源电路）与路径的耦合。 还公开了用于形成组件的本发明的方法以及组件的实施例可用于增加电路板密度的本发明的系统。

公开(公告)号：US5410452A

公开(公告)日：1995-04-25

申请号：US199764

申请日：1994-02-18

Applicant: William Y. Sinclair ,  James P. Walter

Inventor： William Y. Sinclair ,  James P. Walter

IPC: H01R12/58 ,  H05K1/14 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H01R12/58 ,  H05K1/141 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/10704 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K3/341 ,  H05K3/3447 ,  Y10T29/4914 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: An adaptor pin for connection to a printed circuit board includes an elongated electrically conductive pin having an enlarged portion adjacent one end for forming a mechanical interference fit with a hole partially drilled through the circuit board. The pin has an enlarged cross-sectional solder portion intermediate the enlarged portion and the opposite end of the pin so as to limit the extent of penetration of the pin into the hole of the circuit board. The enlarged portion of each pin is electrically connected by soldering to a circuit path on the circuit board. By this arrangement, a rigid mechanical connection between the pin and the circuit board is effected, and thus subsequent reheating of the board for connecting a surface mounted chip to the opposite side of the board will not interfere with the electrical and mechanical connection between the adaptor pin and the circuit board.

Abstract translation: 用于连接到印刷电路板的适配销包括细长的导电针，其具有与一端相邻的扩大部分，用于形成与通过电路板部分钻孔的机械过盈配合。 该销在销的扩大部分和相对端之间具有扩大的横截面焊接部分，以限制销进入电路板的孔的程度。 每个引脚的放大部分通过焊接电连接到电路板上的电路路径上。 通过这种布置，可实现销和电路板之间的刚性机械连接，因此用于将表面安装的芯片连接到板的相对侧的板的后续再加热将不会干扰适配器之间的电气和机械连接 引脚和电路板。

公开(公告)号：US5351393A

公开(公告)日：1994-10-04

申请号：US913880

申请日：1992-07-15

Applicant: George D. Gregoire

Inventor： George D. Gregoire

IPC: H01L23/495 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36

CPC classification number: H05K3/3426 ,  H01L23/49555 ,  H05K1/141 ,  H01L2924/0002 ,  H05K2201/049 ,  H05K2201/09472 ,  H05K2201/10303 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10772 ,  H05K2201/10818 ,  H05K3/368 ,  Y02P70/613 ,  Y10T29/49135 ,  Y10T29/4914

Abstract: A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed circuit board. The converter board assembly includes an array of spaced apart pins, arranged in rows and columns for mounting, and a plurality of spaced apart pin pads connected thereto. The pin pads are sufficiently spaced apart to avoid interference. A set of surface-mount lead pads is part of the converter board and is interconnected to the array of pins by a plurality of lead traces. The method of making the converter board with a surface-mount integrated circuit device includes forming or reforming the leads of the device to align with the surface-mount pads.

Abstract translation: 具有布置的引脚格栅阵列的表面贴装集成电路转换器板组件能够安装常规的表面安装引线装置以便随后附接到印刷电路板。 转换器板组件包括排列成行和列的用于安装的间隔开的销的阵列，以及与之连接的多个间隔开的销垫。 引脚垫足够间隔开以避免干扰。 一组表面安装引线焊盘是转换器板的一部分，并通过多个引线与引脚阵列互连。 制造具有表面贴装集成电路器件的转换器板的方法包括将器件的引线形成或重整以与表面安装焊盘对准。

公开(公告)号：US4734818A

公开(公告)日：1988-03-29

申请号：US28172

申请日：1987-03-19

Applicant: Jorge M. Hernandez ,  Aleta Gilderdale

Inventor： Jorge M. Hernandez ,  Aleta Gilderdale

IPC: H01G2/12 ,  H01G4/228 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H01G1/14 ,  H01G4/10 ,  H05K7/10

CPC classification number: H01G4/228 ,  H01G2/12 ,  H05K1/0231 ,  H05K1/18 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K3/3447

Abstract: High frequency noise is decoupled from power supplied to Pin Grid Array (PGA), surface mounted leaded chip carrier and surface mounted leadless chip carrier packages by insertion of a decoupling capacitor between the PGA or leaded chip carrier package and printed circuit board; or by mounting the decoupling capacitor over a leadless chip carrier package. The decoupling capacitor comprises a multi layer capacitive element sandwiched between a pair of conductors and having a plurality of leads extending from each conductor. In accordance with the present invention, the decoupling capacitor is individually dimensioned and configured to fit under a PGA or leaded chip carrier package, or over a leadless chip carrier package; and correspond to the power and ground pin or lead configuration of that PGA, surface mounted leaded chip carrier and surface mounted leadless chip carrier package.

Abstract translation: 通过在PGA或引线芯片载体封装和印刷电路板之间插入去耦电容器，高频噪声与提供给针脚阵列（PGA）的电源，表面贴装引线芯片载体和表面安装的无引线芯片载体封装分离; 或者通过将去耦电容器安装在无引线芯片载体封装上。 去耦电容器包括夹在一对导体之间并具有从每个导体延伸的多个引线的多层电容元件。 根据本发明，去耦电容器被独立地尺寸设计和配置成配合在PGA或引线芯片载体封装下或者在无引线芯片载体封装上; 并对应于该PGA，表面贴装引线芯片载体和表面安装的无引线芯片载体封装的电源和接地引脚或引线配置。