公开(公告)号：US10770267B1

公开(公告)日：2020-09-08

申请号：US16526143

申请日：2019-07-30

Applicant: APPLIED MATERIALS, INC.

Inventor： Smbat Kartashyan ,  David Totedo ,  Kartik Ramaswamy ,  Jay Merkel ,  Omid Amirkiai

IPC: H05B33/00 ,  H01J37/32 ,  H03H7/01 ,  H03H7/38

Abstract: Methods and apparatus for matching an impedance of a process chamber with an impedance of an RF power source. In some embodiments, a method comprises dynamically matching a load impedance of the process chamber with an impedance matching circuit coupled between an RF power source and the process chamber, the impedance matching circuit configured to compensate for changes in the load impedance to match an impedance of the RF power source over a wide range of load impedances; filtering power feeding back from the process chamber with a first filter positioned between the matching circuit and the process chamber, the first filter configured as a wide bandpass filter; and filtering residual signals with a second filter positioned between the matching circuit and the RF power source, the second filter configured as a low pass filter.

公开(公告)号：US10373807B2

公开(公告)日：2019-08-06

申请号：US16107844

申请日：2018-08-21

Applicant: Applied Materials, Inc.

Inventor： Kenneth S. Collins ,  Michael R. Rice ,  Kartik Ramaswamy ,  James D. Carducci ,  Yue Guo ,  Olga Regelman

IPC: H01J37/32

Abstract: Embodiments of the disclosure provide a plasma source assembly and process chamber design that can be used for any number of substrate processing techniques. The plasma source may include a plurality of discrete electrodes that are integrated with a reference electrode and a gas feed structure to generate a uniform, stable and repeatable plasma during processing. The plurality of discrete electrodes include an array of electrodes that can be biased separately, in groups or all in unison, relative to a reference electrode. The plurality of discrete electrodes may include a plurality of conductive rods that are positioned to generate a plasma within a processing region of a process chamber. The plurality of discrete electrodes is provided RF power from standing or traveling waves imposed on a power distribution element to which the electrodes are connected.

公开(公告)号：US20180308666A1

公开(公告)日：2018-10-25

申请号：US15630833

申请日：2017-06-22

Applicant: Applied Materials, Inc.

Inventor： Kenneth S. Collins ,  Michael R. Rice ,  Kartik Ramaswamy ,  James D. Carducci

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/687 ,  H01L21/683 ,  C23C16/455

CPC classification number: H01J37/32568 ,  C23C16/45536 ,  C23C16/45544 ,  C23C16/507 ,  C23C16/545 ,  H01J37/321 ,  H01J37/32449 ,  H01J37/32715 ,  H01J37/3277 ,  H01J37/32816 ,  H01J2237/3321 ,  H01J2237/334 ,  H01L21/67069 ,  H01L21/6831 ,  H01L21/68785

Abstract: A plasma reactor includes a chamber body having an interior space that provides a plasma chamber and having a ceiling, a gas distributor to deliver a processing gas to the plasma chamber, a pump coupled to the plasma chamber to evacuate the chamber, a workpiece support to hold a workpiece, and an intra-chamber electrode assembly. The intra-chamber electrode assembly includes an insulating frame, a first plurality of coplanar filaments that extend laterally through the plasma chamber between the ceiling and the workpiece support along a first direction, and a second plurality of coplanar filaments that extend in parallel through the plasma chamber along a second direction perpendicular to the first direction. Each filament of the first and second plurality of filaments includes a conductor at least partially surrounded by an insulating shell. A first RF power source supplies a first RF power to the conductor of the intra-chamber electrode assembly.

公开(公告)号：US20180221949A1

公开(公告)日：2018-08-09

申请号：US15941988

申请日：2018-03-30

Applicant: Applied Materials, Inc.

Inventor： Christopher A. Rowland ,  Anantha K. Subramani ,  Kasiraman Krishnan ,  Kartik Ramaswamy ,  Thomas B. Brezoczky ,  Swaminathan Srinivasan ,  Jennifer Y. Sun ,  Simon Yavelberg ,  Srinivas D. Nemani ,  Nag B. Patibandla ,  Hou T. Ng

IPC: B22F3/00 ,  B28B1/00 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  B23K10/00 ,  H05B3/00

CPC classification number: B22F3/008 ,  B22F2003/1051 ,  B22F2003/1057 ,  B22F2998/10 ,  B23K10/006 ,  B23K10/027 ,  B28B1/001 ,  B29C64/153 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y50/02 ,  H05B3/0061

Abstract: An additive manufacturing system includes a platen, a dispenser configured to deliver a powder in a linear region that extends across less than all of a width of the platen, a drive system configured to move the dispenser along the first axis and a perpendicular second axis, a controller, and an energy source configured to selectively fuse a layer of powder. The controller is configured to cause the drive system to move the dispenser along the second axis a first time such that the linear region makes a first sweep along the second axis to deposit the powder in a first swath over the platen, thereafter along the first axis, and thereafter along the second axis a second time such that the first linear region makes a second sweep along the second axis to deposit the powder in a parallel second swath over the platen.

公开(公告)号：US20180211811A1

公开(公告)日：2018-07-26

申请号：US15934880

申请日：2018-03-23

Applicant: Applied Materials, Inc.

Inventor： Jason A. Kenney ,  James D. Carducci ,  Kenneth S. Collins ,  Richard Fovell ,  Kartik Ramaswamy ,  Shahid Rauf

IPC: H01J37/04 ,  H05H1/46 ,  H01J37/32

CPC classification number: H01J37/04 ,  H01J37/321 ,  H01J37/3211 ,  H05H1/46 ,  H05H2001/4667

Abstract: A plasma reactor includes inner, middle and outer current distributors to carry RF power to be supplied to a plasma in the processing region, and a plurality of RF power feeds connected between a plurality of RF power terminals and the inner, middle and outer current distributors. The current distributors are successive concentric axially symmetric hollow bodies. The plurality of current feeds include a middle RF power feed that includes an axial upper portion connected to one of the plurality of RF power terminals, a plurality of arms extending radially outwardly from the axial upper portion, and a plurality of axially extending RF connection rods extending from outer ends of the plurality of arms to the middle current distributor.

公开(公告)号：US09960776B2

公开(公告)日：2018-05-01

申请号：US14202472

申请日：2014-03-10

Applicant: APPLIED MATERIALS, INC.

Inventor： Kenneth S. Collins ,  Satoru Kobayashi ,  Kartik Ramaswamy

IPC: H03L7/085 ,  H03L7/107

CPC classification number: H03L7/1075

Abstract: Methods and apparatus for generating a variable clock used to control a component of a substrate processing system are provided herein. In some embodiments, an apparatus for controlling a substrate processing system includes: a phase locked loop circuit for generating a relative clock that is phase locked to a variable frequency signal being used by a substrate processing chamber; and a controller, coupled to the phase locked loop circuit, for producing a control signal for a component of the substrate processing system, wherein the control signal is based upon the relative clock and an operating indicia of the substrate processing system.

公开(公告)号：US09870897B2

公开(公告)日：2018-01-16

申请号：US14319089

申请日：2014-06-30

Applicant: APPLIED MATERIALS, INC.

Inventor： James D. Carducci ,  Kenneth S. Collins ,  Richard Fovell ,  Jason A. Kenney ,  Kartik Ramaswamy ,  Shahid Rauf

IPC: C23C16/00 ,  H01L21/306 ,  H01J37/32 ,  H05H1/46 ,  C23C16/505

CPC classification number: H01J37/3211 ,  C23C16/505 ,  H01J37/32119 ,  H01J37/32183 ,  H05H1/46 ,  H05H2001/4667

Abstract: A plasma reactor has an overhead inductively coupled plasma source with two coil antennas and symmetric and radial RF feeds and cylindrical RF shielding around the symmetric and radial RF feeds. The radial RF feeds are symmetrically fed to the plasma source.

公开(公告)号：US09799491B2

公开(公告)日：2017-10-24

申请号：US15146133

申请日：2016-05-04

Applicant: APPLIED MATERIALS, INC.

Inventor： Leonid Dorf ,  Kenneth S. Collins ,  Shahid Rauf ,  Kartik Ramaswamy ,  James D. Carducci ,  Hamid Tavassoli ,  Olga Regelman ,  Ying Zhang

IPC: H01J37/32 ,  H01J37/06 ,  H01L21/3065

CPC classification number: H01J37/32174 ,  H01J37/06 ,  H01J37/32082 ,  H01J37/3233 ,  H01J37/32357 ,  H01J37/32422 ,  H01J37/3244 ,  H01J37/32458 ,  H01J37/32532 ,  H01J2237/3151 ,  H01J2237/3174 ,  H01J2237/334 ,  H01J2237/3348 ,  H01L21/3065 ,  H01L21/31116

Abstract: The disclosure concerns a method of operating a plasma reactor having an electron beam plasma source for independently adjusting electron beam energy, plasma ion energy and radical population. The disclosure further concerns an electron beam source for a plasma reactor having an RF-driven electrode for producing the electron beam.

公开(公告)号：US09745663B2

公开(公告)日：2017-08-29

申请号：US13666224

申请日：2012-11-01

Applicant: APPLIED MATERIALS, INC.

Inventor： Andrew Nguyen ,  Kenneth S. Collins ,  Kartik Ramaswamy ,  Shahid Rauf ,  James D. Carducci ,  Douglas A. Buchberger, Jr. ,  Ankur Agarwal ,  Jason A. Kenney ,  Leonid Dorf ,  Ajit Balakrishna ,  Richard Fovell

IPC: H01L21/00 ,  C23C16/00 ,  C23F1/08 ,  C23C14/28 ,  H05H1/46 ,  B01J12/00 ,  H01J37/32

CPC classification number: C23F1/08 ,  B01J12/002 ,  C23C14/28 ,  H01J37/321 ,  H01J37/3211 ,  H01J37/32733 ,  H01J37/32834 ,  H05H1/46

Abstract: A plasma reactor has an overhead multiple coil inductive plasma source with symmetric RF feeds and a symmetrical chamber exhaust with plural struts through the exhaust region providing access to a confined workpiece support. A grid may be included for masking spatial effects of the struts from the processing region.

公开(公告)号：US20170182556A1

公开(公告)日：2017-06-29

申请号：US15327281

申请日：2015-07-16

Applicant: Applied Materials, Inc.

Inventor： Kartik Ramaswamy ,  Anantha K. Subramani ,  Kasiraman Krishnan ,  Jennifer Y. Sun ,  Thomas B. Brezoczky ,  Christopher A. Rowland ,  Srinivas D. Nemani ,  Swaminathan Srinivasan ,  Simon Yavelberg ,  Ellie Y. Yieh ,  Hou T. Ng

IPC: B22F3/105 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  B28B17/00 ,  B23K26/70 ,  B23K26/14 ,  B29C67/00 ,  B28B1/00 ,  B33Y10/00 ,  B23K26/342

CPC classification number: B22F3/1055 ,  B22F1/0088 ,  B22F2003/1056 ,  B22F2003/1057 ,  B23K26/1464 ,  B23K26/342 ,  B23K26/702 ,  B28B1/001 ,  B28B17/0081 ,  B29C64/153 ,  B29C64/20 ,  B29C64/386 ,  B33Y10/00 ,  B33Y30/00 ,  B33Y40/00 ,  B33Y50/02 ,  Y02P10/295

Abstract: An additive manufacturing system includes a platen, a feed material dispenser apparatus configured to deliver a feed material onto the platen, a laser source configured to produce a laser beam during use of the additive manufacturing system, a controller configured to direct the laser beam to locations on the platen specified by a computer aided design program to cause the feed material to fuse, a gas source configured to supply gas, and a nozzle configured to accelerate and direct the gas to substantially the same location on the platen as the laser beam.