MULTI-LEVEL MICROMECHANICAL STRUCTURE
    67.
    发明申请
    MULTI-LEVEL MICROMECHANICAL STRUCTURE 有权
    多层微观结构

    公开(公告)号:US20160332864A1

    公开(公告)日:2016-11-17

    申请号:US15147197

    申请日:2016-05-05

    Abstract: The present invention relates to a micromechanical device comprising a multi-layer micromechanical structure including only homogenous silicon material. The device layer comprises at least a rotor and at least two stators. At least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a first surface of the device layer and at least some of the rotor and at least two stators are at least partially recessed to at least two different depths of recession from a second surface of the device layer.

    Abstract translation: 微机械装置技术领域本发明涉及包括仅包含均质硅材料的多层微机械结构的微机械装置。 装置层至少包括一个转子和至少两个定子。 转子和至少两个定子中的至少一些至少部分地凹陷到来自装置层的第一表面的至少两个不同的凹陷深度,并且至少一些转子和至少两个定子至少部分地凹入 与器件层的第二表面的至少两个不同的凹陷深度。

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