公开(公告)号：US20020011659A1

公开(公告)日：2002-01-31

申请号：US09798758

申请日：2001-03-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Mitsuyoshi Nishide ,  Jun Urakawa ,  Yukinobu Sato

IPC: H01L023/14 ,  H01L023/48 ,  H01L023/52 ,  H01L029/40

CPC classification number: C04B35/195 ,  H01L2224/16225 ,  H05K1/0306 ,  H05K3/3452 ,  H05K3/4629 ,  H05K2201/017

Abstract: An insulating thick film composition for forming a solder resist layer having a high degree of positional accuracy is provided, which can suppress warping and undulation of a multilayer ceramic substrate and can maintain the superior electrical characteristics thereof. The insulating thick film composition is primarily composed of a powdered ceramic having the same composition system as that of a powdered ceramic contained in a green ceramic sheet, and the mean particle diameter of the powdered ceramic of the insulating thick film composition is smaller than that of the powdered ceramic contained in the green ceramic body.

公开(公告)号：US5379186A

公开(公告)日：1995-01-03

申请号：US85807

申请日：1993-07-06

Applicant: Glenn E. Gold ,  Anthony B. Suppelsa ,  Anthony J. Suppelsa

Inventor： Glenn E. Gold ,  Anthony B. Suppelsa ,  Anthony J. Suppelsa

IPC: H01L23/31 ,  H01L23/42 ,  H05K1/02 ,  H05K3/28 ,  H05K7/20

CPC classification number: H05K3/284 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/42 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K2201/017 ,  H05K2201/0209 ,  H05K2201/09872 ,  H05K2203/1322

Abstract: An encapsulated electronic component having an integral heat diffuser. The heat producing electronic component (10) is mounted on a substrate carrier (12) and a layer of encapsulant material (16) covers the component. A layer of thermally conductive material (18) is applied over the encapsulant material, and then a second layer of encapsulant material (20) is applied over the thermally conductive material. The heat generated by the component is distributed throughout the thermally conductive material, thereby eliminating the hot spot over the component, resulting in a substantially lower surface temperature.

Abstract translation: 一种具有整体散热器的封装的电子部件。 发热电子部件（10）安装在基板载体（12）上，并且密封材料层（16）覆盖该部件。 将一层导热材料（18）施加在密封剂材料上，然后将第二层密封剂材料（20）施加在导热材料上。 由部件产生的热量分布在整个导热材料上，从而消除了部件上的热点，从而导致基本上较低的表面温度。

公开(公告)号：US5274352A

公开(公告)日：1993-12-28

申请号：US901873

申请日：1992-06-22

Applicant: Toshiaki Nishikawa ,  Yoshiharu Yamashita

Inventor： Toshiaki Nishikawa ,  Yoshiharu Yamashita

IPC: H01C1/14 ,  H01C1/034 ,  H01C7/00 ,  H01L27/01 ,  H05K1/09 ,  H05K1/16 ,  H05K3/28 ,  H01C1/012

CPC classification number: H01C1/034 ,  H05K3/28 ,  H05K1/092 ,  H05K1/167 ,  H05K2201/017

Abstract: A thick film resistive element superior in moisture resistance characteristic is provided, which includes a pair of film-like conductors formed on an insulating substrate, a film-like resistor formed on the substrate so as to be partially laminated on the electrode portions of the pair of conductors thereby covering the surfaces of the electrode portions, and a first covering member formed of a material containing a crystal glass as a main ingredient thereof which covers the other portions of the pair of conductors than said electrode portions. As a result, there does not exist such an area that is covered with a porous amorphous glass film only, so that even if a protection film of an organic resin is not provided, there is no possibility that the moisture in the application environment affects on the conductors to degrade the insulation resistance therebetween. Thus, the use of this thick film resistive element makes it possible to realize a thick film printed circuit board and thick film hybrid integrated circuit device with no need to coat a protection film of an organic resin.

Abstract translation: 提供了具有优异的耐湿性特性的厚膜电阻元件，其包括形成在绝缘基板上的一对膜状导体，形成在基板上的膜状电阻器，以便部分地层压在该对的电极部分上 的导体，由此覆盖电极部分的表面，以及由包含晶体玻璃作为其主要成分的材料形成的第一覆盖部件，该第一覆盖部件覆盖一对导体的除了所述电极部分之外的其它部分。 结果，不存在仅被多孔非晶玻璃膜覆盖的区域，所以即使没有提供有机树脂的保护膜，也不可能施加环境中的水分影响 导体之间的绝缘电阻降低。 因此，使用这种厚膜电阻元件使得可以实现厚膜印刷电路板和厚膜混合集成电路器件，而不需要涂覆有机树脂的保护膜。

公开(公告)号：USRE33859E

公开(公告)日：1992-03-24

申请号：US608506

申请日：1990-11-02

Applicant: I. Macit Gurol

Inventor： I. Macit Gurol

IPC: H01C17/242 ,  H01L21/70 ,  H01L23/29 ,  H01L23/31 ,  H05K1/03 ,  H05K1/16 ,  H05K3/28

CPC classification number: H05K3/28 ,  H01C17/242 ,  H01L21/702 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3142 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/167 ,  H05K2201/017 ,  Y10T428/239 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: A ceramic substrate supports a thin or thick film electronic circuit hermetically enclosed by a vitreous glass covering sealed to the ceramic substrate by a heat fused vitreous sealing glass. The vitreous sealing glass is screened onto the vitreous glass covering in a composition comprising a binder material and a liquifier. The electronic circuit is trimmed by a laser beam directed through the vitreous glass covering as one of the final process steps after completion of those process steps which tend to affect the resistivity of the resistive element; process steps such as high temperature baking and soldering of component parts.

公开(公告)号：US5047368A

公开(公告)日：1991-09-10

申请号：US333161

申请日：1989-04-03

Applicant: Wolfgang E. Schnitker ,  Michael P. J. Nover ,  Kay Appel

Inventor： Wolfgang E. Schnitker ,  Michael P. J. Nover ,  Kay Appel

IPC: H05K3/46 ,  H01L25/16 ,  H01L27/01 ,  H05K1/09 ,  H05K1/16 ,  H05K3/28

CPC classification number: H01L25/16 ,  H01L27/013 ,  H05K3/28 ,  H01L27/02 ,  H01L2924/0002 ,  H05K1/0275 ,  H05K1/092 ,  H05K1/16 ,  H05K2201/017 ,  H05K2201/0195 ,  H05K2201/09881 ,  H05K2203/0577 ,  Y10S428/901

Abstract: The invention relates to a method of forming a thick-film circuit arrangement having an electronic circuit which is constructed on a surface (17) of a ceramic substrate plate (3) and which consists of conductor paths (5), resistors, capacitors and components, in particular integrated switching circuits without a housing, formed according to thick-film technique, in this structure has between the electrically conductive structures (5) a sintered, non-conductive paste substantially filling the intermediate spaces between them and both the structures and the interposed pastes are covered by a sintered insulating paste. For concealing the thick-film circuit arrangement from unauthorized access, the following covering construction is carried out:1. the paste in the intermediate spaces fills the same between the electronically active thick-film conductor structures in such a manner that the tops of the electrically active structures and the insulating filling layer (7) formed from an insulating paste and filling the intermediate spaces between them are situated substantially in one plane, andthe insulating paste is provided over the combined conductor/filling layer (11) in a covering and smoothing manner to form at least one insulating first thick-film anti-access layer (13) which, by additional observation-impeding inclusions (dye, particles), impedes an optical recognition of the underlying structures, especially when the first thick-film anti-access layer or layers is or are not succeeded by further anit-access layers.

公开(公告)号：US4694573A

公开(公告)日：1987-09-22

申请号：US832716

申请日：1986-02-10

Applicant: Atsushi Nishino ,  Masaki Ikeda ,  Yoshihiro Watanabe ,  Masahiro Hiraka

Inventor： Atsushi Nishino ,  Masaki Ikeda ,  Yoshihiro Watanabe ,  Masahiro Hiraka

IPC: H05B3/20 ,  H05K1/03 ,  H05K1/05 ,  H05K3/20 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/20 ,  H05K1/0306 ,  H05K1/053 ,  H05K2201/017 ,  H05K2203/0531 ,  H05K3/28 ,  Y10T29/49155

Abstract: Disclosed is a method of forming an electrically conductive circuit comprising the steps of: preparing a transferring paper in which an assembly of electrically conductive foil carrying a predetermined pattern and an insulating layer containing glass frit and an overcoat layer consisting of a resin film having good burning property are provided on a transferring paper covered with a paste layer; removing an integral structure of the conductive foil, the insulating layer, and the overcoat layer from the transferring paper; transferring the removed integral structure onto a substrate; and burning the substrate with the integral structure set thereon at a temperature where the glass is soften. According to this method, it is possible to eliminate transformation or damage of a conductive foil where a conductive foil is singly disposed on a substrate.

Abstract translation: PCT No.PCT / JP85 / 00327 Sec。 371日期1986年2月10日 102（e）日期1986年2月10日PCT提交1985年6月12日PCT公布。 出版物WO86 / 00190 1986年1月3日公开。公开是一种形成导电电路的方法，包括以下步骤：制备转印纸，其中承载预定图案的导电箔的组件和包含玻璃料的绝缘层和覆盖层组成 具有良好燃烧性能的树脂膜设置在被糊层覆盖的转印纸上; 从转印纸上去除导电箔，绝缘层和外涂层的整体结构; 将去除的整体结构转移到基底上; 并且在玻璃被软化的温度下，以设置在其上的整体结构燃烧基板。 根据该方法，可以消除将导电箔单独设置在基板上的导电箔的变形或损坏。

公开(公告)号：US4401709A

公开(公告)日：1983-08-30

申请号：US396661

申请日：1982-07-09

Applicant: Ashok N. Prabhu ,  Kenneth W. Hang

Inventor： Ashok N. Prabhu ,  Kenneth W. Hang

IPC: C03C1/10 ,  C03C3/074 ,  C03C8/10 ,  C03C8/16 ,  C03C8/24 ,  H01B3/00 ,  H01B3/08 ,  H01L27/01 ,  H05K3/28 ,  H05K3/46 ,  H05K1/03 ,  H05K1/16 ,  H05K3/12

CPC classification number: C03C8/245 ,  H01L27/013 ,  H05K3/285 ,  H05K2201/017 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926

Abstract: Improved thick-film overglaze inks useful in constructing multilayer integrated circuits on circuit boards, particularly porcelain-coated metal circuit boards, are provided. The subject inks comprise: a glass consisting of lead oxide, a modifier component consisting of the oxides of cadmium, zinc, barium and antimony and a glass-forming component consisting of aluminum oxide, boron trioxide and silicon dioxide; a suitable organic vehicle and, if desired, a colorant oxide.

公开(公告)号：US4017889A

公开(公告)日：1977-04-12

申请号：US535261

申请日：1974-12-23

Applicant: Lewis F. Miller

Inventor： Lewis F. Miller

IPC: H01L21/3205 ,  H01L21/60 ,  H01L23/12 ,  H01L23/498 ,  H01L23/52 ,  H01L23/528 ,  H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/24 ,  H05K3/34 ,  H01L23/48 ,  H01L29/44 ,  H01L29/46

CPC classification number: H05K3/248 ,  H01L23/49816 ,  H01L23/528 ,  H01L24/81 ,  H05K3/3452 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01043 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/017 ,  H05K2201/2081

Abstract: A ternary barrier structure and method for forming the structure to be used on a conductive electrode. In electronic structures, dielectric substrates are used which have a plurality of connecting conductive areas which are wettable by solder. The region surrounding these connecting conductive areas are not wettable by solder. Barrier structures are used to prevent the flow of the solder while the solder is liquid during the manufacture of these electronic products. The present barrier structure covers at least a portion of one of these connecting conductive electrodes wherein the electrode is composed predominantly of silver and a lesser quantity of one or more of the platinum metals. The barrier structure includes a gold bearing, non-wettable by solder, glaseous layer over a portion of the electrode. The portion of the conductive electrode under and adjacent to the barrier glasseous layer contains a gold-silver alloy which is produced during the formation of the barrier structure by diffusion of the gold from the glasseous layer into the conductive electrode. A particularly corrosion resistant barrier structure and conductive electrode combination is thereby produced at this rather critical point in the microminiature circuit structure.

Abstract translation: 用于形成用于导电电极的结构的三元阻挡结构和方法。 在电子结构中，使用具有可被焊料润湿的多个连接导电区域的电介质基板。 围绕这些连接导电区域的区域不能被焊料润湿。 在制造这些电子产品期间，阻焊结构用于防止焊料流动，同时焊料是液态的。 本阻挡结构覆盖这些连接导电电极之一的至少一部分，其中电极主要由银组成，少量的一种或多种铂金属。 阻挡结构包括金轴承，不能通过焊料润湿，在电极的一部分上具有气态层。 导电电极在阻挡层层下面及其附近的部分含有金 - 银合金，该金 - 银合金是在形成阻挡结构期间通过将金从玻璃化层扩散到导电电极中产生的。 因此，在微型电路结构的这个相当关键的点处产生特别耐腐蚀的阻挡结构和导电电极组合。

公开(公告)号：US3887760A

公开(公告)日：1975-06-03

申请号：US43911674

申请日：1974-02-04

Applicant: SIEMENS AG

Inventor： KRIEGER FRIEDRICH ,  STEIN CHRISTIAN

IPC: H01L21/60 ,  H01L23/538 ,  H05K1/03 ,  H05K1/11 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3468 ,  H01L23/538 ,  H01L24/81 ,  H01L2224/81801 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/014 ,  H05K1/0306 ,  H05K1/111 ,  H05K3/3452 ,  H05K2201/017 ,  H05K2201/09727 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10674 ,  H05K2201/10719 ,  H05K2203/044 ,  Y02P70/611

Abstract: A layer circuit arranged to receive semiconductor modules by soldering, the circuit having at least one conductor path extending therealong with a solder platform at one end of the conductor path. A layer is positioned transversely across the conductor path beyond the solder platform but extends across the conductor path less than the width of the path. This layer is incapable of tinning so that it separates the solder platform at the end of the conductor path from the remainder of the path by a relatively narrow constriction.

Abstract translation: 布置成通过焊接来接收半导体模块的层电路，所述电路具有至少一个导体路径，在导体路径的一端具有与焊料平台一起延伸的导体路径。 一个层横向穿过导体路径定位超过焊接平台，但延伸穿过导体路径小于路径的宽度。 该层不能镀锡，使得其在导体路径末端的焊料平台与路径的其余部分相隔较窄的收缩部分。

公开(公告)号：US20190223298A1

公开(公告)日：2019-07-18

申请号：US16365089

申请日：2019-03-26

Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Jonathan Silvano De Sousa ,  Markus Leitgeb

IPC: H05K3/46 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K3/4655 ,  H05K1/0207 ,  H05K1/181 ,  H05K1/185 ,  H05K1/186 ,  H05K3/4688 ,  H05K2201/012 ,  H05K2201/017 ,  H05K2201/0175 ,  H05K2201/0179

Abstract: A method of manufacturing a constituent for a component carrier is disclosed. The method includes providing an electrically conductive structure, forming a highly thermally conductive and electrically insulating or semiconductive structure on the electrically conductive structure, and subsequently, attaching a thermally conductive and electrically insulating structure, having a lower thermal conductivity than the highly thermally conductive and electrically insulating or semiconductive structure, on an exposed surface of the highly thermally conductive and electrically insulating or semiconductive structure.