公开(公告)号：US20060255476A1

公开(公告)日：2006-11-16

申请号：US11129984

申请日：2005-05-16

Applicant: Frederick Kuhlman ,  Richard Parker ,  Shing Yeh ,  Bradley Carter ,  Steven Middleton ,  Rodney Sprinkles

Inventor： Frederick Kuhlman ,  Richard Parker ,  Shing Yeh ,  Bradley Carter ,  Steven Middleton ,  Rodney Sprinkles

IPC: H01L23/48

CPC classification number: H05K3/3484 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/81138 ,  H01L2924/01322 ,  H01L2924/14 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/0215 ,  H05K2201/0266 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: An electronic assembly includes a bare IC die or a leadless electronic component having at least one electrically conductive contact formed on a surface of the component and a leadframe or a substrate having at least one electrically conductive trace. The conductive contact of the component is electrically and mechanically coupled to the conductive trace with a solder joint. The solder joint includes a plurality of solid electrically conductive metal particles having a substantially spherical shape and a diameter ranging from about one mil to about ten mils.

Abstract translation: 电子组件包括裸IC芯片或无引线电子元件，其具有形成在元件的表面上的至少一个导电触点和具有至少一个导电迹线的引线框架或基板。 组件的导电接触件通过焊接接头与导电迹线电连接和机械耦合。 焊接点包括多个固体导电金属颗粒，其具有基本上球形的形状，直径范围为约1密耳至约10密耳。

公开(公告)号：US20060091188A1

公开(公告)日：2006-05-04

申请号：US10976980

申请日：2004-10-29

Applicant: Cheng Tay ,  Pek Tan ,  Swee Cheng ,  Eng Yap

Inventor： Cheng Tay ,  Pek Tan ,  Swee Cheng ,  Eng Yap

IPC: B23K31/02

CPC classification number: B23K1/0016 ,  B23K2101/42 ,  H01L21/4853 ,  H01L21/486 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2201/035 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2203/043 ,  H05K2203/1476

Abstract: In one embodiment, a method is provided. The method comprises filling a microvia formed in a bond pad with solder paste comprising solder balls of the first size; and coating the bond pad with solder paste comprising solder balls of the second size, wherein the second size is greater than the first size.

Abstract translation: 在一个实施例中，提供了一种方法。 该方法包括用形成第一尺寸的焊球的焊膏填充在焊盘中形成的微孔; 以及用包括第二尺寸的焊球的焊膏涂覆所述接合焊盘，其中所述第二尺寸大于所述第一尺寸。

公开(公告)号：US20030164204A1

公开(公告)日：2003-09-04

申请号：US10248802

申请日：2003-02-20

Inventor： Ho-Ming Tong ,  Chun-Chi Lee ,  Jen-Kuang Fang ,  Ching-Fu Horng ,  Shih-Kuang Chen ,  Shyh-Ing Wu ,  Chun-Hung Lin ,  Yung-Chi Lee ,  Yu-Chen Chou ,  Tsung-Hua Wu ,  Su Tao

IPC: B23K035/34

CPC classification number: H01L24/10 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H05K3/3484 ,  H05K2201/0266 ,  H05K2203/043 ,  H01L2924/00

Abstract: A solder paste for fabricating bumps includes a flux and metallic alloy powder. The metallic alloy powder includes a plurality of low eutectic metallic alloy granules, and the size of these metallic alloy granules is 20-60 nullm and the average size of the metallic granules is 35 nullm to 45 nullm.

Abstract translation: 用于制造凸块的焊膏包括焊剂和金属合金粉末。 金属合金粉末包含多个低共晶金属合金颗粒，这些金属合金颗粒的尺寸为20-60μm，金属颗粒的平均尺寸为35μm〜45μm。

公开(公告)号：US06518163B2

公开(公告)日：2003-02-11

申请号：US09746336

申请日：2000-12-26

Applicant: Seiki Sakuyama ,  Yasuo Yamagishi ,  Masataka Mizukoshi

Inventor： Seiki Sakuyama ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC: H01L2144

CPC classification number: H05K3/3484 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49883 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/141 ,  H01L2224/16145 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1532 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0266 ,  H05K2201/10477 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/043 ,  H05K2203/0568 ,  H05K2203/0574 ,  H05K2203/0577 ,  H05K2203/0769

Abstract: The present invention relates to a bump formation method, comprising the steps of providing a mask, in which a plurality of openings have been formed corresponding to a plurality of electrode pads, to a substrate provided with this plurality of electrode pads, filling the openings with a solder paste, and heat treating the solder paste. The solder paste contains a solder powder. This solder powder is one that contains no more than 10 wt % particles whose diameter is greater than the thickness of the mask and no more than 1.5 times this thickness. Preferably, this solder powder is one that contains no more than 10 wt % particles whose diameter is greater than 40% of the diameter of the openings, or one that contains no more than 30 wt % particles whose diameter is 40 to 100% the thickness of the mask.

Abstract translation: 凸点形成方法技术领域本发明涉及一种凸块形成方法，包括以下步骤：将具有多个电极焊盘的多个开口形成的掩模提供给设置有该多个电极焊盘的基板， 焊膏，并对焊膏进行热处理。 焊膏含有焊料粉末。 该焊料粉末是含有不超过10重量％的直径大于掩模厚度且不大于该厚度的1.5倍的颗粒。 优选地，该焊料粉末是含有不超过10重量％的直径大于开口直径的40％的颗粒，或者包含不超过30重量％的直径为40至100重量％的颗粒的焊料粉末 的面具。

公开(公告)号：US5411602A

公开(公告)日：1995-05-02

申请号：US197750

申请日：1994-02-17

Applicant: Donald J. Hayes

Inventor： Donald J. Hayes

IPC: B22F1/00 ,  B22F9/08 ,  B23K35/02 ,  H05K3/34 ,  B23K35/34

CPC classification number: H05K3/3484 ,  B22F1/0048 ,  B22F9/08 ,  B23K35/025 ,  B22F2999/00 ,  H05K2201/0266

Abstract: Spherical solder drops having precise and accurate shape are formed by an ejection device and solidified to form solder balls for making solder pastes. The diameters of the solidified solder balls are determined by an excitation signal applied to the ejection device and changes in the diameter of the orifice in the ejection device. A solder paste is produced by mixing solidified solder balls of a single diameter or a combination of several different diameters with a carrier.

Abstract translation: 通过喷射装置形成具有精确和精确形状的球形焊料滴，并固化以形成用于制造焊膏的焊球。 凝固的焊球的直径由施加到喷射装置的激发信号和喷射装置中的孔的直径的变化来确定。 通过将单个直径的固化焊球或几个不同直径的组合与载体混合来制造焊膏。

公开(公告)号：US5409741A

公开(公告)日：1995-04-25

申请号：US836650

申请日：1992-02-14

Applicant: Lucien D. Laude

Inventor： Lucien D. Laude

IPC: C23C24/00 ,  C23C18/30 ,  C23C26/00 ,  H05K1/03 ,  H05K3/10 ,  H05K3/18 ,  B05D3/06

CPC classification number: H05K3/102 ,  C23C18/30 ,  H05K1/0306 ,  H05K1/0313 ,  H05K2201/0266 ,  H05K2201/0347 ,  H05K2203/107 ,  H05K3/181

Abstract: The method for metallizing the surface of dielectric materials according to the invention comprises a first step wherein a metal powder, the size of the grains of which is comprised between 10 and 5000 nm, is deposited and then incorporated into the surface of the dielectric material. In a second step of the method, the dielectric material which is so impregnated with metal, is immersed into an autocatalytic bath to coat the impregnated zones of the material with a layer of the metal contained in the bath in a thickness which is proportional to the immersion time. This method enables to metallize materials such as oxides, polymers and composites containing these oxides and/or these polymers. The characteristics of the metal deposits are controlled, on the one hand, by the type of metal, and the size and the geometry of the metal powder grains and, on the other hand, by the type and the structure of the dielectric materials coated with these deposits.

Abstract translation: 根据本发明的用于金属化电介质材料的表面的方法包括第一步骤，其中沉积10至5000nm晶粒尺寸的金属粉末，然后并入电介质材料的表面。 在该方法的第二步中，将浸渍有金属的介电材料浸入自催化浴中，以包含在浴中的金属层涂覆该材料的浸渍区，其厚度与 沉浸时间 该方法能够使包含这些氧化物和/或这些聚合物的材料如氧化物，聚合物和复合材料金属化。 金属沉积物的特性一方面由金属的类型以及金属粉末颗粒的尺寸和几何形状进行控制，另一方面通过涂覆有金属粉末的介电材料的类型和结构来控制 这些存款。

公开(公告)号：US5225966A

公开(公告)日：1993-07-06

申请号：US735231

申请日：1991-07-24

Applicant: Nagesh R. Basavanhally ,  Benjamin H. Cranston

Inventor： Nagesh R. Basavanhally ,  Benjamin H. Cranston

IPC: H01B1/22 ,  H01B5/16 ,  H01L21/60 ,  H01R4/04 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/38

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L24/31 ,  H01R4/04 ,  H05K3/323 ,  H01L2224/29101 ,  H01L2224/29311 ,  H01L2224/29339 ,  H01L2224/29355 ,  H01L2224/29439 ,  H01L2224/29499 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01013 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/07811 ,  H01L2924/14 ,  H01L2924/30107 ,  H05K1/181 ,  H05K2201/0218 ,  H05K2201/023 ,  H05K2201/0266 ,  H05K2201/10719 ,  H05K3/3473 ,  H05K3/386

Abstract: A compliant element (23, 25) is provided between an integrated circuit (11) and a substrate (19) which are bonded and interconnected by an anisotropic conductive adhesive (20) comprising conductive particles (21) in a polymer matrix (22). In one embodiment, one set of bonding pads (12, FIG. 2) is coated with a layer (23) of a metal that is significantly softer than the metal from which the conductive particles are made, which permits an oversized conductive particle (21a) to indent into the soft metal layer (23). In another embodiment, one of the sets of bonding pads (15, FIG. 3) is arranged on a relatively thick layer of adhesive (25) which is sufficiently viscous at the temperature at which contact is made to permit the bonding pad (15) to pivot in response to pressure from an oversized conductive particle (21d).

Abstract translation: 柔性元件（23,25）设置在集成电路（11）和基板（19）之间，所述集成电路（11）和基板（19）通过在聚合物基体（22）中包含导电颗粒（21）的各向异性导电粘合剂（20）结合并互连。 在一个实施例中，一组接合焊盘（图2中的12）涂覆有金属层（23），其比制成导电颗粒的金属显着更软，这允许过大的导电颗粒（21a ）压入软金属层（23）中。 在另一个实施例中，一组接合焊盘（图3中的15个）布置在相对较厚的粘合剂层25上，粘合剂层25在接触的温度下具有足够的粘性以允许接合焊盘（15） 响应于来自过大导电颗粒（21d）的压力而枢转。

公开(公告)号：US4696764A

公开(公告)日：1987-09-29

申请号：US676876

申请日：1984-11-30

Applicant: Taro Yamazaki

Inventor： Taro Yamazaki

IPC: C09D5/24 ,  C09D5/25 ,  H01B1/20 ,  H01B1/22 ,  H01B1/24 ,  H05K3/32 ,  H05K3/36 ,  H01B1/04

CPC classification number: H01B1/24 ,  C09D5/24 ,  H01B1/20 ,  H01B1/22 ,  H05K3/323 ,  H05K2201/0129 ,  H05K2201/023 ,  H05K2201/0266 ,  H05K2201/0272 ,  H05K2201/0323 ,  H05K2201/0326 ,  H05K3/361

Abstract: An electrically conductive adhesive composition which provides electric conductivity between facing electrodes but maintains electric insulation in the lateral direction across the facing direction, said composition comprising (a) a nonconductive base resin and (b) electrically conductive particles incorporated and dispersed in the resin (a); wherein(I) said electrically conductive particles (b) are composed of(b-1) 10 to 75%, based on the total weight of the components (a), (b-1) and (b-2), of abrasive grain-like electrically conductive particles having an average particle diameter of at least 1 micrometer, and(b-2) 0.2 to 20% by weight, based on the total weight of the components (a), (b-1) and (b-2), of electrically conductive fine particles having an average particle diameter of not more than 0.5 micrometer, and(II) said electrically conductive adhesive composition contains a solvent for said base resin (a) in an amount required to form said composition into the state of a printing ink or a paint.

Abstract translation: 一种导电粘合剂组合物，其在相对的电极之间提供导电性，但在相对的方向上沿横向保持电绝缘，所述组合物包含（a）非导电基础树脂和（b）引入并分散在树脂中的导电颗粒 ）; 其中（I）所述导电颗粒（b）由基于组分（a），（b-1）和（b-2））的总重量的（b-1）10至75％ 基于组分（a），（b-1）和（b）的总重量，平均粒径为至少1微米的颗粒状导电颗粒和（b-2）0.2至20重量％ -2）平均粒径不大于0.5微米的导电细颗粒，和（II）所述导电粘合剂组合物含有用于将所述组合物形成所述组合物所需的量的所述基础树脂（a）的溶剂 印刷油墨或油漆的状态。

公开(公告)号：US4680141A

公开(公告)日：1987-07-14

申请号：US676199

申请日：1984-11-29

Applicant: Felix Barajas

Inventor： Felix Barajas

IPC: B23K35/02 ,  B23K35/36 ,  G01R1/073 ,  H05K1/02 ,  H05K3/34 ,  H01B1/06

CPC classification number: G01R1/0735 ,  B23K35/025 ,  B23K35/36 ,  H05K3/3484 ,  H05K1/0268 ,  H05K2201/0215 ,  H05K2201/0266 ,  H05K2203/163

Abstract: A test assembly for testing a high density circuit or a test board, which comprises a test head containing a mirror image circuit of the circuit to be tested on the test board, a plurality of test points on the test head circuit, the test points comprising a plurality of metal pads, and metal contacts soldered to the metal pads, the metal contacts being in the form of metal balls or flakes selected from the group consisting of brass, bronze or copper, of a size ranging from about 5 to about 30 mils. The test head is positiioned over the test board with the metal contacts on the test head in contact with corresponding test points on the high density circuit on the test board. Means are provided for connecting the circuit on the test head with a tester, thereby providing signals from the high density circuit under test through the test head circuit to the tester. A solder composition is provided which is especially adapted for soldering the metal contacts to the metal pads on the test head. Such solder composition comprises a liquid vehicle, finely divided solder metal dispersed in the vehicle, the solder metal having a particle size ranging from 40 to 70 microns, and additional metal particles dispersed in the vehicle, the additional particles being in the form of metal balls or flakes selected from the group consisting of brass, bronze and copper, the additional metal particles having a size ranging from about 5 to about 30 mils and being present in an amount ranging from about 5 to about 60% by weight of the total composition.

Abstract translation: 一种用于测试高密度电路或测试板的测试组件，其包括测试头，测试头包含测试板上待测试电路的镜像电路，测试头电路上的多个测试点，测试点包括 多个金属焊盘和焊接到金属焊盘的金属触点，金属触点是选自黄铜，青铜或铜的金属球或薄片，尺寸范围为约5至约30密耳 。 测试头位于测试板上，测试头上的金属触点与测试板上高密度电路上的相应测试点相接触。 提供了用于将测试头上的电路与测试仪连接的装置，从而通过测试头电路向测试仪提供来自被测试的高密度电路的信号。 提供了一种焊料组合物，其特别适于将金属触点焊接到测试头上的金属焊盘。 这种焊料组合物包括液体载体，分散在载体中的细碎焊料金属，焊料金属具有40至70微米的粒度，以及分散在载体中的附加金属颗粒，附加的颗粒呈金属球的形式 或选自黄铜，青铜和铜的薄片，附加金属颗粒的尺寸范围为约5至约30密尔，并且以总组合物的约5至约60重量％的量存在。

公开(公告)号：US4373974A

公开(公告)日：1983-02-15

申请号：US250209

申请日：1981-04-02

Applicant: Felix Barajas

Inventor： Felix Barajas

IPC: B23K35/26 ,  B23K35/36 ,  H01L21/50 ,  H01L23/488 ,  H05K3/34 ,  B23K35/34

CPC classification number: B23K35/262 ,  B23K35/36 ,  H01L21/50 ,  H01L23/488 ,  H05K3/3484 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/09701 ,  H05K2201/0266 ,  H05K2201/10727 ,  H05K3/3442

Abstract: Novel solder composition or solder cream, particularly adapted for soldering components in electronic circuitry, comprising finely divided solder metals such as tin and lead, dispersed in a vehicle containing viscosity controlling agents, organic solvents, and a rosin or rosin derivative as a flux. By employing a narrow range of rosin-containing vehicle, that is between 13 and 14%, and between 86 and 87% of solder metal, by weight of the solder composition, and fine particle size solder metal of from 40 to 70 microns, the formation of solder balls is essentially eliminated, thus avoiding the necessity of removing such solder balls.

Abstract translation: 新型焊料组合物或焊膏，特别适用于焊接电子电路中的组件，包括分散在含有粘度控制剂的载体中的细分散的焊料金属如锡和铅，有机溶剂和作为助熔剂的松香或松香衍生物。 通过使用窄范围的含有松香的载体，其为焊料金属的重量的13至14％，焊料金属的86至87％，以及40至70微米的细粒度焊料金属， 基本上消除了焊球的形成，从而避免了去除这样的焊球的必要性。