公开(公告)号：US20110165735A1

公开(公告)日：2011-07-07

申请号：US13048112

申请日：2011-03-15

Applicant: Kurt Peter Wachtler

Inventor： Kurt Peter Wachtler

IPC: H01L21/58

CPC classification number: H01L25/0657 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K1/028 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/10378 ,  H01L2224/05599

Abstract: A semiconductor device with a first (101) and a second (111) semiconductor chip assembled on an insulating flexible interposer (120). The interposer, preferably about 25 to 50 μm thick, has conductive traces (121), a central planar rectangular area and on each side of the rectangle a wing bent at an angle from the central plane. The central area has metal studs (122, 123) on the top and the bottom surface, which match the terminals of the chips, further conductive vias of a pitch center-to-center about 50 μm or less. The side wings have contact pads (130) with metallic connectors (131) on the bottom surface; the connectors may be solder balls, metal studs, or anisotropic conductive films. The second chip is adhesively attached to a substrate, whereby the interposer faces away from the substrate. The interposer side wings have a convex bending (150) downwardly along the second chip and a concave bending (151) over the substrate; the side wing connectors are attached to the matching substrate sites.

Abstract translation: 一种具有组装在绝缘柔性插入件（120）上的第一（101）和第二（111）半导体芯片的半导体器件。 优选约25至50μm厚的插入件具有导电迹线（121），中心平面矩形区域，并且在矩形的每一侧上以与中心平面成一定角度弯曲的翼。 中心区域在顶部和底部表面上具有与芯片的端子匹配的金属螺柱（122,123），中心至中心的间距的导电通孔为大约50μm或更小。 侧翼具有在底表面上具有金属连接器（131）的接触垫（130） 连接器可以是焊球，金属螺柱或各向异性导电膜。 第二芯片粘附到基板上，由此插入器面向基板。 插入器侧翼沿着第二芯片向下弯曲（150）并且在基板上方具有凹弯曲（151）; 侧翼连接器连接到匹配的基底部位。

公开(公告)号：US20110023291A1

公开(公告)日：2011-02-03

申请号：US12848089

申请日：2010-07-30

Applicant: James Peter Caska

Inventor： James Peter Caska

IPC: B23P19/00

CPC classification number: H05K1/0287 ,  H05K1/0289 ,  H05K1/142 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10303 ,  Y10T29/53174

Abstract: An integrated method of prototyping and manufacturing electronic circuit boards where a new circuit design can move between virtual, prototype, partially merged and fully merged forms in a relatively automated fashion. A scaleable high density matrix of solderless electrical connections between the pin-outs of a plurality of electronic modules forms a virtual breadboard prototype circuit that can be merged into printed circuit board electrical layers to thus directly synthesize manufacturable forms of prototyped electronic circuits.

Abstract translation: 一种电子电路板的原型和制造的集成方法，其中新的电路设计可以以相对自动化的方式在虚拟，原型，部分合并和完全合并之间移动。 多个电子模块的引脚之间的无焊接电连接的可扩展高密度矩阵形成虚拟面包板原型电路，其可以被合并到印刷电路板电层中，从而直接合成可制造形式的原型电子电路。

公开(公告)号：US20100314726A1

公开(公告)日：2010-12-16

申请号：US12569525

申请日：2009-09-29

Applicant: Tyler Mueller ,  Larry E. Tyler ,  Geoffrey Batchelder ,  Paul F. Gerrish ,  Michael F. Mattes ,  Anna J. Malin

Inventor： Tyler Mueller ,  Larry E. Tyler ,  Geoffrey Batchelder ,  Paul F. Gerrish ,  Michael F. Mattes ,  Anna J. Malin

IPC: H01L23/552 ,  H01L21/00

CPC classification number: H05K1/144 ,  H01L23/3107 ,  H01L23/3185 ,  H01L23/564 ,  H01L24/05 ,  H01L24/06 ,  H01L24/80 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/818 ,  H01L2224/81894 ,  H01L2224/83894 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0298 ,  H05K1/11 ,  H05K2201/041 ,  Y10T29/49117 ,  Y10T29/49147 ,  H01L2224/05552 ,  H01L2924/00

Abstract: An apparatus and method uses a first Faraday cage portion and a second Faraday cage portion to provide a Faraday cage enclosure surrounding at least one circuit device.

Abstract translation: 一种装置和方法使用第一法拉第笼部分和第二法拉第笼部分来提供围绕至少一个电路装置的法拉第笼壳。

公开(公告)号：US07638866B1

公开(公告)日：2009-12-29

申请号：US11142812

申请日：2005-06-01

Applicant: Reginald D. Bean ,  Alan P. Boone

Inventor： Reginald D. Bean ,  Alan P. Boone

IPC: H01L23/02

CPC classification number: H05K1/144 ,  H01L23/57 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06582 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H05K1/0275 ,  H05K1/183 ,  H05K3/3436 ,  H05K2201/041 ,  H05K2201/10151 ,  H05K2201/10674

Abstract: An electronic device includes a die, a first circuit substrate connected to the die, and a second circuit substrate closely coupled to the first circuit substrate. The die is located between the first and second circuit substrates and is protected from tampering by the close coupling of the first and second circuit substrates. The circuit substrates may be circuit carrying elements (e.g. circuit boards) or may be additional die, may be any number of other substrates, and/or may be a combination of substrates. The device may include a cavity such that the die is located in the cavity. The cavity could be formed by any number of means. The device may also include a second die connected to the second substrate such that the first die and second die are located in proximity to each other on opposite sides of the cavity.

Abstract translation: 电子设备包括管芯，连接到管芯的第一电路衬底和密封地耦合到第一电路衬底的第二电路衬底。 芯片位于第一和第二电路基板之间，并且通过第一和第二电路基板的紧密耦合来防止篡改。 电路基板可以是电路承载元件（例如电路板）或者可以是附加的管芯，可以是任何数量的其它衬底，和/或可以是衬底的组合。 该装置可以包括腔，使得模具位于空腔中。 空腔可以通过任何数量的方式形成。 该装置还可以包括连接到第二基板的第二管芯，使得第一管芯和第二管芯在腔体的相对侧上彼此靠近。

公开(公告)号：US20090284937A1

公开(公告)日：2009-11-19

申请号：US12431038

申请日：2009-04-28

Applicant: Pekka Rytky

Inventor： Pekka Rytky

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H05K1/147 ,  H05K1/144 ,  H05K1/182 ,  H05K1/189 ,  H05K3/4691 ,  H05K2201/041 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/10128 ,  Y10T29/49126

Abstract: An electric circuitry for a portable electronic device is presented. The electric circuitry includes a first printed circuit board comprising at least one electrical component attached to and extending from a surface of the first printed circuit board. The electric circuitry further comprises a second printed circuit board arranged to be coupled with the first printed circuit board and comprising at least one recess or hole arranged to receive the at least one electrical component extending from the surface of the first printed circuit board when the first circuit board and the second printed circuit board are coupled to each other.

Abstract translation: 提出了一种用于便携式电子设备的电路。 电路包括第一印刷电路板，其包括附着到第一印刷电路板的表面并从第一印刷电路板的表面延伸的至少一个电气部件。 电路还包括布置成与第一印刷电路板耦合的第二印刷电路板，并且包括至少一个凹槽或孔，布置成容纳从第一印刷电路板的表面延伸的至少一个电组件，当第一 电路板和第二印刷电路板彼此耦合。

公开(公告)号：US20090002339A1

公开(公告)日：2009-01-01

申请号：US12209762

申请日：2008-09-12

Applicant: Joseph Kurth REYNOLDS ,  Shawn P. DAY

Inventor： Joseph Kurth REYNOLDS ,  Shawn P. DAY

IPC: G09G5/00

CPC classification number: G06F3/03547 ,  G06F3/0412 ,  G06F3/0414 ,  G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04107 ,  H03K17/962 ,  H03K2217/960765 ,  H05K1/0201 ,  H05K1/0218 ,  H05K1/0274 ,  H05K1/144 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/10128 ,  H05K2201/10151

Abstract: A touch sensor device is provided that uses a flexible circuit substrate to provide an improved input device. Specifically, the present invention uses a touch sensor controller affixed to the flexible circuit substrate, which is coupled to a sensor component to provide a flexible, reliable and cost effective touch sensor suitable for a wide variety of applications. In one embodiment the touch sensor uses a flexible circuit substrate that provides relatively high temperature resistance. This allows the touch sensor controller to be affixed using reliable techniques, such as various types of soldering. The sensor component can comprise a relatively low-temperature-resistant substrate that can provide a cost effective solution. Taken together, this embodiment of the touch sensor provides reliability and flexibility at relatively low cost.

Abstract translation: 提供一种触摸传感器装置，其使用柔性电路基板来提供改进的输入装置。 具体地说，本发明使用固定在柔性电路基板上的触摸传感器控制器，其耦合到传感器部件，以提供适用于各种应用的灵活，可靠和成本有效的触摸传感器。 在一个实施例中，触摸传感器使用提供相对高耐温性的柔性电路基板。 这允许使用可靠的技术来粘贴触摸传感器控制器，例如各种类型的焊接。 传感器组件可以包括相对低温的衬底，其可以提供成本有效的解决方案。 综合起来，触摸传感器的这个实施例以相对低的成本提供可靠性和灵活性。

公开(公告)号：US20080316255A1

公开(公告)日：2008-12-25

申请号：US12142722

申请日：2008-06-19

Applicant: Tomoyuki Kubo ,  Hirofumi Kondo

Inventor： Tomoyuki Kubo ,  Hirofumi Kondo

IPC: B41J2/145 ,  H05K1/02 ,  H05K3/36

CPC classification number: B41J2/1609 ,  B41J2/14209 ,  B41J2/1623 ,  B41J2/1632 ,  B41J2002/14217 ,  B41J2002/14225 ,  B41J2002/14306 ,  B41J2002/14419 ,  B41J2002/14459 ,  B41J2002/14491 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/09063 ,  H05K2203/063 ,  Y10T29/49126

Abstract: A flexible wiring member which connects a device and an external signal source has a plurality of wire members in which a plurality of wires are formed on one surface of a substrate, and a plurality of wire members is stacked to face the device. A plurality of bumps for connecting with the device are provided to the wires on a surface, of the wirings, facing the device. Bumps of one of the wire members overlapping with the other of the wire members face the device via the through hole formed in the other of the wire members. Accordingly, it is possible to realize high densification of wires in the flexible wiring while suppressing a rise in a cost.

Abstract translation: 连接装置和外部信号源的柔性布线构件具有多个线构件，其中多个线形成在基板的一个表面上，并且多个线构件被堆叠以面对该装置。 将多个用于与该装置连接的凸块设置在布线面对该装置的表面上的导线上。 与另一个线构件重叠的线构件中的一个的撞击物体通过形成在另一个线构件中的通孔面对设备。 因此，可以在抑制成本上升的同时，在柔性布线中实现线的高致密化。

公开(公告)号：US07348842B2

公开(公告)日：2008-03-25

申请号：US11512471

申请日：2006-08-30

Applicant: Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang ,  Zlatko Aurelio Filipvic

Inventor： Ikuroh Ichitsubo ,  Guan-Wu Wang ,  Weiping Wang ,  Zlatko Aurelio Filipvic

IPC: H03F1/00

CPC classification number: H03F3/195 ,  H01L23/66 ,  H01L25/162 ,  H01L25/165 ,  H01L25/18 ,  H01L2223/665 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/19041 ,  H01L2924/19103 ,  H01L2924/3011 ,  H01L2924/3025 ,  H03F1/34 ,  H03F3/24 ,  H03F2200/294 ,  H03F2200/372 ,  H04B2001/0433 ,  H05K1/0237 ,  H05K1/144 ,  H05K1/16 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/041 ,  H01L2924/00

Abstract: A radio frequency (RF) module includes a first substrate adapted to receive passive circuits; and a second substrate adapted to receive active circuits, the first and second substrates electrically coupled through pads positioned on opposing surfaces of the first and second substrate.

Abstract translation: 射频（RF）模块包括适于接收无源电路的第一衬底; 以及适于接收有源电路的第二衬底，所述第一和第二衬底通过定位在所述第一和第二衬底的相对表面上的衬垫电耦合。

公开(公告)号：US20070285949A1

公开(公告)日：2007-12-13

申请号：US11448933

申请日：2006-06-08

Applicant: Pervaiz Lodhie ,  Kevin T. Sweeney

Inventor： Pervaiz Lodhie ,  Kevin T. Sweeney

IPC: H01R33/00

CPC classification number: H01R25/142 ,  F21S8/038 ,  F21V21/35 ,  F21Y2115/10 ,  H01R13/7175 ,  H05K1/141 ,  H05K2201/041 ,  H05K2201/10106

Abstract: A track lighting system wherein a module having a plurality of LEDs mounted thereto is placed within a channel shaped rail system, the module being positionable within the rail system. A first surface of a first printed circuit board (PCB) is positioned on the bottom surface of the rail system and a pair of parallel conductive members are positioned on the second surface of the PCB. The bottom surface of the module has a plurality of spaced openings through which are inserted input power detents which contact corresponding conductive members. The power detents are connected to a circuit which converts the 24 VDC power input to a constant current; the output of the circuit being coupled to a second PCB upon which is mounted the LEDs. Openings are formed in the sides of the rail system and detents, positioned on the sides of the module, engage corresponding openings formed in the rail system sides to lock the module in position within the rail system.

Abstract translation: 一种轨道照明系统，其中具有安装在其上的多个LED的模块被放置在通道形状的轨道系统内，该模块可定位在轨道系统内。 第一印刷电路板（PCB）的第一表面位于轨道系统的底表面上，并且一对平行的导电构件位于PCB的第二表面上。 模块的底表面具有多个间隔开的开口，通过该开口插入与相应的导电构件相接触的输入动力爪。 功率锁定器连接到将24VDC功率输入转换为恒定电流的电路; 电路的输出耦合到安装有LED的第二PCB上。 开口形成在轨道系统的侧面，定位在模块的侧面上的棘爪接合形成在轨道系统侧的相应的开口，以将模块锁定在轨道系统内的适当位置。

公开(公告)号：US20070247824A1

公开(公告)日：2007-10-25

申请号：US11379751

申请日：2006-04-21

Applicant: Paul Brazis ,  Marc Chason ,  Daniel Gamota ,  Krishna Kalyanasundaram

Inventor： Paul Brazis ,  Marc Chason ,  Daniel Gamota ,  Krishna Kalyanasundaram

IPC: H05K1/14 ,  H05K1/11

CPC classification number: H05K1/147 ,  H05K1/118 ,  H05K1/144 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/10189 ,  H05K2201/10674 ,  H05K2203/1572

Abstract: An electronic apparatus, includes a plurality of electronic modules, each having a maximum thickness of no more than 90 microns, each comprising a substrate having a two sided edge connection pattern. The electronic modules are arranged adjacent to each other. Each pad of a first set of connection pads on a first electronic module is conductively connected to an opposing pad of a second set of connection pads of a second electronic module. The first set of connection pads is separated from the second set of connection pads by electrically conductive material that is less than 15 microns thick.

Abstract translation: 一种电子设备，包括多个电子模块，每个电子模块的最大厚度不超过90微米，每个电子模块包括具有双面边缘连接图案的基板。 电子模块彼此相邻布置。 第一电子模块上的第一组连接焊盘的每个焊盘导电地连接到第二电子模块的第二组连接焊盘的相对焊盘。 第一组连接焊盘通过小于15微米厚的导电材料与第二组连接焊盘分开。