公开(公告)号：US20170091491A1

公开(公告)日：2017-03-30

申请号：US14865551

申请日：2015-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： John R. DANGLER ,  Phillip Duane ISAACS ,  David C. LONG

IPC: G06F21/87 ,  H05K1/02 ,  H05K3/10 ,  G06F21/72

CPC classification number: H05K3/10 ,  G06F21/72 ,  G06F21/87 ,  H05K1/0275 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/0393 ,  H05K1/147 ,  H05K1/167 ,  H05K3/062 ,  H05K3/366 ,  H05K2201/0352 ,  H05K2201/042 ,  H05K2201/047 ,  H05K2201/055 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/10151

Abstract: Tamper-respondent electronic circuit structures, electronic assembly packages, and methods of fabrication are provided which include, at least in part, a tamper-respondent sensor. The tamper-respondent sensor includes one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.

公开(公告)号：US09590337B2

公开(公告)日：2017-03-07

申请号：US14736895

申请日：2015-06-11

Applicant: Tyco Electronics Corporation

Inventor： Kyle Gary Annis ,  Lynn Robert Sipe ,  Dustin Carson Belack ,  Matthew Richard McAlonis ,  Graham Harry Smith, Jr.

IPC: H01R13/40 ,  H01R12/79 ,  H01R13/52 ,  H01R13/6581

CPC classification number: H01R12/79 ,  H01R12/598 ,  H01R12/62 ,  H01R13/5202 ,  H01R13/6581 ,  H01R13/6587 ,  H05K1/117 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10189

Abstract: An electrical connector includes a housing having a cavity. A wafer stack is received in the cavity. The wafer stack includes a plurality of electrical wafers arranged parallel to each other within the cavity. Each wafer includes a first edge and a second edge. Each wafer includes at least one trace between the first and second edges. The electrical connector includes a flex harness including a plurality of flexible printed circuit boards (FPCBs). The FPCBs are electrically connected to corresponding wafers.

Abstract translation: 电连接器包括具有空腔的壳体。 晶片堆叠被容纳在空腔中。 晶片堆叠包括在空腔内彼此平行布置的多个电晶片。 每个晶片包括第一边缘和第二边缘。 每个晶片包括在第一和第二边缘之间的至少一个迹线。 电连接器包括具有多个柔性印刷电路板（FPCB）的柔性线束。 FPCB电连接到相应的晶片。

公开(公告)号：US20170048963A1

公开(公告)日：2017-02-16

申请号：US15208944

申请日：2016-07-13

Applicant: FUJITSU LIMITED

Inventor： HAJIME MURAKAMI

IPC: H05K1/02 ,  H05K1/14 ,  H01L23/31 ,  H05K1/11

CPC classification number: H05K1/023 ,  G06F1/183 ,  G06F1/184 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0262 ,  H05K1/113 ,  H05K1/115 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/1031 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y02P70/611

Abstract: A noise reduction board includes: a first board; a second board arranged under the first board; a plurality of power feeding parts made of a metal in a shape of a pole and configured to electrically interconnect the first board and the second board; and a noise reduction part arranged between the power feeding parts, wherein the noise reduction part includes: a metal plate; an insulator configured to cover a surface of the metal plate; a first terminal provided on the side of the first board of the metal plate and electrically coupled to a ground pattern of the first board; and a second terminal provided on the side of the second board of the metal plate and electrically coupled to a ground pattern of the second board.

Abstract translation: 降噪板包括：第一板; 布置在第一板下的第二板; 多个供电部，其由金属制成，其形状为极，并且构造成使所述第一板和所述第二板电连接; 以及设置在所述供电部之间的降噪部，其中所述降噪部包括：金属板; 被配置为覆盖所述金属板的表面的绝缘体; 第一端子，设置在所述金属板的所述第一板的一侧上并电耦合到所述第一板的接地图案; 以及第二端子，设置在所述金属板的所述第二板的一侧并电耦合到所述第二板的接地图案。

公开(公告)号：US09545023B2

公开(公告)日：2017-01-10

申请号：US14322538

申请日：2014-07-02

Applicant: Schroff GmbH

Inventor： Dietmar Mann ,  Sergej Dizel ,  Dietmar Gauges ,  Jochen Müller

IPC: H05K7/14 ,  H05K7/18 ,  H05K5/02 ,  H05K1/14

CPC classification number: H05K5/0256 ,  H05K1/144 ,  H05K7/1427 ,  H05K7/1445 ,  H05K2201/042 ,  H05K2201/044 ,  H05K2201/09036 ,  H05K2201/10409 ,  H05K2201/2036 ,  Y10T29/53183

Abstract: A cabinet for housing electronic plug-in cards has front and rear card baskets for inserting plug-in cards and first and second vertical backplanes. The front side of the first backplane faces the front of the cabinet and the front side of the second backplane faces the back of the cabinet. A distance piece connects the two backplanes and a counterbore is disposed in at least one of the rear sides of the two backplanes. The depth of the counterbore or the residual thicknesses of the backplane after drilling the counterbore is sized such that the distance between the front side of the second backplane and the front of the cabinet is a predetermined value. This ensures that the plug-in cards pushed onto the second backplane are completely received inside the rear card basket and the front plate of the plug-in cards ends flush with the rear card basket.

Abstract translation: 用于容纳电子插件卡的机柜具有用于插入插卡和第一和第二垂直背板的前后卡筐。 第一背板的前侧面向机柜的前部，第二个背板的前侧面向机柜后部。 距离件连接两个背板，并且在两个背板的至少一个后侧设置沉孔。 钻孔后沉孔的深度或背板的残余厚度的尺寸使得第二背板前侧与机柜前部之间的距离为预定值。 这确保了推到第二背板上的插入卡被完全接收在后卡筐内，插卡的前板与后卡筐齐平。

公开(公告)号：US09515398B2

公开(公告)日：2016-12-06

申请号：US14091706

申请日：2013-11-27

Applicant: Robert Bosch GmbH

Inventor： Ligor Manushi ,  John Janson ,  Keith Gerber ,  Hiram Avalos

IPC: H01R12/52 ,  H05K1/14

CPC classification number: H01R12/52 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: A spacer and electrical connector assembly for printed circuit boards includes a first member to be placed between two of the printed circuit boards to provide a required spacing between the printed circuit boards. The assembly also includes at least one second member disposed adjacent to the first member, the second member extending along a length of the first member and at least partially bracketing an upper surface and a lower surface of the first member, thereby providing an electrical connection between the printed circuit boards. A plurality of contact portions that respectively receive the second member may be disposed on at least one of the upper and lower surfaces.

Abstract translation: 用于印刷电路板的间隔件和电连接器组件包括放置在两个印刷电路板之间的第一构件，以在印刷电路板之间提供所需的间隔。 组件还包括邻近第一构件设置的至少一个第二构件，第二构件沿着第一构件的长度延伸并且至少部分地包围第一构件的上表面和下表面，从而在第一构件之间提供电连接 印刷电路板。 分别容纳第二构件的多个接触部分可以设置在上表面和下表面中的至少一个上。

公开(公告)号：US20160353573A1

公开(公告)日：2016-12-01

申请号：US15135248

申请日：2016-04-21

Applicant: Innodisk Corporation

Inventor： Chih-Hsing CHEN ,  Hsiao-Yu WANG

IPC: H05K1/14 ,  H05K1/02

CPC classification number: H05K1/144 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409

Abstract: The invention provides a stacked structure comprising a master circuit board and at least two slave circuit boards. The master circuit board comprises a plurality of connecting seats. Each slave circuit board is equipped with a connector, and defined with a plurality of post-production process areas. Wherein the connector of each slave circuit board is disposed on one of post-production process areas, and inserted into the corresponding connecting seat. When the connector of the slave circuit board must be through other slave circuit boards in order to insert the corresponding connecting seat, the post-production process areas that are disposed on other slave circuit boards and impede the connection between the connector and the corresponding connecting seat will be cut into hollow areas. Accordingly, the connector of the slave circuit board is capable of inserting the corresponding connecting seat through the hollow areas of other slave circuit boards.

Abstract translation: 本发明提供了包括主电路板和至少两个从电路板的堆叠结构。 主电路板包括多个连接座。 每个从属电路板都配有一个连接器，并且具有多个后期制作工艺区域。 其中每个从属电路板的连接器设置在后期制作处理区域中的一个上，并插入到相应的连接座中。 当从属电路板的连接器必须通过其他从电路板以插入相应的连接座时，后置制作处理区域设置在其他从电路板上并阻碍连接器与相应连接座之间的连接 将被切成中空区域。 因此，从电路板的连接器能够通过其他从属电路板的中空区域插入相应的连接座。

公开(公告)号：US20160352243A1

公开(公告)日：2016-12-01

申请号：US15157991

申请日：2016-05-18

Applicant: FUJITSU LIMITED

Inventor： Kazuya OKAMOTO ,  Hironobu Kageyama

IPC: H02M7/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0237 ,  H02M1/44 ,  H02M2003/1566 ,  H05K1/0243 ,  H05K1/0265 ,  H05K1/113 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/0979 ,  H05K2201/09972 ,  H05K2201/10166 ,  H05K2201/10303

Abstract: A converter mounting board includes: an electronic component which is supplied an electric current; a high-frequency DC-DC converter that supplies a direct current corresponding to a fast change of the electric current of the electronic component; and a low-frequency DC-DC converter located far away from the electronic component than the high-frequency DC-DC converter and supplies a direct current corresponding to a slow change of the electric current of the electronic component.

Abstract translation: A转换器安装板包括：提供电流的电子部件; 提供与电子部件的电流的快速变化对应的直流电流的高频DC-DC转换器; 以及与高频DC-DC转换器相比远离电子部件的低频DC-DC转换器，并且提供与电子部件的电流的缓慢变化相对应的直流电流。

公开(公告)号：US09456504B2

公开(公告)日：2016-09-27

申请号：US14547498

申请日：2014-11-19

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Tomoki Kobayashi

IPC: H05K3/28 ,  H05K1/02 ,  H05K1/18 ,  H05K3/36

CPC classification number: H05K3/284 ,  H05K1/0218 ,  H05K1/186 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/0715 ,  H05K2201/086 ,  H05K2201/10234

Abstract: An electronic device includes wiring substrates stacked upon one another with a connection member arranged between adjacent wiring substrates, in which the connection member electrically connects the adjacent wiring substrates, and each wiring substrate includes a solder resist layer as a lowermost layer, electronic components mounted on the wiring substrates so that at least one of the electronic components is mounted on each wiring substrate, a first magnetic thin film covering a lower surface of the solder resist layer of an upper one of the adjacent wiring substrates, a first encapsulation resin formed on an upper surface of the uppermost wiring substrate and encapsulates the electronic component mounted on the uppermost wiring substrate, and a second magnetic thin film that entirely covers an upper surface of the first encapsulation resin and covers a lower surface of the solder resist layer on the lowermost wiring substrates.

Abstract translation: 一种电子设备，包括：布置在相邻的布线基板之间的连接构件彼此堆叠的布线基板，其中连接构件电连接相邻布线基板，并且每个布线基板包括作为最下层的阻焊层，安装在 所述布线基板使得至少一个所述电子部件安装在每个布线基板上，覆盖所述相邻布线基板的上部的阻焊层的下表面的第一磁性薄膜，形成在所述布线基板上的第一封装树脂 最上面的布线基板的上表面，封装安装在最上面的布线基板上的电子部件和完全覆盖第一封装树脂的上表面的第二磁性薄膜，并且覆盖最下面布线上的阻焊层的下表面 底物。

公开(公告)号：US09408327B2

公开(公告)日：2016-08-02

申请号：US14800374

申请日：2015-07-15

Applicant: TDK-LAMBDA CORPORATION

Inventor： L. Ray Albrecht, III ,  Gordon K. Y. Lee ,  Jin He

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/14 ,  H01L23/473

CPC classification number: H05K7/20463 ,  H05K1/0203 ,  H05K1/0204 ,  H05K1/144 ,  H05K7/20454 ,  H05K7/205 ,  H05K2201/042 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2201/10871 ,  Y10T29/49144

Abstract: A thermal management system/method allowing efficient electrical/thermal attachment of heat sourcing PCBs to heat sinking PCBs using reflow/wave/hand soldering is disclosed. The disclosed system/method may incorporate a combination of support pins, spacer pads, and/or contact paste that mechanically attaches a heat sourcing PCB (and its associated components) to a heat sinking PCB such that thermal conductivity between the two PCBs can be optimized while simultaneously allowing controlled electrical conductivity between the two PCBs. Controlled electrical isolation between the two PCBs is provided for using spacer pads that may also be thermally conductive. Contact paste incorporated in some embodiments permits enhanced conductivity paths between the heat sourcing PCB, a thermally conductive plate mounted over the heat sourcing PCB, and the heat sinking PCB. The use of self-centering support pins incorporating out-gassing vents in some embodiments allows reflow/wave/hand soldering as desired.

Abstract translation: 公开了一种热管理系统/方法，其允许使用回流/波/手焊接将散热PCB的热源PCB与电源/热附件进行高效电连接。 所公开的系统/方法可以包括将热源PCB（及其相关部件）机械连接到散热PCB上的支撑销，间隔垫和/或接触膏的组合，使得可以优化两个PCB之间的导热性 同时允许两个PCB之间的受控电导率。 提供了两个PCB之间的受控电隔离，以使用也可以是导热的间隔垫。 在一些实施例中结合的接触膏允许加热PCB，安装在热源PCB上的导热板和散热PCB之间的增强的导电路径。 在一些实施例中，使用包含排气孔的自定心支撑销允许根据需要进行回流/波/手焊。

公开(公告)号：US09338879B2

公开(公告)日：2016-05-10

申请号：US14534170

申请日：2014-11-06

Applicant: VIA Technologies, Inc.

Inventor： Sheng-Yuan Lee

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0216 ,  H05K1/0222 ,  H05K1/0245 ,  H05K1/115 ,  H05K1/182 ,  H05K2201/042 ,  H05K2201/10189

Abstract: A through-hole layout structure is suitable for a circuit board. The through-hole layout structure includes a pair of first differential through-holes, a pair of second differential through-holes, a first ground through-hole, a second ground through-hole, and a third ground through-hole, which are all arranged on a first line. The first ground through-hole is located between the pair of first differential through-holes and the pair of second differential through-holes. The pair of first differential through-holes is located between the first ground through-hole and the second ground through-hole. The pair of second differential through-holes is located between the first ground through-hole and the third ground through-hole.

Abstract translation: 通孔布局结构适用于电路板。 通孔布局结构包括一对第一差分通孔，一对第二差分通孔，第一接地通孔，第二接地通孔和第三接地通孔，这些都是 安排在第一行。 第一接地通孔位于一对第一差分通孔和一对第二差动通孔之间。 一对第一差分通孔位于第一接地通孔和第二接地通孔之间。 一对第二差分通孔位于第一接地通孔和第三接地通孔之间。