公开(公告)号：USRE42429E1

公开(公告)日：2011-06-07

申请号：US12790393

申请日：2010-05-28

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H02H9/00

CPC classification number: H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0246 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10022 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A semiconductor module is provided which includes a beat heat spreader, at least two semiconductors thermally coupled to the heat spreader, and a plurality of electrically conductive leads electrically connected to the semiconductors. At least one of the electrically conductive leads is common to both of the semiconductors. The semiconductor module also includes a termination resistor electrically coupled to at least one of the semiconductors. A method of making a semiconductor module is also taught, whereby a plurality of electrically conductive leads are provided. At least two semiconductors are electrically coupled to the plurality of electrically conductive leads, where at least one of the electrically conductive leads is common to both of the semiconductors. The semiconductors are then thermally coupled to a heat spreader. Subsequently, a termination resistor is electrically coupled to at least one of the semiconductors.

Abstract translation: 提供一种半导体模块，其包括节拍散热器，与散热器热耦合的至少两个半导体以及电连接到半导体的多个导电引线。 至少一个导电引线对于这两个半导体是共同的。 半导体模块还包括电耦合到至少一个半导体的终端电阻器。 还教导了制造半导体模块的方法，由此提供多个导电引线。 至少两个半导体电耦合到多个导电引线，其中至少一个导电引线对于两个半导体都是共同的。 然后将半导体热耦合到散热器。 随后，终端电阻器电耦合到至少一个半导体。

公开(公告)号：US20110047789A1

公开(公告)日：2011-03-03

申请号：US12547561

申请日：2009-08-26

Applicant: David R. Lyders ,  George Alan Salisbury

Inventor： David R. Lyders ,  George Alan Salisbury

IPC: B23P19/00

CPC classification number: H05K1/118 ,  H01R24/58 ,  H01R2107/00 ,  H05K1/147 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09236 ,  Y10T29/532

Abstract: An electrical probe assembly includes a flexible circuit. A plurality of electrically conductive regions is on a first side of the flexible circuit. The flexible circuit is arranged about an axis formed by rolling the flexible circuit such that the electrically conductive regions form a plurality of isolated electrically conductive bands.

Abstract translation: 电探头组件包括柔性电路。 多个导电区域在柔性电路的第一侧上。 柔性电路围绕通过滚动柔性电路形成的轴线布置，使得导电区域形成多个隔离的导电带。

公开(公告)号：US07877875B2

公开(公告)日：2011-02-01

申请号：US12193735

申请日：2008-08-19

Applicant: Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

Inventor： Stephen Richard O'Farrell ,  Jan Waszczuk ,  Stephen John Sleijpen ,  James Andrew ,  Craig Donald Strudwicke ,  William Granger ,  Mark Janos

IPC: B23P17/00 ,  B21D53/76 ,  H01L41/00 ,  H04R17/00 ,  H05B3/00

CPC classification number: H05K3/361 ,  B41J2/16 ,  B41J2/1623 ,  B41J2002/14362 ,  B41J2002/14491 ,  B41J2202/19 ,  H01R12/62 ,  H05K1/0266 ,  H05K3/3494 ,  H05K2201/056 ,  H05K2201/09927 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/1476 ,  Y10T29/42 ,  Y10T29/49083 ,  Y10T29/49117 ,  Y10T29/49401

Abstract: A method for connecting a flexible printed circuit board (PCB) to a printhead assembly that includes a printhead carrier and an ink ejection printhead carried by the carrier. The method includes the steps of: adhering the PCB to a first surface of the printhead; receiving the printhead and PCB in a mechanical nest, and actuating the nest into a position below a heated platen assembly; heating the heated platen assembly and actuating the heated platen assembly rectilinearly towards the nest, the heated platen assembly thereby compressing the PCB and the printhead; actuating a forming bar assembly, provided adjacent the heated platen assembly, rectilinearly towards the nest, the forming bar assembly thereby bending a portion of the PCB extending beyond the printhead towards the printhead assembly; and heating a heater cartridge and actuating the heater cartridge rectilinearly towards the print head printhead in a direction substantially perpendicular to the direction in which the forming bar assembly is actuated, whereby the PCB is connected to the printhead and bonded to the printhead carrier.

Abstract translation: 一种用于将柔性印刷电路板（PCB）连接到打印头组件的方法，该打印头组件包括打印头托架和由托架承载的喷墨打印头。 该方法包括以下步骤：将PCB粘附到打印头的第一表面; 将所述打印头和PCB接收在机械嵌套中，并且将所述嵌套驱动到加热的压板组件下方的位置; 加热加热的压板组件并使加热的压板组件直线地朝向嵌套，加热的压板组件由此压缩PCB和打印头; 致动成形条组件，其邻近加热的压板组件直线地朝向嵌套，成形条组件从而将PCB的部分延伸超过打印头朝向打印头组件; 并且加热加热器盒并且在基本上垂直于成形条组件被致动的方向的方向上朝向打印头打印头直线地致动加热器盒，由此PCB连接到打印头并结合到打印头托架。

公开(公告)号：US20100321565A1

公开(公告)日：2010-12-23

申请号：US12850983

申请日：2010-08-05

Applicant: Hiroyuki MOTOHARA ,  Yoshiro NISHIMURA

Inventor： Hiroyuki MOTOHARA ,  Yoshiro NISHIMURA

IPC: H04N5/225

CPC classification number: G03B17/02 ,  A61B1/00096 ,  A61B1/00101 ,  A61B1/04 ,  H04N5/2254 ,  H04N5/2257 ,  H04N2005/2255 ,  H05K1/189 ,  H05K3/301 ,  H05K2201/056 ,  H05K2201/10121 ,  H05K2201/10606

Abstract: There is provided an image pickup module which can be formed by a simple process while securing the mechanical strength of an inner lead at the time of bending and when fixed, without increasing an outer dimension of the image pickup module.The image pickup module includes an image pickup element having an image pickup surface, and a flexible substrate is drawn to be directed rearward of the image pickup surface. A guide member which fixes the image pickup element and the flexible substrate is provided, and the guide member includes a portion which is extended along a rear surface of the image pickup element, and a portion which is extended along a gap between the image pickup element and the flexible substrate.

Abstract translation: 提供了一种图像拾取模块，其可以通过简单的过程形成，同时在弯曲时和固定时确保内引线的机械强度，而不增加图像拾取模块的外部尺寸。 图像拾取模块包括具有图像拾取表面的图像拾取元件，并且柔性基板被绘制成指向图像拾取表面的后方。 提供固定图像拾取元件和柔性基板的引导构件，并且引导构件包括沿着图像拾取元件的后表面延伸的部分和沿图像拾取元件之间的间隙延伸的部分 和柔性基板。

公开(公告)号：US07787254B2

公开(公告)日：2010-08-31

申请号：US11715205

申请日：2007-03-07

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K1/00

CPC classification number: H05K1/189 ,  H01L23/473 ,  H01L23/5387 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K3/0061 ,  H05K3/0064 ,  H05K2201/056 ,  H05K2201/064 ,  H05K2201/09445 ,  H05K2201/2018 ,  H01L2924/00

Abstract: A multichip module comprises: a first rigid member defining one outer wall of a chamber; a second rigid member defining the opposite wall of the chamber; a sealable interface joining the first and second rigid members at their peripheries, whereby a hollow chamber is formed; a flex circuit having a plurality of integrated circuit chips disposed thereon, the flex circuit affixed to at least one of the first and second rigid members; electrical contacts at least partially extending outward through the sealable interface; and, a fluid inlet and a fluid outlet configured to permit fluid to flow through the chamber whereby heat generated by the integrated circuit chips may be removed from the module.

Abstract translation: 多芯片模块包括：限定室的一个外壁的第一刚性构件; 限定所述腔室的相对壁的第二刚性构件; 可密封的界面，在其周边处连接第一和第二刚性构件，由此形成中空室; 具有设置在其上的多个集成电路芯片的柔性电路，所述柔性电路固定到所述第一和第二刚性构件中的至少一个; 至少部分地通过可密封界面向外延伸的电触点; 以及流体入口和流体出口，其构造成允许流体流过所述室，由此可以从模块移除由集成电路芯片产生的热量。

公开(公告)号：US20100214741A1

公开(公告)日：2010-08-26

申请号：US12632398

申请日：2009-12-07

Applicant: Rie Takada ,  Kenichiro Tsubone

Inventor： Rie Takada ,  Kenichiro Tsubone

IPC: H05K7/20 ,  H05K1/14 ,  H05K1/00 ,  H05K3/30

CPC classification number: H05K1/147 ,  H01L23/3672 ,  H01L23/5385 ,  H01L23/5387 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16237 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19106 ,  H05K1/0203 ,  H05K1/141 ,  H05K1/189 ,  H05K3/3436 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10666 ,  H05K2201/10734 ,  H05K2203/0455 ,  Y10T29/4913 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: An electronic component mounting structure includes a first substrate on which a first component is mounted and a second substrate connected to the first substrate. The second substrate is bent toward the first component.

Abstract translation: 电子部件安装结构包括：第一基板，其上安装有第一部件;第二基板，连接到第一基板。 第二基板朝向第一部件弯曲。

公开(公告)号：US07748110B2

公开(公告)日：2010-07-06

申请号：US11826758

申请日：2007-07-18

Applicant: Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

Inventor： Toshiyuki Asahi ,  Seiji Karashima ,  Takashi Ichiryu ,  Seiichi Nakatani ,  Tousaku Nishiyama ,  Koichi Hirano ,  Osamu Shibata ,  Takeshi Nakayama ,  Yoshiyuki Saito

IPC: H05K3/36

CPC classification number: H05K3/403 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01R12/52 ,  H01R13/2414 ,  H05K1/0218 ,  H05K1/0284 ,  H05K1/141 ,  H05K1/145 ,  H05K1/182 ,  H05K3/20 ,  H05K3/3442 ,  H05K3/361 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/043 ,  H05K2201/048 ,  H05K2201/049 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/09036 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K2203/302 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49208 ,  H01L2924/00

Abstract: A connection member can be produced without a via-forming step. The connection member includes an insulating substrate which has an upper surface, a lower surface opposed to the upper surface, and a side surface which connects these surfaces; and at least one wiring which extends from the upper surface to the lower surface through the side surface.

Abstract translation: 可以在没有通孔形成步骤的情况下制造连接构件。 连接构件包括绝缘基板，其具有上表面，与上表面相对的下表面和连接这些表面的侧表面; 以及至少一个通过侧面从上表面延伸到下表面的布线。

公开(公告)号：US07718284B2

公开(公告)日：2010-05-18

申请号：US12104597

申请日：2008-04-17

Applicant: Taiki Sueyoshi ,  Hiroshi Yamazaki

Inventor： Taiki Sueyoshi ,  Hiroshi Yamazaki

IPC: H01M14/00 ,  H01M8/00 ,  H05K1/00

CPC classification number: H05K1/0272 ,  H01M8/0206 ,  H01M8/0221 ,  H01M8/0228 ,  H01M8/1011 ,  H01M8/1097 ,  H05K1/16 ,  H05K2201/056 ,  H05K2201/09063 ,  Y02E60/523

Abstract: A base insulating layer of an FPC board includes a rectangular first insulating portion and a second insulating portion that outwardly extends from one side of the first insulating portion. A conductor layer is formed on one surface of the base insulating layer. The conductor layer includes a pair of rectangular collector portions and a pair of extraction conductor portions that extend in a long-sized shape from the collector portions. One collector portion is formed in a first region of the first insulating portion of the base insulating layer, and the other collector portion is formed in a second region of the first insulating portion. One extraction conductor portion extends from the one collector portion to the second insulating portion, and the other extraction conductor portion extends from the other collector portion to the second insulating portion.

Abstract translation: FPC基板的基底绝缘层包括矩形的第一绝缘部分和从第一绝缘部分的一侧向外延伸的第二绝缘部分。 在基底绝缘层的一个表面上形成导体层。 导体层包括一对矩形集电器部分和从集电部分延伸成长形状的一对提取导体部分。 一个集电部分形成在基底绝缘层的第一绝缘部分的第一区域中，另一个集电部分形成在第一绝缘部分的第二区域中。 一个提取导体部分从一个集电器部分延伸到第二绝缘部分，另一个引出部分从另一个集电部分延伸到第二绝缘部分。

公开(公告)号：US07715200B2

公开(公告)日：2010-05-11

申请号：US12232990

申请日：2008-09-26

Applicant: Jung-Chan Cho ,  Yang-Je Lee ,  Hyun-Seok Choi ,  Yong-Hyun Kim ,  Jung-Hyeon Kim ,  Hyo-Jae Bang ,  Do-Hyung Kim ,  Kyoung-Sun Kim ,  Young-Ho Lee ,  Jae-Sang Baik ,  Yong-Jin Kim

Inventor： Jung-Chan Cho ,  Yang-Je Lee ,  Hyun-Seok Choi ,  Yong-Hyun Kim ,  Jung-Hyeon Kim ,  Hyo-Jae Bang ,  Do-Hyung Kim ,  Kyoung-Sun Kim ,  Young-Ho Lee ,  Jae-Sang Baik ,  Yong-Jin Kim

IPC: H05K1/00

CPC classification number: H05K1/147 ,  H05K1/117 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/10159 ,  H05K2203/1572

Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.

Abstract translation: 提供堆叠半导体模块，其制造方法和使用该模块的电子系统。 提供了具有安装在刚性印刷电路板（PCB）上的多个半导体器件和具有安装在柔性PCB上的多个其它半导体器件的第二半导体模块的第一半导体模块。 在刚性PCB上，可以在第一表面上设置数L个第一突出部，并且可以在刚性PCB的第二表面上设置数个K个第二突片。 柔性PCB可以在第三表面上具有数量M的第三突出部，并且在柔性PCB的第四表面上可以具有数目N的第四突出部。 第二突片可以使用导电粘合剂与第三突片组合。 第三突片可以电连接到相应的第二突片。

公开(公告)号：US20100110328A1

公开(公告)日：2010-05-06

申请号：US12608267

申请日：2009-10-29

Applicant: Yoshitaka TATEBAYASHI ,  Akira HOSAKA

Inventor： Yoshitaka TATEBAYASHI ,  Akira HOSAKA

IPC: G02F1/1333

CPC classification number: G02F1/13452 ,  G02B6/0083 ,  G02B6/0091 ,  G02F2202/28 ,  H05K1/189 ,  H05K2201/056 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: A small-sized liquid crystal display device which can enhance light utilization efficiency of light emitting diodes and also can reduce a thickness of the liquid crystal display device is provided. A flexible printed circuit board is connected to a terminal portion of a TFT substrate. In such a flexible printed circuit board, a light-emitting-diode-use flexible printed circuit board is folded and extends toward a back surface of a backlight. Light emitting diodes are arranged on the light-emitting-diode-use flexible printed circuit board in such a manner that the light emitting diodes are pressed against an edge portion of the light guide plate. Since the light emitting diodes and the edge portion of the light guide plate are brought into close contact with each other, the utilization efficiency of light from the light emitting diodes is enhanced. Further, since the light emitting diodes and the edge portion of the light guide plate which faces the light emitting diodes are provided outside the TFT substrate, a thickness of the whole liquid crystal display device can be reduced.

Abstract translation: 提供一种可以提高发光二极管的光利用效率并且还可以减小液晶显示装置的厚度的小尺寸液晶显示装置。 柔性印刷电路板连接到TFT基板的端子部分。 在这种柔性印刷电路板中，将发光二极管使用的柔性印刷电路板折叠并朝向背光的背面延伸。 发光二极管以发光二极管使用的柔性印刷电路板的方式配置，使得发光二极管被压靠在导光板的边缘部分上。 由于发光二极管和导光板的边缘部分彼此紧密接触，所以来自发光二极管的光的利用效率提高。 此外，由于发光二极管和导光板的面向发光二极管的边缘部分设置在TFT基板的外侧，所以可以降低整个液晶显示装置的厚度。