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    Apparatus for heating surfaces in the internal space of a motor vehicle
    61.
    发明授权
    Apparatus for heating surfaces in the internal space of a motor vehicle 有权
    用于加热机动车内部空间中的表面的装置

    公开(公告)号：US09510393B2

    公开(公告)日：2016-11-29

    申请号：US14706042

    申请日：2015-05-07

    Applicant: I.G. BAUERHIN GMBH

    Inventor： Karl Lochmann ,  Dieter Barthel

    IPC: H05B1/02 ,  H05B3/26 ,  H05B3/34 ,  H05K1/02 ,  H05K1/11

    CPC classification number: H05B1/0236 ,  H05B3/26 ,  H05B3/34 ,  H05B2203/003 ,  H05B2203/016 ,  H05B2203/029 ,  H05K1/0212 ,  H05K1/0265 ,  H05K1/117 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10151

    Abstract: An apparatus for heating surfaces in the internal space of a motor vehicle comprises at least one heating element, having at least one heating conductor that forms an electrical heating circuit, and at least one carrier material, wherein the heating conductor has at least two HC terminal ends and the temperature acquisition element has at least two TA terminal ends. This apparatus for heating is characterized in that at least two of the HC and TA terminal ends are electrically connected to first HC terminal areas or first TA terminal areas of a printed circuit board and in that the printed circuit board has second HC terminal areas and second TA terminal areas, wherein the first HC terminal areas and the second HC terminal areas are at least in part connected to each other via first pcb traces and the first TA terminal areas and the second TA terminal areas via second pcb traces, wherein the first and the second pcb traces are part of the printed circuit board, and wherein the printed circuit board is arranged on, under or at the at least one carrier material.

    Abstract translation: 一种用于加热机动车辆的内部空间中的表面的装置包括至少一个加热元件，其具有形成电加热回路的至少一个加热导体和至少一个载体材料，其中加热导体具有至少两个HC端子 端部，并且温度采集元件具有至少两个TA终端。 该加热装置的特征在于，HC和TA终端中的至少两个电连接到印刷电路板的第一HC端子区域或第一TA端子区域，并且印刷电路板具有第二HC端子区域和第二HC端子区域 TA端子区域，其中第一HC端子区域和第二HC端子区域经由第一pcb迹线和经由第二pcb迹线的第一TA端子区域和第二TA端子区域至少部分地彼此连接，其中第一和 所述第二pcb迹线是所述印刷电路板的一部分，并且其中所述印刷电路板布置在所述至少一种载体材料的下方或下方。

    REDUCED THERMAL TRANSFER TO PELTIER COOLED FETS
    63.
    发明申请
    REDUCED THERMAL TRANSFER TO PELTIER COOLED FETS 有权
    减少热转移到冷凝的场效应晶体管

    公开(公告)号：US20150319880A1

    公开(公告)日：2015-11-05

    申请号：US14268276

    申请日：2014-05-02

    Applicant: Honeywell International Inc.

    Inventor： Peter Charles Strickland ,  Sergiy Borysenko ,  Bradley Jessup

    IPC: H05K7/20 ,  H05K3/06 ,  H05K1/02

    CPC classification number: H05K7/20 ,  H05K1/0204 ,  H05K1/0209 ,  H05K3/06 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10219 ,  Y10T29/49156 ,  Y10T29/49361

    Abstract: A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a circuit-region on the second surface of the substrate. The ground plane includes a patterned-region that is patterned with an array of holes. The circuitry is configured for use with the at least one device to be cooled. When a first side of the cooling device contacts the ground plane, and when the at least one device to be cooled contacts the circuitry, a reduced cross-sectional area of the patterned-region prevents heat from a second side of the cooling device from degrading performance of the at least one device.

    Abstract translation: 提供了一种与被配置为冷却至少一个装置的冷却装置一起使用的印刷电路板。 印刷电路板包括具有与第一表面相对的第一表面和第二表面的基板; 在衬底的第一表面上的接地平面，以及在衬底的第二表面上的电路区域中的电路。 接地平面包括图案化的具有孔阵列的图案区域。 电路被配置为与要冷却的至少一个设备一起使用。 当冷却装置的第一侧接触接地平面时，并且当待冷却的至少一个装置接触电路时，图案化区域的减小的横截面面积防止来自冷却装置的第二侧的热量降解 至少一个设备的性能。

    SUBSTRATE FOR LIGHT-EMITTING DIODE
    64.
    发明申请
    SUBSTRATE FOR LIGHT-EMITTING DIODE 有权
    用于发光二极管的基板

    公开(公告)号：US20150237708A1

    公开(公告)日：2015-08-20

    申请号：US14701730

    申请日：2015-05-01

    Applicant: NGK Insulators, Ltd.

    Inventor： Shinsuke YANO ,  Makoto TANI ,  Hirokazu NAKANISHI

    IPC: H05K1/02 ,  H05K1/05 ,  H01L33/48

    CPC classification number: H05K1/0203 ,  H01L33/486 ,  H01L33/62 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2933/0066 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0298 ,  H05K1/053 ,  H05K2201/062 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10416 ,  H05K2203/1126 ,  H01L2924/00

    Abstract: A substrate for a light-emitting diode comprising a metal base with a thickness of a predetermined value or more is constituted so that the thickness of a top conductor for an electrical connection with a light-emitting diode (LED) in a predetermined range falls within a predetermined range and the thickness of an insulation layer which electrically insulates the metal base and the top conductor and the thickness of the top conductor meet a predetermined relation. Thereby, a substrate for a light-emitting diode which can show a high heat dissipation capacity by achieving a low thermal resistance as the total thermal resistance of the whole substrate without reducing an insulation reliability and high-humidity reliability of the substrate is provided.

    Abstract translation: 包括具有预定值或更大厚度的金属基底的发光二极管的基板被构成为使得与预定范围内的发光二极管（LED）的电连接的顶部导体的厚度在其内 电绝缘金属基底和顶部导体的绝缘层和顶部导体的厚度的预定范围和厚度满足预定关系。 因此，提供了一种通过在不降低基板的绝缘可靠性和高湿度可靠性的情况下实现作为整个基板的总热阻的低热阻而能够显示高散热能力的发光二极管的基板。

    Buffer layer to enhance photo and/or laser sintering
    66.
    发明授权
    Buffer layer to enhance photo and/or laser sintering 有权
    缓冲层可增强照片和/或激光烧结

    公开(公告)号：US08647979B2

    公开(公告)日：2014-02-11

    申请号：US13260893

    申请日：2010-03-26

    Applicant: Zvi Yaniv ,  Mohshi Yang ,  Peter B. Laxton

    Inventor： Zvi Yaniv ,  Mohshi Yang ,  Peter B. Laxton

    IPC: H01L23/48

    CPC classification number: H05K1/092 ,  B22F3/105 ,  B22F7/04 ,  B22F2998/00 ,  B23K26/32 ,  B23K26/34 ,  B23K35/0244 ,  B23K2101/36 ,  B23K2103/50 ,  B23K2103/52 ,  H01L21/268 ,  H01L21/288 ,  H01L21/4867 ,  H01L21/76877 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K3/10 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/4664 ,  H05K2201/062 ,  H05K2203/107 ,  Y10T29/49156 ,  B22F1/0018 ,  H01L2924/00

    Abstract: Conductive lines are deposited on a substrate to produce traces for conducting electricity between electronic components. A patterned metal layer is formed on the substrate, and then a layer of material having a low thermal conductivity is coated over the patterned metal layer and the substrate. Vias are formed through the layer of material having the low thermal conductivity thereby exposing portions of the patterned metal layer. A film of conductive ink is then coated over the layer of material having the low thermal conductivity and into the vias to thereby coat the portions of the patterned metal layer, and then sintered. The film of conductive ink coated over the portion of the patterned metal layer does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity may be a polymer, such as polyimide.

    Abstract translation: 导电线被沉积在衬底上以产生用于在电子部件之间传导电力的迹线。 在基板上形成图案化的金属层，然后在图案化的金属层和基板上涂覆具有低热导率的材料层。 通过具有低热导率的材料层形成通孔，从而暴露图案化金属层的部分。 然后将导电油墨膜涂覆在具有低热导率的材料层上并进入通孔中，从而涂覆图案化金属层的部分，然后烧结。 涂覆在图案化金属层的部分上的导电油墨的膜不像在具有低热导率的材料层上涂覆导电油墨的膜那样吸收与烧结相同的能量。 具有低热导率的材料层可以是聚合物，例如聚酰亚胺。

    Electronic circuit unit
    68.
    发明授权
    Electronic circuit unit 有权
    电子电路单元

    公开(公告)号：US08242385B2

    公开(公告)日：2012-08-14

    申请号：US12826276

    申请日：2010-06-29

    Applicant: Satoshi Kawai

    Inventor： Satoshi Kawai

    IPC: H05K1/11

    CPC classification number: H05K1/116 ,  H05K1/0224 ,  H05K1/113 ,  H05K3/429 ,  H05K2201/062 ,  H05K2201/0723 ,  H05K2201/093 ,  H05K2201/09454 ,  H05K2201/0969 ,  H05K2201/09709

    Abstract: An electronic circuit unit includes a multi-layer substrate in which high frequency circuits are provided on two different layers and a ground layer is formed between the two layers, and grounding lands connected to peripheral conductive members through connection bars formed on a plurality of layers of the multi-layer substrate. The grounding lands are connected to each other through a via hole and conducted to the ground layer, and the connection bars protruding radially outward from at least two grounding lands provided on different layers are arranged in different directions with respect to a circumferential direction such that the connection bars do not overlap each other along a thickness direction of the multi-layer substrate.

    Abstract translation: 电子电路单元包括多层基板，其中高频电路设置在两个不同的层上，并且在两层之间形成接地层，以及通过形成在多个层上的连接条连接到外围导电构件的接地区 多层基板。 接地平台通过通孔相互连接并传导到接地层，并且从设置在不同层上的至少两个接地台径向向外突出的连接杆相对于圆周方向布置在不同的方向上，使得 连接条不沿着多层基板的厚度方向彼此重叠。

    Micro heat flux sensor array
    69.
    发明授权
    Micro heat flux sensor array 有权
    微型热通量传感器阵列

    公开(公告)号：US08104952B2

    公开(公告)日：2012-01-31

    申请号：US12659212

    申请日：2010-03-01

    Applicant: Jae-Wook Yoo ,  Yun-Hyeok Im

    Inventor： Jae-Wook Yoo ,  Yun-Hyeok Im

    IPC: G01K17/00

    CPC classification number: G01K17/20 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/09036 ,  H05K2201/10151

    Abstract: Provided is a micro heat flux sensor array having reduced heat resistance. A micro heat flux sensor array may include a substrate, a plurality of first sensors formed on a first side of the substrate, and a plurality of second sensors formed on a second side of the substrate. Each of the plurality of first and second sensors may include a first wiring pattern layer of a first conductive material, a second wiring pattern layer of a second conductive material contacting the first wiring pattern layer, and an insulating layer in contact with the first and second wiring patterns.

    Abstract translation: 提供具有降低的耐热性的微型热通量传感器阵列。 微型热通量传感器阵列可以包括衬底，形成在衬底的第一侧上的多个第一传感器和形成在衬底的第二侧上的多个第二传感器。 多个第一传感器和第二传感器中的每一个可以包括第一导电材料的第一布线图案层，与第一布线图案层接触的第二导电材料的第二布线图案层和与第一和第二传感器接触的绝缘层 接线方式

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