Method of manufacturing a substrate structure
    64.
    发明授权
    Method of manufacturing a substrate structure 有权
    制造衬底结构的方法

    公开(公告)号:US08377506B2

    公开(公告)日:2013-02-19

    申请号:US12574350

    申请日:2009-10-06

    Applicant: Chih-Cheng Lee

    Inventor: Chih-Cheng Lee

    Abstract: A substrate structure is provided. The substrate structure includes a substrate, a first insulation layer, a conductive part, a second insulation layer, a seed layer and a conductive layer. The substrate has a first circuit pattern layer and a second circuit pattern layer, which are located on two opposite surfaces of the substrate respectively. The first insulation layer formed on the first circuit pattern layer has a first insulation hole, which exposes a first opening in the outer surface of the first insulation layer. The conductive part formed on the first insulation hole for electrically connecting with a chip is enclosed by the edge of the first opening. The second insulation layer formed on the second circuit pattern layer has a second insulation hole in which the seed layer is formed. The conductive layer is formed on the seed layer for electrically connecting with a circuit board.

    Abstract translation: 提供了基板结构。 基板结构包括基板,第一绝缘层,导电部件,第二绝缘层,种子层和导电层。 衬底具有分别位于衬底的两个相对表面上的第一电路图案层和第二电路图案层。 形成在第一电路图案层上的第一绝缘层具有第一绝缘孔,其暴露第一绝缘层的外表面中的第一开口。 形成在与芯片电连接的第一绝缘孔上的导电部分被第一开口的边缘包围。 形成在第二电路图案层上的第二绝缘层具有形成种子层的第二绝缘孔。 导电层形成在种子层上,用于与电路板电连接。

    Integrated method for high-density interconnection of electronic components through stretchable interconnects
    65.
    发明授权
    Integrated method for high-density interconnection of electronic components through stretchable interconnects 失效
    电子元件通过可伸缩互连实现高密度互连的集成方法

    公开(公告)号:US08349727B2

    公开(公告)日:2013-01-08

    申请号:US13083111

    申请日:2011-04-08

    Abstract: Stretchable multi-chip modules (SMCMs) are capable of withstanding large mechanical deformations and conforming to curved surfaces. These SMCMs may find their utilities in elastic consumer electronics such as elastic displays, skin-like electronic sensors, etc. In particular, stretchable neural implants provide improved performances as to cause less mechanical stress and thus fewer traumas to surrounding soft tissues. Such SMCMs usually comprise of various electronic components attached to or embedded in a polydimethylsiloxane (PDMS) substrate and wired through stretchable interconnects. However, reliably and compactly connecting the electronic components to PDMS-based stretchable interconnects is very challenging. This invention describes an integrated method for high-density interconnection of electronic components through stretchable interconnects in an SMCM. This invention has applications in high-density SMCMs, as well as high-density stretchable/conformable neural interfaces.

    Abstract translation: 可伸缩的多芯片模块(SMCM)能够承受大的机械变形并符合曲面。 这些SMCM可以在诸如弹性显示器,皮肤样电子传感器等的弹性消费电子产品中发现它们的用途。特别地,可拉伸的神经植入物提供改善的性能,从而导致较少的机械应力,从而减少周围软组织的创伤。 这样的SMCM通常包括连接到或嵌入在聚二甲基硅氧烷(PDMS)衬底中并通过可拉伸互连线布线的各种电子部件。 然而,将电子元件可靠且紧凑地连接到基于PDMS的可拉伸互连是非常具有挑战性的。 本发明描述了一种用于通过SMCM中的可伸缩互连实现电子部件的高密度互连的集成方法。 本发明可应用于高密度SMCM,以及高密度可伸缩/神经接口。

    MULTILAYER PRINTED WIRING BOARD
    69.
    发明申请
    MULTILAYER PRINTED WIRING BOARD 有权
    多层印刷接线板

    公开(公告)号:US20120302010A1

    公开(公告)日:2012-11-29

    申请号:US13561247

    申请日:2012-07-30

    Abstract: A method for manufacturing a printed wiring board includes forming an uncalcined layer containing a raw ceramic material on a first metal layer, firing the uncalcined layer formed on the first metal layer such that a high dielectric constant layer having a ceramic body calcined in a sheet form is formed on the first metal layer, forming a second metal layer on the high dielectric constant layer on the opposite side of the high dielectric constant layer with respect to the first metal layer such that a layered capacitor having the high dielectric constant layer and first and second layer electrodes sandwiching the high dielectric constant layer is formed, and disposing the layered capacitor in a main body.

    Abstract translation: 一种制造印刷电路板的方法包括在第一金属层上形成含有原料陶瓷材料的未煅烧层,焙烧形成在第一金属层上的未煅烧层,使得具有以片状形式煅烧的陶瓷体的高介电常数层 形成在第一金属层上,相对于第一金属层在高介电常数层的相对侧的高介电常数层上形成第二金属层,使得具有高介电常数层的层状电容器和第一金属层 形成夹着高介电常数层的第二层电极,并将层叠电容器配置在主体中。

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