公开(公告)号：US20090211785A1

公开(公告)日：2009-08-27

申请号：US12034829

申请日：2008-02-21

Applicant: J. Thomas Lovskog

Inventor： J. Thomas Lovskog

IPC: H05K1/00

CPC classification number: H05K1/0266 ,  H05K3/4611 ,  H05K2201/0919 ,  H05K2201/093 ,  H05K2201/09781 ,  H05K2201/09927 ,  H05K2201/09936

Abstract: A multilayer printed circuit board may include traces that are printed on selected layers of the board so that the traces extend to the edge of the corresponding layer. When the layers are assembled together, the ends of the traces may be viewable on a side of the printed circuit board. The traces may be arranged to convey information. For example, trace ends may be readable as one or more binary words, as alphanumeric characters or as a bar code.

Abstract translation: 多层印刷电路板可以包括印刷在板的选定层上的迹线，使得迹线延伸到相应层的边缘。 当这些层组装在一起时，迹线的端部可以在印刷电路板的一侧可见。 迹线可以被布置成传送信息。 例如，跟踪结束可以作为一个或多个二进制字，字母数字字符或条形码读取。

公开(公告)号：US07549591B2

公开(公告)日：2009-06-23

申请号：US11395262

申请日：2006-04-03

Applicant: Allen Lubow

Inventor： Allen Lubow

IPC: G06K19/06

CPC classification number: G06K19/08 ,  G06K19/06009 ,  G06K19/06018 ,  G06K19/07749 ,  G06K19/07769 ,  G06K19/083 ,  H05K1/0266 ,  H05K1/165 ,  H05K2201/09781 ,  H05K2201/09927 ,  H05K2201/09936 ,  H05K2201/10098

Abstract: A communication system is provided that includes both an electromagnetic (“EM”) communication device and an optical communication device including at least a machine readable symbol where at least a portion of the EM communication device and at least a portion of the machine readable symbol are formed from the same material. This material may be, for example, a conductable ink or a conductable foil. If desired, the EM communication device may include an antenna where at least a portion of the antenna includes at least a portion of the machine readable symbol.

Abstract translation: 提供了一种通信系统，其包括电磁（“EM”）通信设备和至少包括机器可读符号的光通信设备，其中EM通信设备的至少一部分和机器可读符号的至少一部分是 由相同的材料形成。 该材料可以是例如可导电油墨或可导电箔。 如果需要，EM通信设备可以包括天线，其中天线的至少一部分包括机器可读符号的至少一部分。

公开(公告)号：US20080304243A1

公开(公告)日：2008-12-11

申请号：US12120304

申请日：2008-05-14

Applicant: Ching-Jen Wang

Inventor： Ching-Jen Wang

IPC: H05K7/02

CPC classification number: H05K1/0256 ,  H05K1/0237 ,  H05K1/0266 ,  H05K1/181 ,  H05K3/28 ,  H05K2201/09236 ,  H05K2201/09936

Abstract: A circuit board includes a plurality of conductive layers, a plurality of insulating layers, a telecommunication network connection port and a modem card processing module. A high voltage signal line is laid out at one of the conductive layers. The insulating layers are disposed between each of the conducting layers, respectively. The telecommunication network connection port is disposed on the conductive layers and is electrically connected to one end of the high voltage signal line. The modem card processing module is disposed on the conductive layers and is electrically connected to the other end of the high voltage signal line.

Abstract translation: 电路板包括多个导电层，多个绝缘层，电信网络连接端口和调制解调器卡处理模块。 高电压信号线布置在导电层之一处。 绝缘层分别设置在每个导电层之间。 电信网络连接端口设置在导电层上并与高压信号线的一端电连接。 调制解调器卡处理模块设置在导电层上并与高电压信号线的另一端电连接。

公开(公告)号：US20080210604A1

公开(公告)日：2008-09-04

申请号：US12109877

申请日：2008-04-25

Applicant: Kenichiro Suetsugu ,  Shunji Hibino ,  Masato Hirano ,  Atsushi Yamaguchi ,  Mikiya Nakata

Inventor： Kenichiro Suetsugu ,  Shunji Hibino ,  Masato Hirano ,  Atsushi Yamaguchi ,  Mikiya Nakata

IPC: B07C5/34 ,  H05K1/00 ,  H05K5/00

CPC classification number: C22B25/06 ,  C22B13/00 ,  H01H2009/0077 ,  H05K1/0266 ,  H05K1/18 ,  H05K3/3463 ,  H05K13/0465 ,  H05K2201/09936 ,  H05K2203/178 ,  Y02P10/214 ,  Y02P10/228 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/49819 ,  Y10T29/49821 ,  Y10T29/49822

Abstract: The disclosure provides an article having a circuit mounted with parts characterized by comprising an electronic part soldered with a lead free solder and having an identification marking indicating no inclusion of lead and an electrical appliance including the same. The present invention also provides a recycling method of wastes of the same. The present invention can offer an article having a circuit mounted with parts and an electrical appliance including the same both of which facilitate identification whether lead which is poisonous to human body is contained or not.

Abstract translation: 本公开提供了一种具有电路的物品，其具有部件，其特征在于包括用无铅焊料焊接的电子部件，并且具有指示不包括引线的识别标记和包括其的电器。 本发明还提供了一种废物的回收方法。 本发明可以提供具有安装有部件的电路和包括该电路的电器的物品，两者都有助于识别是否含有对人体有毒的铅。

公开(公告)号：US20080121413A1

公开(公告)日：2008-05-29

申请号：US11986849

申请日：2007-11-26

Applicant: Sergio E. Cardona ,  Jerry Apodaca

Inventor： Sergio E. Cardona ,  Jerry Apodaca

IPC: H05K1/00 ,  H01R43/00

CPC classification number: H05K1/0269 ,  H05K3/28 ,  H05K2201/0989 ,  H05K2201/09936 ,  Y10T29/49117

Abstract: A printed circuit board. The novel printed circuit board includes a substrate, a layer of conductive material disposed on the substrate, and a solder mask layer disposed on the conductive layer, the solder mask layer including cutouts shaped as reference text and/or art. The conductive layer is etched to form traces for connecting electronic components to be mounted on the board in a desired pattern to form an electrical circuit and may include pads and lands to which the components are to be soldered. The solder mask layer is made from a material that resists wetting by solder and also includes cutouts in areas where the components are to be soldered to the conductive layer. The reference text and/or art includes readable information for assembling, testing, and/or repairing the circuit board, such as component part numbers, reference designators, pin one identifiers, component outlines, and test point identifiers.

Abstract translation: 印刷电路板。 新颖的印刷电路板包括基板，设置在基板上的导电材料层和设置在导电层上的焊料掩模层，焊接掩模层包括形状为参考文字和/或艺术的切口。 导电层被蚀刻以形成用于将要安装在板上的电子部件以期望的图案形成的迹线，以形成电路，并且可以包括焊料和焊盘，焊料和焊盘要焊接到部件上。 焊接掩模层由阻止焊料润湿的材料制成，并且还包括在要将组件焊接到导电层的区域中的切口。 参考文本和/或艺术品包括用于组装，测试和/或修复电路板的可读信息，例如组件部件号，参考指示符，引脚一标识符，组件轮廓和测试点标识符。

公开(公告)号：US20080002375A1

公开(公告)日：2008-01-03

申请号：US11767664

申请日：2007-06-25

Applicant: Mitsuhiro Nozaki ,  Hiroshi Isono ,  Hiroshi Usui

Inventor： Mitsuhiro Nozaki ,  Hiroshi Isono ,  Hiroshi Usui

IPC: H05K1/02 ,  H05K3/30

CPC classification number: H05K1/118 ,  H05K1/0266 ,  H05K1/189 ,  H05K2201/09936 ,  H05K2201/10083 ,  H05K2201/10446 ,  Y10T29/49005 ,  Y10T29/49124 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T428/24942 ,  Y10T428/24975 ,  Y10T428/265

Abstract: For providing a flexible printed circuit board in which the distance between each of plural wiring patterns is a desired distance by cutting the flexible printed circuit board having plural wiring patterns, plural wiring patterns are formed so as to extend on the surface of an electrically insulative base film, and each of the plural wiring patterns is formed so as to include a portion where the distance between each of them is narrowed along the extending direction of the base film.

Abstract translation: 为了提供柔性印刷电路板，其中通过切割具有多个布线图案的柔性印刷电路板，其中多个布线图案中的每一个之间的距离是期望的距离，形成多个布线图案以在电绝缘基底的表面上延伸 膜，并且多个布线图案中的每一个形成为包括其中每个之间的距离沿着基膜的延伸方向变窄的部分。

公开(公告)号：US20080002165A1

公开(公告)日：2008-01-03

申请号：US11667665

申请日：2005-11-04

Applicant: Yoshiharu Sasaki

Inventor： Yoshiharu Sasaki

IPC: G03B27/42 ,  G03F7/20 ,  H05K3/00 ,  H05K3/06

CPC classification number: G03F7/161 ,  G03F7/2012 ,  H05K1/0266 ,  H05K3/0073 ,  H05K3/0082 ,  H05K3/064 ,  H05K2201/09936 ,  H05K2203/163

Abstract: Printed circuit boards having patterns of uniform line width can be produced. A lamination apparatus superposes a resist layer on a substrate. Further, the substrate is exposed to light carrying information representing lamination date/time. An exposure apparatus reads out the lamination date/time information before performing exposure and judges whether passage time from the lamination to the current time is within the range of predetermined hold time. If the judgment is NO, the exposure apparatus issues a warning to notify an operator that the passage time from the lamination to the current time is not within the range of the predetermined hold time. The operator may remove the substrate from the exposure apparatus because it is impossible to form a pattern of desirable line width on the substrate.

Abstract translation: 可以制造具有均匀线宽图案的印刷电路板。 层压装置将抗蚀剂层叠置在基板上。 此外，将基板暴露于携带表示层压日期/时间的信息的光。 曝光装置在进行曝光之前读取层叠日期/时间信息，判断从层叠到当前时间的通过时间是否在规定的保持时间的范围内。 如果判断为否，则曝光装置发出警告，通知操作者从层叠到当前时间的通过时间不在预定保持时间的范围内。 操作者可以从曝光设备移除基板，因为不可能在基板上形成所需的线宽的图案。

公开(公告)号：US20070295531A1

公开(公告)日：2007-12-27

申请号：US11614187

申请日：2006-12-21

Applicant: Shu-Luan Chan ,  Chi-Chih Huang ,  Shuo-Hsun Chang

Inventor： Shu-Luan Chan ,  Chi-Chih Huang ,  Shuo-Hsun Chang

IPC: H05K1/03

CPC classification number: H05K1/0266 ,  H05K1/0269 ,  H05K3/0035 ,  H05K3/28 ,  H05K3/4602 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/0959 ,  H05K2201/09854 ,  H05K2201/09936

Abstract: A substrate structure is disclosed. The substrate structure includes a core substrate, an interconnection portion and a solder mask; herein the core substrate includes a top surface and a bottom surface opposite the top surface. A circuit pattern is disposed on the top surface. The interconnection portion is disposed on the top surface; herein the interconnection portion includes a surface dielectric layer and a surface circuit layer disposed thereon. The surface circuit layer is electrically connected to the circuit pattern, and the surface dielectric layer includes at least a hole that is not covered with the surface circuit layer. The solder mask is disposed on the interconnection portion; herein the solder mask includes an indentation disposed above the hole. Besides, a method for manufacturing the substrate structure is disclosed.

Abstract translation: 公开了一种衬底结构。 基板结构包括芯基板，互连部分和焊接掩模; 这里，芯基板包括顶表面和与顶表面相对的底表面。 电路图案设置在顶表面上。 互连部分设置在顶表面上; 这里，互连部分包括表面电介质层和设置在其上的表面电路层。 表面电路层与电路图案电连接，表面电介质层至少包括未被表面电路层覆盖的孔。 焊接掩模设置在互连部分上; 这里的焊料掩模包括设置在孔上方的凹陷。 此外，公开了一种用于制造衬底结构的方法。

公开(公告)号：US20070279846A1

公开(公告)日：2007-12-06

申请号：US11757716

申请日：2007-06-04

Applicant: Yen-Po Yu

Inventor： Yen-Po Yu

IPC: H05K5/00

CPC classification number: H05K1/18 ,  H05K1/0266 ,  H05K1/0269 ,  H05K2201/044 ,  H05K2201/09936 ,  H05K2201/10106 ,  H05K2201/10189

Abstract: A motherboard including a circuit board, a connecting device and an illumination device is provided. The connecting device and the illumination device are disposed on the circuit board, The illumination device includes at least one lighting element. The lighting element and the connecting device are disposed on the same side of the circuit board.

Abstract translation: 提供了包括电路板，连接装置和照明装置的主板。 连接装置和照明装置设置在电路板上。照明装置包括至少一个照明元件。 照明元件和连接装置设置在电路板的同一侧。

公开(公告)号：US20070263862A1

公开(公告)日：2007-11-15

申请号：US11465814

申请日：2006-08-21

Applicant: Tzyy-Jang Tseng ,  Cheng-Po Yu ,  Chi-Min Chang ,  Cheng-Hung Yu

Inventor： Tzyy-Jang Tseng ,  Cheng-Po Yu ,  Chi-Min Chang ,  Cheng-Hung Yu

IPC: G09C3/08

CPC classification number: H05K1/0269 ,  H05K3/0097 ,  H05K3/225 ,  H05K2201/09936 ,  H05K2203/013

Abstract: A manufacturing process and an apparatus for printing imprint on defective board are provided. An automatic printing device is used for replacing operator, so as to reduce manpower and to increase the correctness and veracity of defect mark printing. The manufacturing process includes the following steps: first, an image sensor captures an image of a defect mark and transmits the image to a processing unit for data processing. Next, the data is compared, and an inkjet head is notified of the correct printing position to print ink on the customer identification mark of the printed circuit board.

Abstract translation: 提供了制造工艺和用于在缺陷板上印刷压印的装置。 使用自动打印装置来代替操作者，以减少人力和提高缺陷标记打印的正确性和真实性。 制造过程包括以下步骤：首先，图像传感器捕获缺陷标记的图像，并将图像发送到用于数据处理的处理单元。 接下来，比较数据，并且通知喷墨头正确的打印位置以在印刷电路板的客户识别标记上印刷墨水。