公开(公告)号：US09590154B2

公开(公告)日：2017-03-07

申请号：US14459621

申请日：2014-08-14

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Yasuyoshi Horikawa

IPC: H01L33/60 ,  H01L33/62 ,  H05K1/02 ,  H05K1/18 ,  H01L25/16 ,  H05K1/05

CPC classification number: H01L33/60 ,  H01L24/45 ,  H01L25/167 ,  H01L33/62 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0274 ,  H05K1/056 ,  H05K1/187 ,  H05K1/188 ,  H05K2201/0376 ,  H05K2201/10106 ,  H05K2201/10174 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A wiring substrate includes an insulation layer, separated wires formed on a first surface of the insulation layer, a first plating layer formed on a first surface of each of the wires, a reflection layer including a first opening that exposes at least a portion of the first plating layer as a connection pad, and an electronic component mounted on a second surface of each of the wires, which is located on an opposite side of the first surface of each of the wires. The electronic component is embedded in the insulation layer.

Abstract translation: 布线基板包括绝缘层，形成在绝缘层的第一表面上的分离线，形成在每条导线的第一表面上的第一镀层，包括第一开口的反射层，该第一开口暴露至少一部分 第一电镀层作为连接焊盘，以及电子部件，其安装在每个电线的第二表面上，该电子部件位于每个电线的第一表面的相对侧上。 电子部件嵌入绝缘层。

公开(公告)号：US09472685B2

公开(公告)日：2016-10-18

申请号：US14247118

申请日：2014-04-07

Applicant: Joshua D. Kaggie

Inventor： Joshua D. Kaggie

IPC: G05F3/04 ,  H01L29/861 ,  H03H7/38

CPC classification number: H01L29/861 ,  G05F3/04 ,  H03H7/38 ,  H03H7/383 ,  H05K2201/10174

Abstract: The present invention is a method by which diodes are connecting in a circuit such that they are more robust. The method involves placing two diodes of opposite directions in parallel and applying a DC bias such that a forward diode may then handle higher than normal voltages and a reverse diode provides a failsafe in the event of a reverse bias.

Abstract translation: 本发明是二极管连接在电路中使得它们更坚固的方法。 该方法包括并联放置两个相反方向的二极管并施加一个直流偏压，使得正向二极管然后可以处理高于正常电压，反向二极管在反向偏压的情况下提供故障保护。

公开(公告)号：US09461549B2

公开(公告)日：2016-10-04

申请号：US14339859

申请日：2014-07-24

Applicant: DENSO CORPORATION

Inventor： Yuuki Takemoto ,  Katsutoyo Misawa ,  Yuuichi Handa ,  Syotarou Yamasaki ,  Syuji Kurauchi ,  Kenta Hatakenaka

IPC: H01F5/00 ,  H02M3/00 ,  H02M3/335 ,  B60L11/00 ,  H02M3/337 ,  H05K1/18 ,  H05K1/02

CPC classification number: H02M3/33507 ,  B60L11/00 ,  B60L15/007 ,  B60L2210/10 ,  H01F5/00 ,  H02M3/00 ,  H02M3/337 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10515 ,  Y02T10/645 ,  Y02T10/7216

Abstract: An electric power source device has a transformer, a primary-side semiconductor module, a secondary-side semiconductor module, a secondary-side electrical component, a base plate and a circuit substrate on which substrate-side electrical components are mounted. The primary-side semiconductor module has a larger exterior size than the secondary-side electrical component. The primary-side semiconductor module and the secondary-side electrical component form a stacked section. In the stacked section, the secondary-side electrical component is stacked, in a vertical direction, i.e. a direction of a normal line of a mounting surface of the base plate, on the primary-side semiconductor module. The primary-side semiconductor module is directly mounted on the mounting surface. At least a part of the substrate-side electrical components is arranged inside of the primary-side semiconductor module in a horizontal direction, and inside of a second surface of the stacked section toward the mounting surface along the normal line.

Abstract translation: 电源装置具有安装有基板侧电气部件的变压器，初级侧半导体模块，二次侧半导体模块，二次侧电气部件，基板以及电路基板。 初级侧半导体模块具有比次级侧电气部件更大的外部尺寸。 初级侧半导体模块和次级侧电气部件形成堆叠部。 在堆叠部分中，次级侧电气元件在初级侧半导体模块上沿垂直方向，即基板的安装表面的法线方向堆叠。 初级侧半导体模块直接安装在安装面上。 基板侧电气部件的至少一部分在水平方向配置在一次侧半导体模块的内部，在堆叠部的第二面的内侧沿着法线配置在安装面上。

公开(公告)号：US20160219689A1

公开(公告)日：2016-07-28

申请号：US15091564

申请日：2016-04-05

Applicant: FUJI ELECTRIC CO., LTD.

Inventor： Hideyo NAKAMURA ,  Masafumi HORIO

IPC: H05K1/02 ,  H05K1/03 ,  H01L25/065 ,  H05K1/18

CPC classification number: H05K1/025 ,  H01L25/0655 ,  H01L25/072 ,  H01L25/162 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/73265 ,  H02M7/003 ,  H02M7/487 ,  H05K1/0306 ,  H05K1/181 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/1053 ,  H01L2924/00014

Abstract: A semiconductor device includes a first circuit board on which a first switching element and a first diode connected in inverse parallel are mounted, a second circuit board on which a second switching element and a second diode connected in inverse parallel are mounted, a printed circuit board disposed opposite the first circuit board and the second circuit board, and a plurality of conductive posts which electrically connect the first switching element, the second switching element, the first diode, the second diode, the first circuit board, or the second circuit board and metal layers of the printed circuit board. The first switching element and the second switching element are connected in anti-series to form a bidirectional switch.

Abstract translation: 一种半导体器件包括：第一电路板，其上安装有逆并联连接的第一开关元件和第一二极管;第二电路板，其上安装有并联连接的第二开关元件和第二二极管，印刷电路板 与第一电路板和第二电路板相对设置的多个导电柱，将第一开关元件，第二开关元件，第一二极管，第二二极管，第一电路板或第二电路板电连接的多个导电柱，以及 印刷电路板的金属层。 第一开关元件和第二开关元件反串联连接以形成双向开关。

公开(公告)号：US20160212853A1

公开(公告)日：2016-07-21

申请号：US14996059

申请日：2016-01-14

Applicant: HYUNDAI MOBIS CO., LTD

Inventor： Hyun Woo Kang

IPC: H05K1/18 ,  H05K1/05

CPC classification number: H05K1/181 ,  F21S41/141 ,  F21S41/192 ,  F21S43/14 ,  F21S43/195 ,  F21Y2103/10 ,  H01L25/167 ,  H01L2924/0002 ,  H05K1/05 ,  H05K1/056 ,  H05K2201/10022 ,  H05K2201/10106 ,  H05K2201/10174 ,  H05K2201/10189 ,  H01L2924/00

Abstract: Disclosed is a light emitting diode (LED) package for a lamp of a vehicle. The LED package includes a printed circuit board (PCB) which includes a metal layer, an insulating layer formed on the metal layer, and an electric wiring layer formed on the insulating layer; an LED circuit unit which includes an LED chip mounted on the electric wiring layer; and a connector which is mounted on the electric wiring layer to be connected with the LED chip. Area and thickness of the printed circuit board and position of the LED chip on the printed circuit board can be determined based on thermal resistance of the LED chip and thermal resistance of the PCB.

Abstract translation: 公开了一种用于车辆灯的发光二极管（LED）封装。 LED封装包括印刷电路板（PCB），其包括金属层，形成在金属层上的绝缘层和形成在绝缘层上的电布线层; LED电路单元，其包括安装在所述电布线层上的LED芯片; 以及安装在与LED芯片连接的电布线层上的连接器。 印刷电路板的面积和厚度以及印刷电路板上的LED芯片的位置可以基于LED芯片的热阻和PCB的热阻来确定。

公开(公告)号：US09380698B1

公开(公告)日：2016-06-28

申请号：US14644183

申请日：2015-03-10

Applicant: VivaLnk Limited (Cayman Islands)

Inventor： Jiang Li ,  Junfeng Mei

IPC: G06K7/08 ,  G06K19/02 ,  G06K19/06 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14 ,  A61B5/00 ,  H04B1/3827 ,  H04B5/00

CPC classification number: H05K1/0283 ,  A61B5/6823 ,  A61B5/6824 ,  A61B5/6825 ,  A61B5/6828 ,  A61B5/6829 ,  A61B5/6833 ,  A61B2562/046 ,  H04B1/385 ,  H04B2001/3866 ,  H05K1/148 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/30 ,  H05K2201/0133 ,  H05K2201/09027 ,  H05K2201/09263 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10098 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/1316

Abstract: An electronic patch includes a foldable circuit layer that includes a foldable network that includes comprising: a plurality of electronic modules comprising a plurality of electronic components, and flexible straps that connect the plurality of electronic modules, wherein the flexible straps comprise conductive circuit that are conductively connected with the plurality of electronic components in the plurality of electronic modules. Neighboring electronic modules can undulate in opposite directions normal to the foldable circuit layer. The electronic patch also includes an elastic layer that encloses the foldable circuit layer.

公开(公告)号：US20160111403A1

公开(公告)日：2016-04-21

申请号：US14984092

申请日：2015-12-30

Applicant: FREESCALE SEMICONDUCTOR INC.

Inventor： WENG F. YAP

IPC: H01L25/16 ,  H05K1/18 ,  H01L23/31 ,  H01L25/065 ,  H01L23/495

CPC classification number: H01L25/16 ,  H01L21/56 ,  H01L21/561 ,  H01L21/568 ,  H01L23/12 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49589 ,  H01L23/49816 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/165 ,  H01L25/18 ,  H01L2224/12105 ,  H01L2224/24175 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/1029 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/00014 ,  H01L2924/1203 ,  H01L2924/12042 ,  H01L2924/1205 ,  H01L2924/1206 ,  H01L2924/1207 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/181 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10174 ,  Y10T29/41 ,  Y10T29/49126 ,  Y10T29/49139 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/82 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Embodiments of a method for fabricating System-in-Packages (SiPs) are provided, as are embodiments of a SiP. In one embodiment, the method includes producing a first package including a first molded package body having a sidewall. A first leadframe is embedded within the first molded package body and having a first leadframe lead exposed through the sidewall. In certain implementations, a semiconductor die may also be encapsulated within the first molded package body. A Surface Mount Device (SMD) is mounted to the sidewall of the first molded package body such that a first terminal of the SMD is in ohmic contact with the first leadframe lead exposed through the sidewall.

公开(公告)号：US09107275B2

公开(公告)日：2015-08-11

申请号：US13503772

申请日：2010-11-02

Applicant: Shlomo Magdassi ,  Michael Grouchko ,  Michael Layani

Inventor： Shlomo Magdassi ,  Michael Grouchko ,  Michael Layani

IPC: H01L31/0224 ,  H05B33/28 ,  C23C4/18 ,  C23C26/00 ,  H01L31/18 ,  C23C16/513 ,  B05D3/10 ,  B05D5/06 ,  B05D5/12 ,  H01L33/42

CPC classification number: H05B33/28 ,  B05D3/107 ,  B05D5/061 ,  B05D5/12 ,  C23C4/18 ,  C23C16/513 ,  C23C26/00 ,  H01B1/02 ,  H01B1/026 ,  H01B1/10 ,  H01L31/022466 ,  H01L31/1884 ,  H01L33/42 ,  H01L2924/0002 ,  H01L2933/0016 ,  H05K1/0225 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0313 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/092 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0302 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/035 ,  H05K2201/0391 ,  H05K2201/0969 ,  H05K2201/10053 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2203/0545 ,  H05K2203/1173 ,  H05K2203/125 ,  Y02E10/50 ,  Y10T428/24273 ,  Y10T428/24331 ,  Y10T428/249978 ,  Y10T428/249979 ,  H01L2924/00

Abstract: The invention provides processes for the manufacture of conductive transparent films and electronic or optoelectronic devices comprising same.

Abstract translation: 本发明提供了用于制造导电透明膜的方法和包括其的电子或光电子器件。

公开(公告)号：US20150163912A1

公开(公告)日：2015-06-11

申请号：US14097868

申请日：2013-12-05

Applicant: Corning MobileAccess Ltd.

Inventor： Rami Reuven ,  Yaakov Shaul

IPC: H05K1/14 ,  H05K3/30 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K1/144 ,  H05K1/117 ,  H05K1/181 ,  H05K1/184 ,  H05K3/303 ,  H05K3/32 ,  H05K3/3405 ,  H05K3/3415 ,  H05K3/403 ,  H05K2201/10174 ,  Y10T29/49133

Abstract: In a printed circuit board having stacked units, a protruding portion of a first of the units can extend across and past at least one of the peripheral edges of a non-conductive substrate of a second of the units. The protruding portion of the first unit may include at least a portion of a conductor of the first unit, and the portion of the conductor of the first unit may be configured for being connected to an electronic device. The electronic device may include conductive leads or legs protruding from a body of the electronic device so that a gap is defined between the legs, and the protruding portion of the first unit may be positioned in the gap. Circuit board conductors on opposite sides of the protruding portion may be respectively connected to the legs, such as by soldering.

Abstract translation: 在具有堆叠单元的印刷电路板中，第一单元的突出部分可以延伸穿过第二单元的非导电衬底的至少一个外围边缘并且经过其中的至少一个。 第一单元的突出部分可以包括第一单元的导体的至少一部分，并且第一单元的导体的部分可以被配置为连接到电子设备。 电子设备可以包括从电子设备的主体突出的导电引线或腿，使得在腿之间限定间隙，并且第一单元的突出部分可以位于间隙中。 突出部分的相对侧上的电路板导体可以分别通过焊接连接到腿部。

公开(公告)号：US20150098191A1

公开(公告)日：2015-04-09

申请号：US14507779

申请日：2014-10-06

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H05K1/02 ,  H05K1/11 ,  H05K7/20

CPC classification number: H01L21/4882 ,  H01L21/4803 ,  H01L23/3672 ,  H01L23/3675 ,  H01L23/3738 ,  H01L31/02327 ,  H01L31/024 ,  H01L33/483 ,  H01L33/58 ,  H01L33/641 ,  H01L33/642 ,  H01L2924/0002 ,  H01L2933/0075 ,  H01S5/02469 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/049 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09827 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10151 ,  H05K2201/10174 ,  H01L2924/00

Abstract: Embodiments of a silicon heat-dissipation package for compact electronic devices are described. In one aspect, a device includes first and second silicon cover plates. The first silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The second silicon cover plate has a first primary side and a second primary side opposite the first primary side thereof. The first primary side of the second silicon cover plate includes an indentation configured to accommodate an electronic device therein. The first primary side of the second silicon cover plate is configured to mate with the second primary side of the first silicon cover plate when the first silicon cover plate and the second silicon cover plate are joined together with the electronic device sandwiched therebetween.

Abstract translation: 描述了用于紧凑型电子设备的硅散热封装的实施例。 在一个方面，一种装置包括第一和第二硅覆盖板。 第一硅覆盖板具有与第一初级侧相对的第一初级侧和第二初级侧。 第二硅覆盖板具有与第一初级侧相对的第一初级侧和第二初级侧。 第二硅覆盖板的第一初级侧包括构造成在其中容纳电子器件的凹陷。 当第一硅覆盖板和第二硅覆盖板与夹在其间的电子器件接合在一起时，第二硅覆盖板的第一初级侧被配置为与第一硅覆盖板的第二初级侧配合。