公开(公告)号：US20140377996A1

公开(公告)日：2014-12-25

申请号：US14320428

申请日：2014-06-30

Applicant: Pulse Electronics, Inc.

Inventor： Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

IPC: H01R13/66 ,  H01R13/7193 ,  H01R12/70

CPC classification number: H01R13/66 ,  H01R12/70 ,  H01R13/6658 ,  H01R13/719 ,  H01R13/7193 ,  H01R24/64 ,  H05K1/0233 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10568 ,  H05K2201/2036

Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.

Abstract translation: 可安装在印刷电路板上的电连接器。 在一个实施例中，电连接器包括绝缘壳体，该绝缘壳体包括一个或多个电子部件，与电子部件信号通信的多个电导体，并且适于与插头和多个终端进行信号通信，该多个终端与一个或多个 电子元器件。 在一个方面，多个端子适于与印刷电路板上的一个或多个外部安装的电子部件接合，从而过滤在电导体和印刷电路板之间通过的信号，其中外部安装的电子部件安装在 电连接器。 还公开了上述电连接器的制造方法和业务方法。

公开(公告)号：US20140374149A1

公开(公告)日：2014-12-25

申请号：US14303790

申请日：2014-06-13

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Masaki SANADA ,  Syota MIKI

IPC: H05K1/11

CPC classification number: H05K3/4007 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/5384 ,  H01L24/16 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2224/81191 ,  H01L2224/81444 ,  H01L2224/8182 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/113 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/0338 ,  H05K2201/10515 ,  H05K2201/1053 ,  H01L2924/00014 ,  H01L2924/014

Abstract: A pad structure includes an insulating layer; a first metal layer formed on one surface of the insulating layer and including an intermetallic compound layer of copper and tin or a tin layer; and a second metal layer formed on the first metal layer and including a gold layer.

Abstract translation: 衬垫结构包括绝缘层; 形成在所述绝缘层的一个表面上并且包括铜和锡或锡层的金属间化合物层的第一金属层; 以及形成在第一金属层上并且包括金层的第二金属层。

公开(公告)号：US08916900B2

公开(公告)日：2014-12-23

申请号：US13318504

申请日：2010-04-28

Applicant: Georg Bogner ,  Stefan Gruber

Inventor： Georg Bogner ,  Stefan Gruber

IPC: H01L33/26 ,  H05K1/18 ,  H01L25/16

CPC classification number: H05K1/183 ,  H01L25/167 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/181 ,  H05K2201/10106 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10977 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014

Abstract: An optoelectronic module includes a radiation-emitting semiconductor component, an electrical component and a carrier substrate. The carrier substrate includes a top and a bottom, wherein first electrical connections are arranged on the bottom and second electrical connections are arranged on the top. The electrical component is arranged on the top of the carrier substrate and is electrically conductively connected with the first electrical connections. The radiation-emitting semiconductor component is arranged on the side of the electrical component remote from the carrier substrate. The radiation-emitting semiconductor component furthermore includes conductive structures electrically conductively connected with the second electrical connections.

Abstract translation: 光电子模块包括辐射发射半导体部件，电子部件和载体基板。 载体基板包括顶部和底部，其中第一电连接布置在底部上，而第二电连接布置在顶部。 电气部件布置在载体基板的顶部上并与第一电连接导电连接。 辐射发射半导体部件布置在远离载体基板的电子部件侧。 辐射发射半导体部件还包括与第二电连接导电连接的导电结构。

公开(公告)号：US08908384B2

公开(公告)日：2014-12-09

申请号：US13491378

申请日：2012-06-07

Applicant: Morgan Johnson ,  Frederick G. Weiss

Inventor： Morgan Johnson ,  Frederick G. Weiss

IPC: H05K7/00 ,  H05K1/02 ,  H01L23/32 ,  G06F1/32 ,  H05K1/18 ,  H05K1/14

CPC classification number: G06F13/16 ,  G06F1/32 ,  G06F13/4068 ,  G11C5/04 ,  H01L23/32 ,  H01L23/49838 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/0237 ,  H05K1/0243 ,  H05K1/0296 ,  H05K1/111 ,  H05K1/115 ,  H05K1/141 ,  H05K1/147 ,  H05K1/181 ,  H05K1/189 ,  H05K2201/095 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10522 ,  Y02D10/151 ,  Y10T29/4913 ,  H01L2924/00

Abstract: A computing device has a motherboard circuit substrate having at least one layer of electrical interconnects and a socket arranged to receive a main processor for the computing device, the socket electrically coupled to at least a portion of the layer of electrical interconnects, wherein the circuit substrate has no memory interconnects.

Abstract translation: 计算设备具有具有至少一层电互连层的母板电路基板和布置成接收用于计算设备的主处理器的插座，该插座电耦合到电互连层的至少一部分，其中电路基板 没有内存互连。

公开(公告)号：US20140300001A1

公开(公告)日：2014-10-09

申请号：US14068628

申请日：2013-10-31

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seong Ryul Choi ,  Suk Chang HONG ,  Sang Kab PARK ,  Kwang Seop YOUM

IPC: H05K1/18 ,  H01L23/498 ,  H05K3/00 ,  H05K3/10

CPC classification number: H05K1/183 ,  H01L21/486 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5389 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/112 ,  H05K3/4697 ,  H05K2201/10492 ,  H05K2201/10515 ,  H05K2201/10734 ,  Y10T29/49165 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A printed circuit board, a manufacturing method thereof, and a semiconductor package including the printed circuit board. The printed circuit board includes a base substrate including a plurality of circuit patterns, a cavity formed above the base substrate, a pad embedded in the base substrate and being exposed through the substrate bottom surface of the cavity, and an electronic component mounted in the cavity and electrically connected to the pad. A cavity having a predetermined depth is formed in a base substrate of a printed circuit board so as to mount an electronic component therein, such that a gap between an upper semiconductor package and a lower semiconductor package may be obtained even if pitches between the balls are decreased for high density and high performance of the upper semiconductor package in the manufacturing of a semiconductor package having a PoP structure.

Abstract translation: 印刷电路板及其制造方法以及包括印刷电路板的半导体封装。 印刷电路板包括：基底基板，其包括多个电路图案，形成在基底基板上的空腔，嵌入基底基板中并通过空腔的基板底表面露出的垫，以及安装在腔体中的电子部件 并且电连接到所述垫。 具有预定深度的空腔形成在印刷电路板的基底基板中，以便在其中安装电子元件，使得即使球之间的间距是可以获得上半导体封装和下半导体封装之间的间隙 在具有PoP结构的半导体封装的制造中，上半导体封装的高密度和高性能降低。

公开(公告)号：US08824165B2

公开(公告)日：2014-09-02

申请号：US13185573

申请日：2011-07-19

Applicant: Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

Inventor： Da-Jung Chen ,  Chau-Chun Wen ,  Chun-Tiao Liu

IPC: H05K5/02

CPC classification number: H05K1/181 ,  H01F27/027 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K3/3421 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10924 ,  Y02P70/611 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: An electronic package structure including at least one first electronic element, a second electronic element and a lead frame is provided. The second electronic element includes a body having a cavity. The first electronic element is disposed in the cavity. The lead frame has a plurality of leads. Each of the leads has a first end and a second end. The first end of at least one of the leads extends to the cavity to electrically connect the first electronic element.

Abstract translation: 提供了包括至少一个第一电子元件，第二电子元件和引线框架的电子封装结构。 第二电子元件包括具有空腔的主体。 第一电子元件设置在空腔中。 引线框架具有多个引线。 每个引线具有第一端和第二端。 至少一个引线的第一端延伸到腔体以电连接第一电子元件。

公开(公告)号：US20140211439A1

公开(公告)日：2014-07-31

申请号：US13900758

申请日：2013-05-23

Applicant: Texas Instruments Incorporated

Inventor： Mark Allen Gerber

IPC: H05K1/18 ,  H05K3/32

CPC classification number: H05K7/02 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/49117 ,  Y10T29/49139 ,  H01L2924/00

Abstract: A circuit assembly includes a substrate having a substrate electrical circuit, opposite top and bottom substrate surfaces, and a substrate hole extending through the substrate. The circuit assembly also includes a discrete component assembly electrically connected to the substrate electrical circuit and a support member attached to the discrete component. At least a portion of the discrete component is physically mounted in the substrate hole.

Abstract translation: 电路组件包括具有衬底电路，相对的顶部和底部衬底表面以及延伸穿过衬底的衬底孔的衬底。 电路组件还包括电连接到基板电路的分立组件组件和附接到分立组件的支撑构件。 离散部件的至少一部分物理地安装在基板孔中。

公开(公告)号：US20140185256A1

公开(公告)日：2014-07-03

申请号：US14199327

申请日：2014-03-06

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Nobuaki Ogawa ,  Yoshihito Otsubo

IPC: H05K1/11 ,  H05K3/46 ,  H05K3/28 ,  H05K3/30

CPC classification number: H05K1/11 ,  H01L21/4853 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/5389 ,  H01L23/552 ,  H01L25/0652 ,  H01L25/0655 ,  H01L2224/16225 ,  H01L2924/1531 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/181 ,  H05K3/284 ,  H05K3/303 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4644 ,  H05K2201/0715 ,  H05K2201/10242 ,  H05K2201/1031 ,  H05K2201/10515 ,  H05K2203/1316 ,  Y02P70/611 ,  Y10T29/49146

Abstract: When forming a module 100 having a configuration in which a column-shaped connection terminal 11, which forms an interlayer connection conductor, and an electronic component 102 are mounted on a wiring substrate 101 and sealed with a resin, the column-shaped connection terminal 11 which has a substantially T-shaped cross section and in which a first end portion has a larger diameter than a second end portion is prepared (the preparation step), an electronic component 102 is mounted on one main surface of the wiring substrate 101 and the connection terminal 11 is mounted on the one main surface in such a manner that the second end portion of the connection terminal 11 having a smaller diameter is connected to the wiring substrate 101 (the mounting step), and the electronic component 102 and the connection terminal 11 are sealed with a resin layer 103 (the sealing step).

Abstract translation: 当形成具有其中形成层间连接导体的柱状连接端子11和电子部件102的结构的模块100安装在布线基板101上并用树脂密封时，柱形连接端子11 其具有大致T形的横截面并且其中第一端部具有比第二端部更大的直径（制备步骤），电子部件102安装在布线基板101的一个主表面上，并且 连接端子11安装在一个主表面上，使得具有较小直径的连接端子11的第二端部连接到布线基板101（安装步骤），并且电子部件102和连接端子 11用树脂层103密封（密封步骤）。

公开(公告)号：US08764493B2

公开(公告)日：2014-07-01

申请号：US13437856

申请日：2012-04-02

Applicant: Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

Inventor： Victor H. Renteria ,  Aurelio J. Gutierrez ,  William Mahlerbe ,  Gary L. Hurd ,  Russell L. Machado

IPC: H01R13/66

CPC classification number: H01R13/66 ,  H01R12/70 ,  H01R13/6658 ,  H01R13/719 ,  H01R13/7193 ,  H01R24/64 ,  H05K1/0233 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/10537 ,  H05K2201/10568 ,  H05K2201/2036

Abstract: An electrical connector mountable on a printed circuit board. In one embodiment, the electrical connector comprises an insulative housing comprising one or more electronic components, a plurality of electrical conductors in signal communication with the electronic components and adapted to interface with a plug and a plurality of terminals in signal communication with the one or more electronic components. In one aspect, the plurality of terminals are adapted to interface with one or more externally mounted electronic components on the printed circuit board thereby filtering signals passing between the electrical conductors and the printed circuit board, with the externally mounted electronic components mounted within the footprint of the electrical connector. Methods of manufacture for the aforementioned electrical connector and business methods are also disclosed.

Abstract translation: 可安装在印刷电路板上的电连接器。 在一个实施例中，电连接器包括绝缘壳体，该绝缘壳体包括一个或多个电子部件，与电子部件信号通信的多个电导体，并且适于与插头和多个终端进行信号通信，该多个终端与一个或多个 电子元器件。 在一个方面，多个端子适于与印刷电路板上的一个或多个外部安装的电子部件接合，从而过滤在电导体和印刷电路板之间通过的信号，其中外部安装的电子部件安装在 电连接器。 还公开了上述电连接器的制造方法和业务方法。

公开(公告)号：US20140159233A1

公开(公告)日：2014-06-12

申请号：US13708461

申请日：2012-12-07

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

Inventor： Chun-Cheng Lin ,  Hsiu-Jen Lin ,  Cheng-Ting Chen ,  Wei-Yu Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L23/498 ,  H01L23/00

CPC classification number: H01L24/16 ,  H01L23/49816 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/17 ,  H01L24/48 ,  H01L24/81 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/074 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/056 ,  H01L2224/05611 ,  H01L2224/05616 ,  H01L2224/06181 ,  H01L2224/111 ,  H01L2224/11334 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13216 ,  H01L2224/13224 ,  H01L2224/13239 ,  H01L2224/13244 ,  H01L2224/13247 ,  H01L2224/13255 ,  H01L2224/13284 ,  H01L2224/13309 ,  H01L2224/13317 ,  H01L2224/13318 ,  H01L2224/1332 ,  H01L2224/13338 ,  H01L2224/13349 ,  H01L2224/13355 ,  H01L2224/1336 ,  H01L2224/13366 ,  H01L2224/137 ,  H01L2224/13809 ,  H01L2224/13817 ,  H01L2224/13818 ,  H01L2224/1382 ,  H01L2224/13838 ,  H01L2224/13849 ,  H01L2224/13855 ,  H01L2224/1386 ,  H01L2224/13866 ,  H01L2224/14181 ,  H01L2224/1601 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/16225 ,  H01L2224/16506 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/384 ,  H05K3/3436 ,  H05K3/4015 ,  H05K2201/10515 ,  Y02P70/613 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/01032 ,  H01L2924/01015 ,  H01L2924/01058 ,  H01L2924/00012 ,  H01L2924/0105 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A package on package structure includes a first substrate having a first region and a second region, a bump formed on the first region of the first substrate, a first semiconductor die bonded to the second region of the first substrate, and a semiconductor die package bonded to the first substrate. The bump includes a metallic structure and a plurality of minor elements dispersed in the metallic structure. The semiconductor die package includes a connector bonded to the bump, and the first semiconductor die is between the semiconductor die package and the first substrate.

Abstract translation: 封装结构包括具有第一区域和第二区域的第一基板，形成在第一基板的第一区域上的凸块，与第一基板的第二区域接合的第一半导体管芯，以及半导体管芯封装 到第一底物。 凸块包括分散在金属结构中的金属结构和多个次要元件。 半导体管芯封装包括接合到凸块的连接器，并且第一半导体管芯位于半导体管芯封装和第一衬底之间。