公开(公告)号：US20080227312A1

公开(公告)日：2008-09-18

申请号：US12076014

申请日：2008-03-12

Applicant: Eiji Ogata ,  Kazunori Omori ,  Koichi Namimatsu ,  Kazunari Fukagawa

Inventor： Eiji Ogata ,  Kazunori Omori ,  Koichi Namimatsu ,  Kazunari Fukagawa

IPC: H01R12/06

CPC classification number: H05K3/4046 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/09645 ,  H05K2201/1059

Abstract: A first wiring pattern formed on a first layer of a multilayer wiring substrate, a second wiring pattern formed on a layer different from the first layer on which the first wiring pattern is formed, a penetration hole penetrating the front surface and the back surface of the substrate, and a penetration hole penetrating a front surface and a back surface of the substrate; and a fitting connector having a conductor part on a side surface inscribed in the penetration hole and fitting into the penetration hole are provided. The first wiring pattern and the second wiring pattern are exposed from the internal surface of the penetration hole, and the fitting connector connects a first end part of the conductor part and a second end part with an exposed part of the first wiring pattern and an exposed part of the second wiring pattern, respectively.

Abstract translation: 形成在多层布线基板的第一层上的第一布线图案，形成在与形成有第一布线图案的第一层不同的层上的第二布线图案，穿透第一布线图案的前表面和后表面的穿透孔 基板和穿透基板的前表面和后表面的穿透孔; 以及配合连接器，其具有位于贯通孔内侧的嵌合于贯通孔的侧面的导体部。 第一布线图案和第二布线图案从穿孔的内表面露出，并且嵌合连接器将导体部的第一端部和第二端部与第一布线图案的露出部分连接， 分别是第二布线图案的一部分。

公开(公告)号：US07425139B2

公开(公告)日：2008-09-16

申请号：US11554805

申请日：2006-10-31

Applicant: Cheng-Chia Hsu ,  Teng-Kang Chang ,  Yu-Cheng Pan

Inventor： Cheng-Chia Hsu ,  Teng-Kang Chang ,  Yu-Cheng Pan

IPC: H01R12/00

CPC classification number: H01R33/09 ,  H05K3/308 ,  H05K2201/10113 ,  H05K2201/10401 ,  H05K2201/1059 ,  Y10S439/915

Abstract: In a fixation structure for fixing a lamp on a printed circuit board (PCB), a connection end of the lamp is received within a connection hole of the PCB and a sleeve having approximately cone shape is disposed between the lamp and the PCB. When the connection end of the lamp is continuously inserted into the connection hole of the PCB, a contact area between the connection end and the connection hole is increased, thereby effectively enhancing a contact-and-on performance of the lamp and the PCB. Sleeves may be located on lamps leads or alternatively placed in the connection hole of the PCB.

Abstract translation: 在用于将灯固定在印刷电路板（PCB）上的固定结构中，灯的连接端被接收在PCB的连接孔内，并且具有近似锥形的套筒设置在灯和PCB之间。 当灯的连接端连续插入到PCB的连接孔中时，连接端和连接孔之间的接触面积增加，从而有效地提高了灯和PCB的接触性能。 套管可以位于灯头上，或者可以放置在PCB的连接孔中。

公开(公告)号：US20080220665A1

公开(公告)日：2008-09-11

申请号：US11715681

申请日：2007-03-08

Applicant: Christopher J. Darr ,  Peter P. Kowtun

Inventor： Christopher J. Darr ,  Peter P. Kowtun

IPC: H01R13/11

CPC classification number: H05K3/308 ,  H01H1/5805 ,  H01R12/58 ,  H01R12/592 ,  H01R12/65 ,  H05K3/222 ,  H05K2201/10053 ,  H05K2201/1059

Abstract: A self-contained power distribution device is provided having compliant pins for attachment to mating receptacles of a printed circuit board for use in a vehicle electrical system. An insulative body forms a housing. An electrical switching element is disposed within the housing. A plurality of non-coaxial terminal contacts extend from a lower planar surface of the housing. Each of the plurality of terminal contacts is substantially parallel to one another having exposed portions adapted to be received by the mating receptacles of a printed circuit board. The plurality of terminal contacts is in electrical communication with the switching element. The exposed portion of the plurality of terminal contacts each has a compliance feature that is resilient to deformation when received by the mating receptacles of the printed circuit board. An interference condition occurs between the compliance feature and the mating receptacles.

Abstract translation: 提供了一种独立的配电装置，其具有用于附接到用于车辆电气系统的印刷电路板的配合插座的适配销。 一个绝缘体组成一个住房。 电气开关元件设置在壳体内。 多个非同轴端子触头从壳体的下平面表面延伸。 多个端子触点中的每一个基本上彼此平行，具有适于由印刷电路板的配合插座接收的暴露部分。 多个端子触头与开关元件电连通。 多个端子触头的暴露部分各自具有柔性特征，当由印刷电路板的配合插座接收时，其具有弹性变形。 在顺应性特征和配合插座之间发生干扰状况。

公开(公告)号：US20080158830A1

公开(公告)日：2008-07-03

申请号：US11764331

申请日：2007-06-18

Applicant: Tsutomu TOMINAGA ,  Masahiro Kimata ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Tadayuki Fujimoto

Inventor： Tsutomu TOMINAGA ,  Masahiro Kimata ,  Takayuki Kifuku ,  Shuzo Akiyama ,  Tadayuki Fujimoto

IPC: H05K7/20

CPC classification number: H05K7/20509 ,  H01L2924/0002 ,  H05K3/308 ,  H05K3/32 ,  H05K3/328 ,  H05K7/20854 ,  H05K2201/10166 ,  H05K2201/10295 ,  H05K2201/105 ,  H05K2201/1059 ,  H05K2201/10962 ,  H01L2924/00

Abstract: An electronic control apparatus can be reduced in size and cost by eliminating certain component parts such as a power board, etc. The apparatus includes a housing, a heat sink, semiconductor switching elements having terminals and mounted on the heat sink, a circuit board arranged in opposition to the heat sink, conductive plates connecting between the circuit board and the semiconductor switching elements, and a cover receiving the semiconductor switching elements and the circuit board in cooperation with the heat sink. The conductive plates have the press-fit terminal portions press-fitted into the through holes in the circuit board, and the individual conductive plates are arranged along a lead-out direction in which the individual terminals of the semiconductor switching elements lead out, and are bonded to the individual terminals.

Abstract translation: 电子控制装置的尺寸和成本可以通过消除诸如电源板等的某些部件而减小。该装置包括壳体，散热器，具有端子并安装在散热器上的半导体开关元件，布置在电路板上的电路板 与散热器相对，连接在电路板和半导体开关元件之间的导电板，以及与散热器协作接收半导体开关元件和电路板的盖。 导电板的压配端子部分压配合到电路板的通孔中，并且各个导电板沿着半导体开关元件的各个端子引出的引出方向排列，并且是 绑定到各个终端。

公开(公告)号：US20080144301A1

公开(公告)日：2008-06-19

申请号：US11867280

申请日：2007-10-04

Applicant: Ikuo Konishi

Inventor： Ikuo Konishi

IPC: H05K1/11

CPC classification number: H05K3/308 ,  H01R12/515 ,  H01R12/58 ,  H05K2201/10401 ,  H05K2201/1059 ,  H05K2201/10962

Abstract: A connecting terminal has an electrically-conductive ring surrounding a columnar space. Electrically-conductive elastic pieces extend from the electrically-conductive ring in the direction of the central axis of the columnar space. Electrically-conductive blades stand from the outer surfaces of the electrically-conductive elastic pieces. A lead terminal is received in the columnar space. The tip ends of the electrically-conductive elastic pieces are urged against the lead terminal. The lead terminal is prevented from withdrawing out of the through hole. Electric connection is established between the lead terminal and the elastic pieces. The blade or blades of the connecting terminal or terminals stick into the wall surface of the through hole. The connecting terminal is thus firmly held in the through hole. Electric connection is established between the blade or blades and the through hole. Electric connection is thus established between the lead terminal and the through hole.

Abstract translation: 连接端子具有围绕柱状空间的导电环。 导电弹性片从导电环沿柱状空间的中心轴线的方向延伸。 导电叶片从导电弹性片的外表面立起。 引线端子被接收在柱状空间中。 导电弹性片的前端被推靠在引线端子上。 引线端子被阻止从通孔中退出。 引线端子和弹性片之间建立电连接。 连接端子或端子的刀片或刀片粘入通孔的壁面。 因此，连接端子牢固地保持在通孔中。 在叶片或叶片与通孔之间建立电连接。 因此，在引线端子和通孔之间建立电连接。

公开(公告)号：US20080102663A1

公开(公告)日：2008-05-01

申请号：US11671707

申请日：2007-02-06

Applicant: Shuhei Sakai

Inventor： Shuhei Sakai

IPC: H01R13/648

CPC classification number: H01R12/7011 ,  H01R12/58 ,  H01R12/712 ,  H01R13/6594 ,  H05K1/0243 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2203/0195 ,  H05K2203/1446

Abstract: A shield plate arranged between a connector and a circuit board for covering and shielding parts of metal pins sticking out from the circuit board when a connector provided with a board mounting surface having a plurality of metal pins and a connector connection surface is mounted at an end of the circuit board, provided with an connector-engagement part, a shield part of the metal pins, a mounting part having press-fit pins for insertion, and support parts of the press-fit pins and flexible parts at a part between the shield part and the mounting part, the press-fit pins becoming vertical to the circuit board in the state with the engagement part engaged with the connector and the free end parts of the press-fit pins provisionally inserted into the engagement holes, thereby enabling the press-fit pins to be press-fit into the engagement holes all at once by a pushing action of the support parts.

Abstract translation: 一种屏蔽板，其布置在连接器和电路板之间，用于在设置有具有多个金属销和连接器连接表面的板安装表面的连接器安装在端部的情况下覆盖和屏蔽从电路板伸出的金属销的部分 设置有连接器接合部分，金属销的屏蔽部分，具有用于插入的压配销的安装部分，并且在屏蔽件之间的部分处支撑压配合销和柔性部件的部分 部分和安装部分，压配合销在接合部与连接器接合的状态下变得垂直于电路板，并且压配合销的自由端临时插入到接合孔中，从而使得压配合 - 通过支撑部件的推动动作一次压配合到接合孔中。

公开(公告)号：US20080003884A1

公开(公告)日：2008-01-03

申请号：US11480087

申请日：2006-06-30

Applicant: David Louis Spengler ,  Bill Pagano

Inventor： David Louis Spengler ,  Bill Pagano

IPC: H01R13/66

CPC classification number: H05K1/0268 ,  H05K3/306 ,  H05K3/42 ,  H05K2201/09627 ,  H05K2201/1059 ,  H05K2203/175

Abstract: An apparatus and associated method for analyzing a communications link between two components on a common PCB. The communications link has a pair of through-board conductors connected by a first conductive etching on one side of the PCB. The communications link further has second etchings on an opposite side of the PCB respectively connecting each of the through-board conductors to one of the components.

Abstract translation: 一种用于分析公共PCB上的两个组件之间的通信链路的装置和相关联的方法。 通信链路具有通过PCB的一侧上的第一导电蚀刻而连接的一对贯通板导体。 通信链路还在PCB的相对侧上具有第二蚀刻，其分别将每个贯通板导体连接到其中一个部件。

公开(公告)号：US20070252161A1

公开(公告)日：2007-11-01

申请号：US11691025

申请日：2007-03-26

Applicant: Michael Meis ,  Ellen Aeling ,  John David

Inventor： Michael Meis ,  Ellen Aeling ,  John David

IPC: H01L33/00

CPC classification number: H01L33/483 ,  F21V19/0025 ,  F21Y2115/10 ,  H01L33/642 ,  H01L33/648 ,  H05K1/183 ,  H05K1/184 ,  H05K3/107 ,  H05K2201/09036 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/1059

Abstract: An LED assembly may include a substrate, an elongate mounting structure that is formed in or on the substrate, and an LED that is mechanically secured to the elongate mounting structure. A light producing apparatus may include a substrate, an elongate mounting structure that may be formed in or on the substrate, and a plurality of LEDs that may be removably secured to the elongate mounting structure. A light producing array may include a substrate, a first elongate mounting structure that is formed in or on the substrate, and a second elongate mounting structure that is formed in or on the substrate. A first plurality of LEDs may be removably secured to the first elongate mounting structure. A second plurality of LEDs may be removably secured to the second elongate mounting structure.

Abstract translation: LED组件可以包括衬底，形成在衬底中或衬底上的细长安装结构，以及机械地固定到细长安装结构的LED。 发光装置可以包括基板，可以形成在基板中或基板上的细长安装结构，以及可拆卸地固定到细长安装结构的多个LED。 发光阵列可以包括衬底，形成在衬底中或衬底上的第一细长安装结构，以及形成在衬底中或衬底上的第二细长安装结构。 第一多个LED可以可拆卸地固定到第一细长安装结构。 第二多个LED可以可拆卸地固定到第二细长安装结构。

公开(公告)号：US07280372B2

公开(公告)日：2007-10-09

申请号：US10990280

申请日：2004-11-15

Applicant: Kevin P. Grundy ,  William F. Wiedemann ,  Joseph C. Fjelstad

Inventor： Kevin P. Grundy ,  William F. Wiedemann ,  Joseph C. Fjelstad

IPC: H05K1/11

CPC classification number: H05K3/3405 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2924/15311 ,  H01L2924/19107 ,  H01L2924/3011 ,  H05K1/183 ,  H05K3/308 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/4602 ,  H05K3/4697 ,  H05K2201/0919 ,  H05K2201/092 ,  H05K2201/09845 ,  H05K2201/10189 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10727 ,  H05K2201/10734 ,  H01L2924/00

Abstract: Disclosed are stair stepped PCB structures which provide high performance, direct path, via-less interconnections between various elements of an electronic interconnection structure including, among others, IC packages and connectors.

Abstract translation: 公开了楼梯级PCB结构，其提供包括IC封装和连接器在内的电子互连结构的各种元件之间的高性能，直接路径，无通孔互连。

公开(公告)号：US20070178729A1

公开(公告)日：2007-08-02

申请号：US11598759

申请日：2006-11-14

Applicant: Terukazu Ohtsuki

Inventor： Terukazu Ohtsuki

IPC: H01R13/648

CPC classification number: H05K1/141 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48463 ,  H01L2224/49175 ,  H01L2924/01004 ,  H01L2924/01029 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/325 ,  H05K3/3442 ,  H05K3/366 ,  H05K3/4015 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2203/1572 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Provided is an electronic circuit module using a board having no cavity and a method for efficiently fabricating it. Electronic components are mounted on the front face of a module board 1, and an LSI chip 5 is die-bonded on the bottom face thereof in a bare-chip state with gold wires 8. Around the LSI chip 5, metal blocks 9 made of copper are mounted by soldering. The LSI chip 5, the gold wires 8, and the metal blocks 9 provided on the bottom face of the module board 1 are sealed with resin 10 with a motherboard-facing face 9a of each metal block 9 and a face 18 thereof flush with the corresponding side face of the module board 1 exposed from the resin 10. These exposed portions serve as electrode terminals when the module 11 is soldered to a motherboard. The module board 1 is obtained by cutting a sheet circuit board into individual unit module boards 1.

Abstract translation: 提供一种使用不具有空腔的电路板的电子电路模块及其制造方法。 电子部件安装在模块板1的前表面，并且LSI芯片5以裸线状态与金线8在其底面上裸片接合。 在LSI芯片5周围，通过焊接安装由铜制成的金属块9。 设置在模块基板1的底面上的LSI芯片5，金线8和金属块9用树脂10密封，每个金属块9的母板对向面9a和其表面18与 从树脂10露出的模块板1的相应的侧面。 当模块11被焊接到母板上时，这些暴露部分用作电极端子。 模块板1通过将片状电路板切割成各个单元模块板1而获得。