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    Arrangement of pads and through-holes for semiconductor packages
    63.
    发明授权
    Arrangement of pads and through-holes for semiconductor packages 失效
    衬垫和半导体封装通孔的布置

    公开(公告)号：US5784262A

    公开(公告)日：1998-07-21

    申请号：US554111

    申请日：1995-11-06

    Applicant: John V. Sherman

    Inventor： John V. Sherman

    IPC: H01L23/28 ,  H05K1/11 ,  H05K3/34 ,  H05K3/42 ,  H05K7/06

    CPC classification number: H05K3/3436 ,  H05K1/114 ,  H01L2924/00013 ,  H05K2201/09227 ,  H05K2201/09418 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K3/429 ,  Y02P70/613

    Abstract: An arrangement of mounting pads on a substrate having segments, at least one of which has a plurality of mounting pads in a first row. Mounting pads of the first row are in connection with a corresponding offset through-hole oriented outwardly in the same general direction as a bisector definable for that segment, or oriented outwardly in the same general direction as a diagonal of the arrangement's outer shape. The segment defined can have a second and third row of mounting pads. The arrangement could include second, third, fourth, and so on, segments each with a plurality of mounting pads. Also included is an arrangement of Ball Grid Array (BGA) mounting pads on a circuit board for connection with electrical contacts of a BGA package, having: a first segment of a plurality of mounting pads in a first row with each mounting pad of the first row in connection with an offset through-hole oriented outwardly in the same general direction as a bisector definable for that first segment. More segments may be desired to accommodate a BGA package with a large number of leads. Additionally included, is a layer of a multi-layer circuit board having an arrangement of conductively-lined through-holes for electrical connection between layers. This arrangement has a first and second segment, each having a plurality of generally parallel rows of through-holes; the spacing between these two segments being generally greater than that between adjacent rows within either segment. The conductive lining of each through-hole is in connection with a mounting pad located on an outer side of the layer. Each through-hole is offset in an outwardly direction from its interconnected mounting pad.

    Abstract translation: 在具有段的衬底上的安装焊盘的布置，其中至少一个在第一行中具有多个安装焊盘。 第一排的安装垫与相对应的偏移通孔连接，该相对的偏移通孔在与该部分可定义的平分线相同的大致方向上向外定向，或者在与该布置的外部形状的对角线相同的大致方向上向外取向。 限定的段可以具有第二和第三排安装垫。 该装置可以包括具有多个安装垫的第二，第三，第四等等。 还包括在电路板上的用于与BGA封装的电触点连接的球栅阵列（BGA）安装焊盘的布置，其具有：第一行中的多个安装焊盘的第一段，每个安装焊盘为第一 与在与该第一段可定义的平分线相同的大致方向上向外定向的偏移通孔连接。 可能需要更多的段来容纳具有大量引线的BGA封装。 另外包括的是具有用于层之间电连接的导电排列的通孔布置的多层电路板层。 这种布置具有第一和第二段，每个段具有多个大致平行的通孔排; 这两个段之间的间距通常大于任一段内的相邻行之间的间隔。 每个通孔的导电衬里与位于该层的外侧上的安装衬垫连接。 每个通孔从其互连的安装垫向外偏移。

    Method and apparatus for forming solder balls and solder columns
    65.
    发明授权
    Method and apparatus for forming solder balls and solder columns 失效
    用于形成焊球和焊料柱的方法和装置

    公开(公告)号：US5542174A

    公开(公告)日：1996-08-06

    申请号：US307893

    申请日：1994-09-15

    Applicant: George W. Chiu

    Inventor： George W. Chiu

    IPC: B23K35/00 ,  B23K35/26 ,  H01L21/48 ,  H01L21/60 ,  H01L23/485 ,  H05K3/34

    CPC classification number: H05K3/3436 ,  B23K35/001 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  B23K35/26 ,  H01L2224/1308 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/10992 ,  H05K2203/0415 ,  H05K2203/043 ,  H05K2203/0435 ,  Y02P70/613 ,  Y10T29/49144

    Abstract: A method for forming solder balls and an apparatus and method for forming solder columns on the electrical contact pads of an electronic package in order to establish a more reliable electrical and mechanical connection between an electronic package and a printed circuit board. In one embodiment, solder balls are formed on the electrical contact pads of a package by placing solder cylinders over the electrical contact pads and then passing the package through a reflow furnace where the solder cylinders take the form of spheres and are wetted onto the pads. In a second embodiment, a laminated solder column is formed that is resistant to collapse during the manufacturing process. The laminated solder column comprises a solder cylinder being clad on its top and bottom surfaces with a solder material having a lower melting temperature than that of the center solder cylinder. When attaching the solder column to a package or a printed circuit board reflow temperatures are maintained above the melting temperature of the cladding material but below the melting temperature of the center solder cylinder such that the cladding is wetted onto the electrical contact pads of the package or printed circuit board while the center solder cylinder maintains its solid form.

    Abstract translation: 一种用于形成焊球的方法，以及用于在电子封装的电接触焊盘上形成焊料柱的装置和方法，以便在电子封装和印刷电路板之间建立更可靠的电气和机械连接。 在一个实施例中，通过将焊料圆柱放置在电接触焊盘上，然后使封装穿过回流焊炉，焊料圆筒呈球形并被润湿到焊盘上，在焊料的电接触焊盘上形成焊球。 在第二实施例中，形成层压的焊料柱，其在制造过程中耐塌陷。 层压焊料柱包括在其顶表面和底表面上包覆焊料圆筒的焊料料，其熔化温度低于中心焊料圆筒的熔化温度。 当将焊料柱连接到封装或印刷电路板时，回流温度保持在包层材料的熔化温度以上但低于中心焊料圆筒的熔化温度，使得包层被润湿到包装的电接触焊盘上，或者 印刷电路板，而中心焊锡圆筒保持其固体形式。

    Tin-zinc solder connection to a printed circuit board of the like
    66.
    发明授权
    Tin-zinc solder connection to a printed circuit board of the like 失效
    锡锌焊接到印刷电路板等

    公开(公告)号：US5390080A

    公开(公告)日：1995-02-14

    申请号：US57233

    申请日：1993-05-03

    Applicant: Cynthia M. Melton ,  Linda Weitzel

    Inventor： Cynthia M. Melton ,  Linda Weitzel

    IPC: B23K35/00 ,  B23K35/26 ,  H05K3/34 ,  H05K1/16

    CPC classification number: B23K35/007 ,  B23K35/262 ,  H05K3/3442 ,  H05K3/3463 ,  H05K2201/10636 ,  H05K2201/10992 ,  H05K2203/043 ,  Y02P70/611 ,  Y02P70/613

    Abstract: An electronic package comprises a component mounted on a substrate, such as a printed circuit board, by a solder connection that is based upon a tin alloy containing zinc. The connection is formed to copper faying surface on the substrate, and includes a first layer formed of a zinc-free tin metal bonded to the copper surface and a second layer formed of the tin-zinc solder alloy bonded to the first layer. The first layer provides a zinc-free barrier between the copper and the tin-zinc alloy to retard zinc migration to the copper interface that would otherwise result in dezincification of the solder alloy and reduce the mechanical properties of the connection.

    Abstract translation: 电子封装包括通过基于含有锌的锡合金的焊料连接而安装在诸如印刷电路板的基板上的部件。 该连接形成在基板上的铜合金表面上，并且包括由结合到铜表面的无锌锡金属形成的第一层和由与第一层结合的锡 - 锌焊料合金形成的第二层。 第一层在铜和锡 - 锌合金之间提供无锌屏障，以阻止锌迁移到铜界面，否则会导致焊料合金脱锌并降低连接的机械性能。

    Noncollapsing multisolder interconnection
    68.
    发明授权
    Noncollapsing multisolder interconnection 失效
    非聚合多金属互连

    公开(公告)号：US5233504A

    公开(公告)日：1993-08-03

    申请号：US919338

    申请日：1992-07-27

    Applicant: Cynthia M. Melton ,  Carl J. Raleigh ,  Steven Scheifers

    Inventor： Cynthia M. Melton ,  Carl J. Raleigh ,  Steven Scheifers

    IPC: H01L23/498 ,  H05K3/34

    CPC classification number: H01L23/49827 ,  H05K3/3436 ,  H05K3/3478 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K2201/10734 ,  H05K2201/10992 ,  Y02P70/613

    Abstract: An improved electrical component package comprises a component attached to a substrate by a plurality of multisolder interconnections. Each interconnection comprises a preformed spacer bump composed of a first solder alloy, preferably a lead-base tin alloy containing greater than 90 weight percent lead. The spacer bump is directly metallurgically bonded to a metallic electrical contact of the component and rests against a corresponding metallic electrical contact of the substrate, but is not bonded thereto. Each interconnection further comprises a sheath portion formed of a second compositionally distinct solder alloy having a liquidus temperature less than the first alloy solidus temperature. A preferred second solder is a tin-lead alloy comprising between about 30 and 50 weight percent lead and the balance tin or indium. The sheath is bonded to the spacer bump and to the substrate contact to complete attachment of the component to the substrate and preferably extends to the component contact, encasing the bump, to produce an interconnection having an hour glass configuration to reduce thermal fatigue stresses at the solder bonds to the contacts.

    Abstract translation: 改进的电子部件封装包括通过多个多金属互连连接到基板的部件。 每个互连包括由第一焊料合金构成的预制间隔凸块，优选含有大于90重量％铅的铅基锡合金。 间隔件凸块直接冶金结合到部件的金属电接触件上，并抵靠基板的对应的金属电接触件，但不与其结合。 每个互连还包括由液态温度小于第一合金固相线温度的第二组成不同的焊料合金形成的护套部分。 优选的第二焊料是锡铅合金，其包含约30至50重量％的铅和余量的锡或铟。 护套结合到间隔件凸块和衬底接触件以完成组件到衬底的附接，并且优选地延伸到组件接触件，包住凸块，以产生具有小时玻璃构造的互连，以减少在 焊接到触点。

    Electrical connecting member and electric circuit member
    69.
    发明授权
    Electrical connecting member and electric circuit member 失效
    电连接构件和电路构件

    公开(公告)号：US5174766A

    公开(公告)日：1992-12-29

    申请号：US810444

    申请日：1991-12-19

    Applicant: Tetsuo Yoshizawa ,  Susumu Kadokura

    Inventor： Tetsuo Yoshizawa ,  Susumu Kadokura

    IPC: H01R4/04 ,  H01R12/71 ,  H01R13/24 ,  H05K3/32

    CPC classification number: H01R12/714 ,  H05K3/321 ,  H01L2224/81101 ,  H01R13/2414 ,  H01R4/04 ,  H05K2201/0209 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10992 ,  H05K2203/135

    Abstract: An electrical connecting member comprising a holder made of electrically insulative material and a plurality of conductive members electrically insulated from each other and embedded in the holder and having ends exposed from the holder, and wherein a conductive adhesive layer eutectoidally formed from an adhesive resin solution including one or both of pulverized metal powder and metalized ceramic powder by electrophoresis method is disposed on the end of each conductive member exposed from one surface of the holder. A conductive adhesive layers and the other ends of the conductive members exposed from the other surface of the holder are flush with or protruded from the surfaces of the holder.

    Abstract translation: 一种电连接构件，包括由电绝缘材料制成的保持器和彼此电绝缘并且嵌入在保持器中并且具有从保持器露出的端部的多个导电构件，并且其中由粘合树脂溶液共晶形成的导电粘合剂层包括 通过电泳法将粉碎金属粉末和金属化陶瓷粉末中的一种或两种设置在从保持器的一个表面露出的每个导电构件的端部上。 从保持器的另一个表面露出的导电性粘合剂层和导电性构件的另一端与保持件的表面齐平或突出。

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