-
公开(公告)号:US11713964B1
公开(公告)日:2023-08-01
申请号:US17574055
申请日:2022-01-12
Applicant: Applied Materials Israel Ltd.
Inventor: David Goldovsky , Ido Almog , Ronny Barnea
IPC: G01B15/04 , H01J37/285 , H01J37/244 , H01J37/28
CPC classification number: G01B15/04 , H01J37/244 , H01J37/28 , H01J37/285
Abstract: Disclosed herein is a system for profiling holes in non-opaque samples. The system includes: (i) an e-beam source configured to project an e-beam into an inspection hole in a sample, such that a wall of the inspection hole is struck and a localized electron cloud is produced; (ii) a light sensing infrastructure configured to sense cathodoluminescent light, generated by the electron cloud; and (iii) a computational module configured to analyze the measured signal to obtain the probed depth at which the wall was struck. A lateral offset, and/or orientation, of the e-beam is controllable, so as to allow generating localized electron clouds at each of a plurality of depths inside the inspection hole, and thereby obtain information at least about a two-dimensional geometry of the inspection hole.
-
公开(公告)号:US20230238290A1
公开(公告)日:2023-07-27
申请号:US18152252
申请日:2023-01-10
Applicant: Hitachi High-Tech Corporation
Inventor: Naoaki KONDO , Yuki DOI , Atsushi MIYAMOTO , Hideki NAKAYAMA , Hirohiko KITSUKI
IPC: H01L21/66 , G06T7/13 , H01J37/28 , G01N21/956 , G01N21/95
CPC classification number: H01L22/12 , G06T7/13 , H01J37/28 , G01N21/95607 , G01N21/9503 , G06T2207/10061 , G06T2207/30148
Abstract: A defect observation method includes, as steps executed by a computer system, a first step of acquiring, as a bevel image, an image captured using defect candidate coordinates in a bevel portion as an imaging position by using a microscope or an imaging apparatus; and a second step of detecting a defect in the bevel image. The second step includes a step of determining whether there is at least one portion among a wafer edge, a wafer notch, and an orientation flat in the bevel image, a step of switching and selectively applying a defect detection scheme of detecting the defect from the bevel image from a plurality of schemes which are candidates based on a determination result, and a step of executing a process of detecting the defect from the bevel image in conformity with the switched scheme.
-
公开(公告)号:US20230238205A1
公开(公告)日:2023-07-27
申请号:US18130466
申请日:2023-04-04
Applicant: Hitachi High-Tech Corporation
Inventor: Masahiro FUKUTA , Kazuhiro HONDA
IPC: H01J37/073
CPC classification number: H01J37/073 , H01J37/28
Abstract: A charged particle source is provided that exhibits small energy dispersion for charged particle beams emitted under a high angular current density condition and allows stable acquisition of large charged particle currents even for a small light source diameter. The charged particle source has a spherical virtual cathode surface from which charged particles are emitted, and the virtual cathode surface for charged particles emitted from a first position on a tip end surface of an emitter and the virtual cathode surface for charged particles emitted from a second position on the tip end surface of the emitter match each other.
-
公开(公告)号:US20230230799A1
公开(公告)日:2023-07-20
申请号:US17928691
申请日:2020-07-14
Applicant: Hitachi High-Tech Corporation
Inventor: Yuta IMAI , Junichi KATANE
CPC classification number: H01J37/222 , H01J37/28 , H01J37/265 , H01J2237/226 , H01J2237/24578
Abstract: Provided is a sample image observation device including an SEM and a control system configured to control the SEM. An observation region of a sample is divided into a plurality of sections, and restoration processing is performed on an image which is acquired by irradiating each section with a sparse electron beam, based on scanning characteristics in the section. A reduction in quality of a restored image due to a beam irradiation position deviation caused by a scanning response is prevented and restoration with high accuracy and high throughput under a condition for preventing sample damage is possible.
-
75.
公开(公告)号:US20230230796A1
公开(公告)日:2023-07-20
申请号:US18009898
申请日:2020-07-03
Applicant: Hitachi High-Tech Corporation
Inventor: Tomohito NAKANO , Makoto SUZUKI , Yuzuru MIZUHARA , Ryota WATANABE
IPC: H01J37/141 , H01J37/28 , H01J37/21 , H01J37/153
CPC classification number: H01J37/141 , H01J37/28 , H01J37/21 , H01J37/153 , H01J2237/216
Abstract: This charged particle beam device comprises: a charged particle beam source that generates charged particle beams; an objective lens in which coil current is inputted to focus the charged particle beams on a sample; a control unit that controls the coil current; a hysteresis characteristics storage unit that stores hysteresis characteristics information of the objective lens; a history information storage unit that stores history information relating to the coil current; and an estimating unit that estimates the magnetic field generated by the objective lens based on the coil current, the history information, and the hysteresis characteristic information, and has a magnetic field correction unit that, when the absolute value of the change amount of the coil current is greater than a prescribed value, further adds to the magnetic field estimated by the estimating unit a correction value according to the coil current and its change amount, correcting the magnetic field generated by the objective lens.
-
公开(公告)号:US20230230209A1
公开(公告)日:2023-07-20
申请号:US18155289
申请日:2023-01-17
Applicant: Carl Zeiss Microscopy GmbH
Inventor: Manuel AMTHOR , Daniel Haase , Ralf Engelmann
CPC classification number: G06T5/002 , H01J37/28 , H01J37/222 , G06T2207/10061 , H01J2237/221
Abstract: A method can be used for sensing and processing image data for an object to be imaged. The object is scanned incompletely by virtue of regions (eB) of the object being sensed, where the sensed image regions (eB) alternate with non-sensed image regions (neB) of the object. Image data (rBD) of the non-sensed image regions (neB) are reconstructed on the basis of the sensed image data (eBD) of the sensed image regions (eB). A noise signal (N) of the sensed image data (eBD) of the sensed regions (eB) is ascertained and transferred to the reconstructed image data (rBD) of the non-sensed regions (neB), so that a user obtains a homogeneous visual impression in relation to the noise arising in the overall image data of the object visualized in a resultant overall image (rGBInv).
-
公开(公告)号:US11703468B2
公开(公告)日:2023-07-18
申请号:US17365832
申请日:2021-07-01
Applicant: FEI Company
Inventor: Oleksii Kaplenko , Jan Klusá{hacek over (c)}ek , Tomá{hacek over (s)} Tůma , Mykola Kaplenko , Ond{hacek over (r)}ej Machek
IPC: G01N23/2252 , G01N23/20 , G01N23/203 , G01N23/04 , G06N3/02 , G01N23/083 , H01J37/28
CPC classification number: G01N23/2252 , G01N23/04 , G01N23/083 , G01N23/203 , G01N23/20083 , G06N3/02 , G01N2223/072 , H01J37/28 , H01J2237/2807
Abstract: Method and system are disclosed for determining sample composition from spectral data acquired by a charged particle microscopy system. Chemical elements in a sample are identified by processing the spectral data with a trained neural network (NN). If the identified chemical elements not matching with a known elemental composition of the sample, the trained NN is retrained with the spectral data and the known elemental composition of the sample. The retrained NN can then be used to identify chemical elements within other samples.
-
公开(公告)号:US20230221112A1
公开(公告)日:2023-07-13
申请号:US17574055
申请日:2022-01-12
Applicant: Applied Materials Israel Ltd.
Inventor: David Goldovsky , Ido Almog , Ronny Barnea
IPC: G01B15/04 , H01J37/28 , H01J37/244 , H01J37/285
CPC classification number: G01B15/04 , H01J37/28 , H01J37/244 , H01J37/285
Abstract: Disclosed herein is a system for profiling holes in non-opaque samples. The system includes: (i) an e-beam source configured to project an e-beam into an inspection hole in a sample, such that a wall of the inspection hole is struck and a localized electron cloud is produced; (ii) a light sensing infrastructure configured to sense cathodoluminescent light, generated by the electron cloud; and (iii) a computational module configured to analyze the measured signal to obtain the probed depth at which the wall was struck. A lateral offset, and/or orientation, of the e-beam is controllable, so as to allow generating localized electron clouds at each of a plurality of depths inside the inspection hole, and thereby obtain information at least about a two-dimensional geometry of the inspection hole.
-
公开(公告)号:US11699567B2
公开(公告)日:2023-07-11
申请号:US17534865
申请日:2021-11-24
Applicant: JEOL Ltd.
Inventor: Takanori Murano
IPC: H01J37/28 , H01J37/244
CPC classification number: H01J37/28 , H01J37/244 , H01J2237/2446 , H01J2237/2801
Abstract: A mask member is provided at an entrance opening of a mirror unit. Of a first diffraction grating and a second diffraction grating, when the second diffraction grating is used, the mask member masks preceding mirrors. With this process, aberration caused by reflective X-ray is suppressed. When the first diffraction grating is used, the mask member does not function. Alternatively, the mask member and another mask member may be selectively used.
-
公开(公告)号:US20230215686A1
公开(公告)日:2023-07-06
申请号:US18181395
申请日:2023-03-09
Applicant: Carl Zeiss MultiSEM GmbH
Inventor: Dirk Zeidler , Gregor Dellemann , Gunther Scheunert
IPC: H01J37/244 , H01J37/28
CPC classification number: H01J37/244 , H01J37/28 , H01J2237/2443 , H01J2237/2445 , H01J2237/2446 , H01J2237/24495 , H01J2237/24578
Abstract: A method for operating a multi-beam particle beam microscope includes: scanning a multiplicity of particle beams over an object; directing electron beams emanating from impingement locations of the particle beams at the object onto an electron converter; detecting first signals generated by impinging electrons in the electron converter via a plurality of detection elements of a first detection system during a first time period; detecting second signals generated by impinging electrons in the electron converter via a plurality of detection elements of a second detection system during a second time period; and assigning to the impingement locations the signals which were detected via the detection elements of the first detection system during the first time period, for example on the basis of the detection signals which were detected via the detection elements of the second detection system during the second time period.
-
-
-
-
-
-
-
-
-