公开(公告)号：US08773856B2

公开(公告)日：2014-07-08

申请号：US13290382

申请日：2011-11-07

Applicant: James T. Petroski

Inventor： James T. Petroski

IPC: H05K7/20 ,  B32B37/12 ,  H05K1/18 ,  H05K1/02

CPC classification number: B32B37/12 ,  B32B2309/105 ,  B32B2313/04 ,  B32B2457/206 ,  H05K1/0201 ,  H05K1/0271 ,  H05K1/181 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T156/10

Abstract: An electronic device includes an electronic component with a mating surface. A thermal interface sheet is attached to the mating surface. A substrate carries the electronic device and includes a face. The electronic component is secured to the substrate with the thermal interface sheet positioned between the mating surface and the face. The mating surface is relatively less flat than the face and the mating surface is relatively smoother than the face.

Abstract translation: 电子设备包括具有配合表面的电子部件。 热界面片连接到配合表面。 基板承载电子设备并且包括面。 电子部件固定在基板上，热界面片位于配合表面和表面之间。 配合表面相对于表面相对较小，并且配合表面比面部相对平滑。

公开(公告)号：US20140174940A1

公开(公告)日：2014-06-26

申请号：US14179207

申请日：2014-02-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Chang Hyun LIM ,  Seog Moon CHOI ,  Sang Hyun SHIN ,  Young Ki LEE ,  Sung Keun PARK

IPC: H05K3/02

CPC classification number: H05K3/02 ,  H05K1/0201 ,  H05K1/053 ,  H05K3/0061 ,  H05K2201/062 ,  H05K2201/09881 ,  H05K2201/09972 ,  H05K2203/0315

Abstract: Embodiments of the invention provide a heat-dissipating substrate and a fabricating method of the heat-dissipating substrate. According to various embodiments, the heat-dissipating substrate includes a plating layer divided by a first insulator formed in a division area. A metal plate is formed on an upper surface of the plating layer and filled with a second insulator at a position corresponding to the division area, with an anodized layer formed on a surface of the metal plate. A circuit layer is formed on the anodized layer which is formed on an upper surface of the metal plate. The heat-dissipating substrate and fabricating method thereof achieves thermal isolation by a first insulator formed in a division area and a second insulator.

Abstract translation: 本发明的实施例提供散热基板和散热基板的制造方法。 根据各种实施例，散热基板包括由形成在分割区域中的第一绝缘体分隔的镀层。 金属板形成在镀层的上表面上，并且在对应于分割区域的位置处填充有第二绝缘体，阳极氧化层形成在金属板的表面上。 在形成在金属板的上表面上的阳极氧化层上形成电路层。 散热基板及其制造方法通过形成在分割区域和第二绝缘体中的第一绝缘体进行热隔离。

公开(公告)号：US20140160704A1

公开(公告)日：2014-06-12

申请号：US14179811

申请日：2014-02-13

Applicant: SMA Solar Technology AG

Inventor： Eberhard Janssen ,  Volker Marschang ,  Burkhard Roecher

IPC: H05K7/14 ,  H01G2/10

CPC classification number: H05K7/1417 ,  H01G2/06 ,  H01G2/106 ,  H01G2/14 ,  H02M7/003 ,  H05K1/0201 ,  H05K1/0215 ,  H05K1/0231 ,  H05K1/0254 ,  H05K1/0268 ,  H05K3/222 ,  H05K3/301 ,  H05K3/325 ,  H05K7/14 ,  H05K2201/049 ,  H05K2201/10015 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10409 ,  H05K2201/10454 ,  H05K2201/10492 ,  Y10T29/49004

Abstract: An electronic device includes a housing, a circuit board, a plurality of holders having mechanical connectors to the housing and to the circuit board and mechanically fixing the circuit board within the housing, and at least one capacitor having a first electrode, a second electrode and a dielectric arranged between the first and second electrodes. The first electrode is electrically connected to a contact on the circuit board, and the second electrode is electrically connected to the housing. The at least one capacitor is part of one of the plurality of holders; and the dielectric of the capacitor is part of a thermal insulation between the connectors to the circuit board and to the housing.

Abstract translation: 电子设备包括壳体，电路板，多个保持器，其具有到外壳和电路板的机械连接器，并将电路板机械地固定在壳体内;以及至少一个电容器，其具有第一电极，第二电极和 布置在第一和第二电极之间的电介质。 第一电极电连接到电路板上的触点，并且第二电极电连接到壳体。 所述至少一个电容器是所述多个保持器之一的一部分; 并且电容器的电介质是到电路板的连接器和壳体之间的绝热的一部分。

公开(公告)号：US08749940B2

公开(公告)日：2014-06-10

申请号：US13503983

申请日：2010-09-09

Applicant: Andreas Schmidtlein

Inventor： Andreas Schmidtlein

IPC: H02H5/04

CPC classification number: H05K1/0201 ,  H01H37/761 ,  H01H2037/046 ,  H01H2037/763 ,  H01L2924/0002 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10757 ,  H05K2203/0271 ,  H05K2203/176 ,  Y02P70/613 ,  Y10T29/4913 ,  H01L2924/00

Abstract: An electronic component has an integrated protective device which responds in the event of a thermal overload and interrupts a current flow through the component. The protective device has an electrical terminal which may be brought under spring pretension by intrinsic resilience and assumes a mounting position in the pretensioned state and a current interrupting position in the untensioned state.

Abstract translation: 电子部件具有集成的保护装置，其在热过载的情况下响应并且中断通过部件的电流。 保护装置具有电气端子，其可以通过内在的弹性而处于弹簧预张紧状态，并且处于处于预张紧状态的安装位置和处于未张紧状态的电流中断位置。

公开(公告)号：US08746833B2

公开(公告)日：2014-06-10

申请号：US12998815

申请日：2009-11-19

Applicant: Yukihiro Saga ,  Toshiaki Watanabe

Inventor： Yukihiro Saga ,  Toshiaki Watanabe

IPC: B41J29/38 ,  B41J29/393 ,  B41J2/015

CPC classification number: B41J2/14209 ,  B41J2/04563 ,  B41J2/04581 ,  B41J2/0459 ,  B41J2002/14491 ,  B41J2202/08 ,  H05K1/0201 ,  H05K1/147 ,  H05K1/189 ,  H05K3/284 ,  H05K2201/0209 ,  H05K2201/10151

Abstract: A liquid jet head has a head chip including channels and nozzle holes communicating with respective ones of the channels. The channels have sidewalls each provided with a drive electrode. A temperature sensor is configured to detect a temperature of a liquid in the channels. A drive voltage value setting device is electrically connected to the temperature sensor for determining a magnitude of a drive voltage based on the temperature of the liquid detected by the temperature sensor. A control device performs a control operation that applies a drive voltage of the magnitude determined by the drive voltage value setting device to the drive electrodes of the head chip so as to increase a pressure in each of the channels by deformation of the side walls to thereby discharge the liquid in the channels from the respective nozzle holes.

Abstract translation: 液体喷射头具有头部芯片，其包括与各个通道相通的通道和喷嘴孔。 通道具有各自设置有驱动电极的侧壁。 温度传感器被配置为检测通道中的液体的温度。 驱动电压值设定装置电连接到温度传感器，用于基于由温度传感器检测到的液体的温度来确定驱动电压的大小。 控制装置执行控制操作，其将由驱动电压值设定装置确定的大小的驱动电压施加到头芯片的驱动电极，以便通过侧壁的变形增加每个通道中的压力，由此 从各个喷嘴孔排出通道中的液体。

公开(公告)号：US08717729B2

公开(公告)日：2014-05-06

申请号：US12866501

申请日：2008-02-12

Applicant: Mark S. Tracy ,  Keith A. Sauer ,  Jeffrey A. Lev

Inventor： Mark S. Tracy ,  Keith A. Sauer ,  Jeffrey A. Lev

IPC: H02H5/04 ,  H01H37/00

CPC classification number: G06F1/206 ,  H05K1/0201 ,  H05K2201/10053

Abstract: In one embodiment, a computing device includes a circuit board having a heat-generating component and a mechanical shut-off switch configured to cut power to the heat-generating component when a temperature within the computing device rises above a threshold temperature.

Abstract translation: 在一个实施例中，计算设备包括具有发热部件的电路板和被配置为当计算设备内的温度升高到阈值温度以上时将功率切断到发热部件的机械切断开关。

公开(公告)号：US20140110156A1

公开(公告)日：2014-04-24

申请号：US13961398

申请日：2013-08-07

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Ki Lee ,  Bum Seok Suh ,  Chang Seob Hong ,  Joon Seok Chae ,  Kwang Soo Kim

IPC: H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0201 ,  H01L25/167 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/73265 ,  H05K1/05 ,  H05K2201/09845 ,  H05K2201/09972 ,  H05K2203/0323 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.

Abstract translation: 本发明公开了一种散热基板，其特征在于，包括：散热板，其散热板的一侧和另一侧的厚度彼此不同; 导体图案层，形成在所述散热板上并且包括其上安装有控制装置和功率器件的安装焊盘和电路图案; 以及形成在散热板和导体图案层之间的绝缘层。

公开(公告)号：US20140057428A1

公开(公告)日：2014-02-27

申请号：US14073986

申请日：2013-11-07

Applicant: ISHIHARA CHEMICAL CO., LTD. ,  APPLIED NANOTECH HOLDINGS, INC.

Inventor： Zvi Yaniv ,  Mohshi Yang ,  Peter B. Laxton

IPC: H05K1/09 ,  H05K3/10 ,  H05K1/02 ,  H01L21/288 ,  H01L23/532

CPC classification number: H05K1/092 ,  B22F3/105 ,  B22F7/04 ,  B22F2998/00 ,  B23K26/32 ,  B23K26/34 ,  B23K35/0244 ,  B23K2101/36 ,  B23K2103/50 ,  B23K2103/52 ,  H01L21/268 ,  H01L21/288 ,  H01L21/4867 ,  H01L21/76877 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K3/10 ,  H05K3/125 ,  H05K3/1283 ,  H05K3/4664 ,  H05K2201/062 ,  H05K2203/107 ,  Y10T29/49156 ,  B22F1/0018 ,  H01L2924/00

Abstract: A layer of material having a low thermal conductivity is coated over a substrate. A film of conductive ink is then coated over the layer of material having the low thermal conductivity, and then sintered. The film of conductive ink does not absorb as much energy from the sintering as the film of conductive ink coated over the layer of material having the low thermal conductivity. The layer of material having the low thermal conductivity maybe a polymer, such as polyimide.

Abstract translation: 将一层具有低导热性的材料涂覆在基材上。 然后将导电油墨膜涂覆在具有低热导率的材料层上，然后烧结。 导电油墨的膜不像吸附在导热油墨的薄膜上那样吸收与热导率低的材料层相同的能量。 具有低热导率的材料层可以是聚合物，例如聚酰亚胺。

公开(公告)号：US08624122B2

公开(公告)日：2014-01-07

申请号：US12735193

申请日：2008-12-12

Applicant: Hiroki Shiraiwa ,  Kazuomi Kiyosue ,  Akinori Nakashima ,  Tomohiro Sugiura ,  Noriyoshi Yamazaki ,  Minoru Umezaki

Inventor： Hiroki Shiraiwa ,  Kazuomi Kiyosue ,  Akinori Nakashima ,  Tomohiro Sugiura ,  Noriyoshi Yamazaki ,  Minoru Umezaki

IPC: H05K1/00

CPC classification number: H05K1/0206 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/05 ,  H05K3/306 ,  H05K7/205 ,  H05K2201/10272

Abstract: To achieve efficient heat spreading and heat releasing by using a metal core of a circuit board, a terminal block includes an insulating block body and terminals. At least one of the terminals is provided with terminal portions for a connection with a circuit board. The terminal portions are inserted into respective through holes of the circuit board, the circuit board having a pattern circuit at a surface layer thereof and a conductive metal core at an intermediate portion in a thickness direction, so that heat of the metal core or of both the metal core and the pattern circuit is absorbed and transferred to the terminals. A bus-bar block includes an insulating block body and several parallel bus-bars with different lengths. Terminal portions at a tip end of the bus-bars are inserted, near heat-generating component on the circuit board, into the through holes of the circuit board.

公开(公告)号：US20130343004A1

公开(公告)日：2013-12-26

申请号：US13897336

申请日：2013-05-17

Applicant: The Regents of the University of California

Inventor： Sean Reilly ,  Jacob Supowit ,  Mike Stubblebine

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H05K1/0203 ,  H05K7/1404 ,  H05K7/2039 ,  H05K2201/068

Abstract: Thermally actuated printed circuit board (PCB) retainer assemblies that utilize at least one thermally actuated element to secure a received PCB to a heat sink in accordance with embodiments of the invention are disclosed. In one embodiment, a thermally actuated PCB retainer assembly includes a heat sink having an elongated groove configured to receive a PCB and a PCB retainer that includes a pair of complementary elongated bodies each having a first elongated face and a second elongated face where the second elongated faces of the elongated bodies are disposed in a cooperative sliding relation and at least one thermally actuated element in contact with at least one of the elongated bodies such that the thermally actuated element applies a force on the at least one elongated body in response to temperature changes such that the elongated bodies move in the cooperative sliding relation.

Abstract translation: 公开了根据本发明的实施例的使用至少一个热致动元件将接收的PCB固定到散热器的热致动印刷电路板（PCB）保持器组件。 在一个实施例中，热致动的PCB保持器组件包括散热器，散热器具有被配置为容纳PCB和PCB保持器的细长凹槽，所述PCB和PCB保持器包括一对互补的细长体，每个具有第一细长面和第二细长面， 细长体的表面以协作滑动关系设置，并且至少一个热致动元件与细长体中的至少一个接触，使得热致动元件响应于温度变化在至少一个细长体上施加力 使得细长体以协作滑动关系移动。