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公开(公告)号：US20180220529A1
公开(公告)日：2018-08-02
申请号：US15937692
申请日：2018-03-27
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Hiroyuki KANBARA
CPC classification number: H05K1/0306 , C03C3/062 , C03C3/089 , C03C4/04 , C03C8/22 , C03C8/24 , C03C14/006 , C03C2214/16 , G03F7/0047 , G03F7/029 , G03F7/031 , G03F7/033 , H01B3/02 , H05K1/03 , H05K3/46 , H05K2201/0104 , H05K2201/017 , H05K2201/068 , H05K2203/1126
Abstract: A photosensitive glass paste contains a photosensitive organic component and an inorganic component containing a glass powder having a high softening point, a glass powder having a low softening point, and a ceramic filler. The ceramic filler has a thermal expansion coefficient of 10×10−6/° C. to 16×10−6/° C., the inorganic component contains 30% to 50% by volume of the ceramic filler, and the inorganic component contains 0.5% to 10% by volume of the glass powder having a low softening point.
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公开(公告)号：US09928400B2
公开(公告)日：2018-03-27
申请号：US15271420
申请日：2016-09-21
Applicant: KYOCERA Corporation
Inventor： Kohichi Ohsumi
CPC classification number: G06K9/0002 , H05K1/0366 , H05K1/162 , H05K3/4644 , H05K2201/017 , H05K2201/029 , H05K2201/09236 , H05K2201/10151
Abstract: A wiring board for a fingerprint sensor includes a core insulating layer having a thickness of 30 μm to 100 μm, an inner buildup insulating layer having a thickness of 17 μm to 35 μm, an outer buildup insulating layer having a thickness of 7 μm to 25 μm, a plurality of fingerprint reading outer strip-shaped electrodes, a plurality of fingerprint reading inner strip-shaped electrodes, and an upper solder resist layer covering the outer strip-shaped electrodes by a thickness of 3 μm to 15 μm.
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73.发明申请公开(公告)号：US20180072627A1
公开(公告)日：2018-03-15
申请号：US15814676
申请日：2017-11-16
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Tomoki Kato , Sadaaki Sakamoto
IPC: C04B35/195 , C04B35/26 , H05K3/46
CPC classification number: C04B35/195 , B32B1/00 , B32B18/00 , C04B35/2633 , C04B2235/3215 , C04B2235/3262 , C04B2237/341 , C04B2237/56 , C04B2237/68 , C04B2237/702 , C04B2237/704 , H05K1/0306 , H05K3/46 , H05K3/4688 , H05K2201/017 , H05K2201/0175 , H05K2201/0195
Abstract: A multilayer ceramic substrate that includes a laminate having stacked ceramic layers formed of a ceramic material containing a main component, containing 48 to 75% by weight of Si, 20 to 40% by weight of Ba, and 10 to 40% by weight of Al, and an auxiliary component containing at least 2.5 to 20 parts by weight of Mn with respect to 100 parts by weight of the main component, and in the laminate, glass ceramic layers in which the entire or a portion of the thickness thereof exists within 100 μm inside of the laminate as measured from opposed principal surfaces are further stacked.
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公开(公告)号：US09661759B2
公开(公告)日：2017-05-23
申请号：US14383365
申请日：2013-02-25
Applicant: LG INNOTEK CO., LTD.
Inventor： Ji Su Kim , Ki Do Chun , Kyu Won Lee , Sang Myung Lee
CPC classification number: H05K3/4602 , H05K1/0306 , H05K1/115 , H05K1/181 , H05K1/185 , H05K3/107 , H05K3/465 , H05K3/4697 , H05K2201/017 , H05K2201/0195 , H05K2201/20
Abstract: Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.
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公开(公告)号：US20170104143A1
公开(公告)日：2017-04-13
申请号：US15316028
申请日：2015-05-26
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
CPC classification number: H01L33/62 , B32B7/12 , B32B15/08 , B32B27/281 , B32B2255/10 , B32B2255/20 , B32B2307/202 , B32B2457/202 , H01L33/486 , H01L33/58 , H01L2933/0033 , H01L2933/0058 , H01L2933/0066 , H05K1/0306 , H05K1/0346 , H05K1/036 , H05K1/189 , H05K3/28 , H05K2201/0154 , H05K2201/017 , H05K2201/0179 , H05K2201/09827 , H05K2201/09881 , H05K2201/10106
Abstract: Flexible LED assemblies (300) are described. More particularly, flexible LED (320) assemblies having flexible substrates (302) with conductive features (304, 306) positioned on or in the substrate, and layers of ceramic (310) positioned over exposed portions of the substrate to protect against UV degradation, as well as methods of making such assembles, are described.
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Patent Agency Ranking
76.发明授权Ceramic substrate composite and method for manufacturing ceramic substrate composite 有权陶瓷基板复合材料及陶瓷基板复合材料的制造方法公开(公告)号：US09320155B2
公开(公告)日：2016-04-19
申请号：US14128954
申请日：2012-12-21
Inventor： Taiji Kuroiwa , Seiichi Nakatani , Yoshihisa Yamashita , Susumu Sawada
CPC classification number: H05K3/22 , H05K1/0306 , H05K3/4007 , H05K3/4629 , H05K2201/017 , H05K2201/09481 , H05K2201/09881 , H05K2203/0139 , Y10T29/49155
Abstract: A ceramic substrate composite includes a conductor pattern composite and an insulating layer on a ceramic substrate. The ceramic substrate composite is formed such that the conductor pattern composite and the insulating layer are provided on the ceramic substrate with each other so that the insulating layer overlaps a part of the conductor pattern composite. The conductor pattern composite is composed of a conductor portion and an insulating portion that exists locally in the conductor portion, and the insulating portion is an insulating material that constitutes the insulating layer.
Abstract translation: 陶瓷基板复合体包括导体图案复合体和陶瓷基板上的绝缘层。 形成陶瓷基板复合体，使得导体图案复合体和绝缘层彼此设置在陶瓷基板上，使得绝缘层与导体图案复合体的一部分重叠。 导体图案复合体由导体部分和局部存在于导体部分中的绝缘部分组成，绝缘部分是构成绝缘层的绝缘材料。
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公开(公告)号：US09091421B2
公开(公告)日：2015-07-28
申请号：US13882529
申请日：2011-08-25
Applicant: Hyo Tae Kim , Gi Seok Song , Heung Soon Kim
Inventor： Hyo Tae Kim , Gi Seok Song , Heung Soon Kim
CPC classification number: H01L33/64 , H01L33/648 , H05K1/0203 , H05K1/053 , H05K2201/017 , H05K2201/064 , H05K2201/10106 , H05K2201/10969
Abstract: The present invention provides an LED array module having an improved heat-dissipating effect, and a manufacturing method thereof. To this end, an LED array module includes one or more LED unit modules, the LED unit module comprising: an LED; a heat conductive heat-dissipating slug attached to the lower portion of the LED; and leads connected to the cathode and anode of the LED, respectively, wherein the LED array module comprises: a heat-dissipating plate; a heat conductive solder layer disposed and bonded between the upper surface of the heat-dissipating plate and the lower surface of the heat-dissipating slug; a first insulating layer formed on the upper surface of the heat-dissipating plate; and array electrodes which are formed on the upper surface of the insulating layer and are electrically connected to the leads to drive the LED.
Abstract translation: 本发明提供一种具有改善的散热效果的LED阵列模块及其制造方法。 为此，LED阵列模块包括一个或多个LED单元模块，该LED单元模块包括：LED; 连接到LED的下部的导热散热块; 以及分别连接到LED的阴极和阳极的引线，其中LED阵列模块包括：散热板; 散热板的上表面和散热块的下表面之间设置并结合的导热焊料层; 形成在散热板的上表面上的第一绝缘层; 以及阵列电极，其形成在绝缘层的上表面上并且电连接到引线以驱动LED。
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公开(公告)号：US20150109251A1
公开(公告)日：2015-04-23
申请号：US14582530
申请日：2014-12-24
Applicant: INNOLUX CORPORATION
Inventor： KAI MENG , LIEN-HSIN LEE
IPC: G06F3/044
CPC classification number: H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
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公开(公告)号：US20150083567A1
公开(公告)日：2015-03-26
申请号：US14560592
申请日：2014-12-04
Applicant: INNOLUX CORPORATION
Inventor： KAI MENG , LIEN-HSIN LEE
CPC classification number: H05K1/0296 , G06F3/044 , G06F2203/041 , G06F2203/04103 , G06F2203/04111 , G06F2203/04112 , H03K17/9622 , H03K2017/9613 , H03K2217/96075 , H03K2217/960755 , H03K2217/960765 , H05K1/0274 , H05K1/0306 , H05K3/10 , H05K3/125 , H05K2201/0108 , H05K2201/017 , Y10T29/49105 , Y10T29/49155 , Y10T29/49162
Abstract: A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
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公开(公告)号：US08835944B2
公开(公告)日：2014-09-16
申请号：US13726986
申请日：2012-12-26
Applicant: Citizen Electronics Co., Ltd. , Citizen Holdings Co., Ltd.
Inventor： Sadato Imai
IPC: H01L33/08 , H01L33/48 , H05K1/05 , H01L25/075 , H01L33/64
CPC classification number: H01L33/48 , H01L25/0753 , H01L33/08 , H01L33/644 , H01L2224/48091 , H01L2224/48137 , H01L2924/181 , H05K1/053 , H05K2201/017 , H05K2201/10106 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: In a first aspect of the present invention, a lighting device including a metal plate, an electrical insulation layer that is smaller in size than an outline of the metal plate and arranged on an upper surface of the metal plate, a light-emitting element mounted on the electrical insulation layer, and a first connecting electrode and a second connecting electrode electrically connected to the light-emitting element and arranged on the electrical insulation layer.
Abstract translation: 在本发明的第一方面中，一种照明装置，包括金属板，电绝缘层，该电绝缘层的尺寸小于金属板的轮廓并布置在金属板的上表面上，发光元件安装 以及电连接到所述发光元件并且布置在所述电绝缘层上的第一连接电极和第二连接电极。
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