公开(公告)号：US08614155B2

公开(公告)日：2013-12-24

申请号：US12860117

申请日：2010-08-20

Applicant: Dylan Joseph Boday ,  Joseph Kuczynski

Inventor： Dylan Joseph Boday ,  Joseph Kuczynski

IPC: B32B17/02 ,  B32B15/04 ,  C08F290/14 ,  C08F283/00 ,  C08G61/02 ,  C08G65/48 ,  C08G14/04 ,  C08G63/18 ,  C08G65/38

CPC classification number: H05K1/0353 ,  B32B17/02 ,  B32B17/064 ,  C03C25/323 ,  C08G65/485 ,  C08L71/00 ,  C08L71/12 ,  C08L71/126 ,  C08L2205/02 ,  C08L2205/05 ,  H05K1/0326 ,  H05K1/0366 ,  H05K3/025 ,  H05K2201/0358 ,  Y10T428/31678 ,  Y10T442/2992

Abstract: An enhanced prepreg for printed circuit board (PCB) laminates includes a substrate and a resin applied to the substrate. The resin includes a curable polymer and a polymerization initiator polymer having a backbone with a free radical initiator forming segment that breaks apart upon being subjected to heat to generate a plurality of non-volatile initiating species. This resin composition eliminates possible volatile loss of the free radical initiator during all processing steps in the preparation of PCB laminates. The resin may additionally include a cross-linking agent, flame retardant and viscosity modifiers. In one embodiment, a sheet of woven glass fibers is impregnated with the resin and subsequently dried or cured. The glass cloth substrate may include a silane coupling agent to couple the resin to the substrate. In another embodiment, resin coated copper (RCC) is prepared by applying the resin to copper and subsequently curing the resin.

Abstract translation: 用于印刷电路板（PCB）层压板的增强型预浸料包括基材和施加到基材上的树脂。 该树脂包括可固化聚合物和具有主链的聚合引发剂聚合物，所述主链具有自由基引发剂形成段，其经受热而分裂以产生多种不挥发性起始物质。 在制备PCB层压板的所有加工步骤期间，该树脂组合物消除了自由基引发剂可能的挥发性损失。 树脂可另外包括交联剂，阻燃剂和粘度调节剂。 在一个实施方案中，用树脂浸渍玻璃纤维片，随后干燥或固化。 玻璃布基材可以包括将树脂偶联到基材上的硅烷偶联剂。 在另一个实施方案中，通过将树脂施加到铜上并随后固化树脂来制备树脂涂覆的铜（RCC）。

公开(公告)号：US20130192655A1

公开(公告)日：2013-08-01

申请号：US13798805

申请日：2013-03-13

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Henry L. Edwards ,  Kenneth J. Maggio ,  Steven Kummerl ,  Sreenivasan K. Koduri

IPC: H01L35/28 ,  H01L29/02

CPC classification number: H01L35/28 ,  H01L21/568 ,  H01L23/38 ,  H01L24/18 ,  H01L24/19 ,  H01L24/24 ,  H01L24/25 ,  H01L29/02 ,  H01L2224/04105 ,  H01L2224/06181 ,  H01L2224/2518 ,  H01L2224/32225 ,  H01L2224/92144 ,  H01L2924/12042 ,  H05K1/0203 ,  H05K1/185 ,  H05K2201/0358 ,  H05K2201/10219 ,  H01L2924/00

Abstract: A circuit board with an embedded thermoelectric device with hard thermal bonds. A method of embedding a thermoelectric device in a circuit board and forming hard thermal bonds.

Abstract translation: 具有硬热键的嵌入式热电元件的电路板。 一种在电路板中嵌入热电装置并形成硬热键的方法。

公开(公告)号：US08357859B2

公开(公告)日：2013-01-22

申请号：US12523127

申请日：2008-01-16

Applicant: Hiroaki Wakabayashi ,  Noriyuki Ohigashi

Inventor： Hiroaki Wakabayashi ,  Noriyuki Ohigashi

IPC: H05K1/00

CPC classification number: H05K3/4655 ,  C08F220/18 ,  C08L33/064 ,  H05K3/4652 ,  H05K2201/0358 ,  H05K2203/066 ,  Y10T428/12 ,  Y10T428/264 ,  Y10T428/31511 ,  Y10T428/31529 ,  Y10T428/31681 ,  Y10T428/31699 ,  Y10T428/31786 ,  Y10T428/31935

Abstract: Disclosed is an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) including an insulating resin layer with a uniform thickness that is formed without repulsion or unevenness in a process of forming the insulating resin layer on a film or a metal foil, and a multi-layer printed circuit board that includes the insulating resin sheet laminate and possesses high insulating reliability. The present invention provides an insulating resin sheet laminate (an insulating resin sheet with a film or a metal foil) obtained by forming an insulating resin layer made of a resin composition on a film or a metal foil, and the resin composition includes an acrylic surfactant.

Abstract translation: 公开了一种绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），其包括在膜上形成绝缘树脂层的过程中不产生排斥或不均匀的具有均匀厚度的绝缘树脂层 金属箔和包含绝缘树脂片层叠体并具有高绝缘可靠性的多层印刷电路板。 本发明提供一种通过在膜或金属箔上形成由树脂组合物制成的绝缘树脂层而获得的绝缘树脂片层叠体（具有膜或金属箔的绝缘树脂片），并且该树脂组合物包括丙烯酸类表面活性剂 。

公开(公告)号：US08188375B2

公开(公告)日：2012-05-29

申请号：US11603884

申请日：2006-11-22

Applicant: Kenichi Kawabata ,  Takaaki Morita

Inventor： Kenichi Kawabata ,  Takaaki Morita

IPC: H05K1/16

CPC classification number: H05K3/4652 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/24226 ,  H01L2224/2518 ,  H01L2224/82039 ,  H01L2224/82047 ,  H01L2224/92 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K1/185 ,  H05K3/0044 ,  H05K3/0058 ,  H05K3/4602 ,  H05K3/4682 ,  H05K3/4688 ,  H05K2201/0358 ,  H05K2201/09518 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0554 ,  H05K2203/1105 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T29/49128 ,  Y10T428/24917 ,  H01L2224/83 ,  H01L2224/82 ,  H01L2924/00

Abstract: A multilayer circuit board comprises core layers 101 and 102 made of a core material impregnated with resin, resin layers 111 and 112 interposed between the core layers 101 and 102, a wiring pattern 140 embedded in the resin layers 111 and 112. The core layers 101 and 102 have a thickness of 100 μm or smaller, whereby the entire board can significantly be thinned. Furthermore, the less strong resin layers 111 and 112 are interposed between the hard core layers 101 and 102, whereby the entire board has increased strength.

Abstract translation: 多层电路板包括由浸渍有树脂的芯材制成的芯层101和102，插入在芯层101和102之间的树脂层111和112，嵌入在树脂层111和112中的布线图案140.芯层101 102的厚度为100μm以下，从而能够使整个基板变薄。 此外，较不强的树脂层111和112插入在硬芯层101和102之间，由此整个板具有增加的强度。

公开(公告)号：US20120012553A1

公开(公告)日：2012-01-19

申请号：US12837584

申请日：2010-07-16

Applicant: Robert M. Japp ,  Kostas I. Papathomas ,  Cheryl Palomaki

Inventor： Robert M. Japp ,  Kostas I. Papathomas ,  Cheryl Palomaki

IPC: B32B38/10 ,  C23F1/02

CPC classification number: H05K1/0366 ,  B32B37/02 ,  B32B2309/105 ,  B32B2457/08 ,  H05K3/42 ,  H05K2201/0293 ,  H05K2201/0358 ,  H05K2203/063 ,  Y10T156/1062

Abstract: A method for making a leadless chip carrier (LCC) for use in electronic packages having a core layer stripped of copper cladding, containing drilled clearance holes within, a layer of resin coated copper (RCC) placed on the upper surface of the core layer and a second layer of RCC placed on the lower surface of the core layer. The layers are laminated together with the RCC filling the clearance holes during lamination. A pattern is etched on the RCC and vias are drilled through the filled clearance holes and pre-plated with seed copper layers. The seed copper layers in the vias are then covered by a layer of copper plating to meet the requirements of the core buildup layer, and resin inhibiting conductive anodic filament (CAF) growth within the structure.

Abstract translation: 一种制造用于电子封装的无引线芯片载体（LCC）的方法，所述无引线芯片载体（LCC）具有剥离铜包层的芯层，其中包含钻孔的间隙孔，放置在芯层的上表面上的树脂涂覆铜层（RCC），以及 第二层RCC放置在芯层的下表面上。 层压在一起，RCC在层压期间填充间隙孔。 在RCC上蚀刻图案，并且通过填充的间隙孔钻出通孔并且预镀有种子铜层。 然后通孔中的种子铜层被镀铜层覆盖以满足堆芯层的要求，并且在结构内树脂抑制导电阳极丝（CAF）生长。

公开(公告)号：US07883780B2

公开(公告)日：2011-02-08

申请号：US11493603

申请日：2006-07-27

Applicant: Satoshi Okamoto ,  Toyonari Ito

Inventor： Satoshi Okamoto ,  Toyonari Ito

IPC: B32B15/09 ,  B32B15/20 ,  B05D3/02

CPC classification number: B32B15/08 ,  B32B15/20 ,  B32B27/36 ,  B32B38/0036 ,  B32B2305/55 ,  B32B2307/54 ,  B32B2309/02 ,  H05K1/0326 ,  H05K1/0393 ,  H05K2201/0141 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2203/0759 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786

Abstract: The present invention provides a laminate comprising a resin layer and a copper foil. The resin layer is made from a liquid crystalline polyester having at least one structural unit selected from a structural unit derived from aromatic diamine and a structural unit derived from aromatic amine with a phenolic hydroxyl group in an amount of 10 to 35% by mole on the basis of the total structural units in the polyester. The copper foil has a tensile modulus of 60 GPa or smaller and a tensile strength at break of 150 MPa or smaller measured after heat treatment at a temperature of 300° C. The copper-foil laminate has good flexibility and high durability with little anisotropy is provided.

Abstract translation: 本发明提供一种包含树脂层和铜箔的层压体。 树脂层由液晶聚酯制成，该液晶聚酯具有至少一种选自芳族二胺衍生的结构单元的结构单元和衍生自酚羟基的芳族胺的结构单元，其量为10〜35摩尔％ 聚酯中总结构单位的基础。 铜箔的拉伸模量为60GPa以下，热处理后在300℃下测定的断裂拉伸强度为150MPa以下。铜箔层叠体具有良好的柔软性，耐久性高，几何异向性小 提供。

公开(公告)号：US07832098B2

公开(公告)日：2010-11-16

申请号：US12098582

申请日：2008-04-07

Applicant: Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H01K3/10

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 μm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20100252310A1

公开(公告)日：2010-10-07

申请号：US12670956

申请日：2008-07-25

Applicant: Kiyoshige Kojima ,  Junji Kodemura

Inventor： Kiyoshige Kojima ,  Junji Kodemura

IPC: H05K1/00 ,  B32B15/08 ,  B32B37/06 ,  B05D3/02

CPC classification number: H05K3/4655 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0358 ,  H05K2203/1105 ,  H05K2203/1476 ,  Y10T428/2848

Abstract: A crosslinkable and polymerizable composition containing a monomer and a cross-linking agent is applied onto a metal foil to form a coated film of the composition, and heat is applied to the coated film to firstly bulk polymerize the entire coated film of the crosslinkable and polymerizable composition. Then, by applying heat to the coated film from the metal foil side, cooling a surface far from the metal foil as needed, and subjecting a limited region adjacent to the metal foil in the thickness direction of the coated film to a cross-linking reaction, a composite for multilayer circuit board is obtained, in which the metal foil layer, a hard resin layer containing a hard resin obtained by bulk polymerization reaction and cross-linking reaction, and an adhesive resin layer containing an adhesive resin obtained by bulk polymerization reaction are laminated in this order.

Abstract translation: 将含有单体和交联剂的交联性和可聚合组合物施加到金属箔上以形成组合物的涂膜，并将热量施加到涂膜上，首先将可交联和可聚合的整个涂膜 组成。 然后，通过从金属箔侧向涂膜施加热量，根据需要冷却远离金属箔的表面，并且将与金属箔相邻的有限区域沿涂布膜的厚度方向进行交联反应 得到金属箔层，含有通过本体聚合反应和交联反应得到的硬质树脂的硬质树脂层和通过本体聚合反应得到的粘合性树脂的粘合性树脂层的多层电路板用复合体 按此顺序层压。

公开(公告)号：US20100243601A1

公开(公告)日：2010-09-30

申请号：US12659893

申请日：2010-03-24

Applicant: Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

Inventor： Hiroyuki Uematsu ,  Kenichi Kawabata ,  Kenji Nagase

IPC: C23F1/00 ,  H01B13/00

CPC classification number: H05K3/427 ,  H05K3/002 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0041 ,  H05K3/0044 ,  H05K3/061 ,  H05K3/064 ,  H05K3/382 ,  H05K3/389 ,  H05K3/421 ,  H05K3/4652 ,  H05K2201/0347 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/0394 ,  H05K2203/025 ,  H05K2203/0353 ,  H05K2203/054 ,  H05K2203/0585 ,  H05K2203/0733

Abstract: Provided is a method for manufacturing a multilayer wiring board, whereby even if the multilayer wiring board suffers warping or irregularities, thin-film patterns with great uniformity that are to be used as a mask for forming a wiring layer can be obtained in a simple way. A primer-coated metal foil 20 composed of a primer resin layer 21 and a metal layer 22 is placed on a surface of a double-face CCL 10, which is prepared by applying metal layers 12 and 13 onto the surfaces of a support base 11, and the primer-coated metal foil 20 and the double-face CCL 10 are bonded and the primer resin layer 21 is cured. A via Vb is thereafter formed from the metal layer 22 side, and a metal-plate layer 30 is formed on the resulting metal layer 22. After that, the etched down metal-plate layer 30 and the metal layer 22 are patterned, and using the patterned layers as a mask, the primer resin layer 21 is patterned. Using the patterned primer resin layer 21 as a mask, the metal layer 12 of the double-face CCL 10 and the metal-plate layer 30 are patterned to form a wiring pattern.

Abstract translation: 提供一种多层布线板的制造方法，即使多层布线板发生翘曲或不均匀，也可以以简单的方式获得用作形成布线层的掩模的具有均匀性的薄膜图案 。 将由底漆树脂层21和金属层22构成的底漆涂布金属箔20放置在双面CCL 10的表面上，该双面CCL 10通过将金属层12和13施加到支撑基底11的表面上而制备 并且底漆涂覆的金属箔20和双面CCL 10被粘合，底漆树脂层21固化。 之后，从金属层22侧形成通孔Vb，在所得到的金属层22上形成金属板层30.之后，对蚀刻后的金属板层30和金属层22进行图案化，使用 作为掩模的图案化层，对底漆树脂层21进行图案化。 使用图案化底漆树脂层21作为掩模，将双面CCL 10的金属层12和金属板层30图案化以形成布线图案。

公开(公告)号：US20100044078A1

公开(公告)日：2010-02-25

申请号：US12551802

申请日：2009-09-01

Applicant: Hirohisa Narahashi ,  Shigeo Nakamura ,  Tadahiko Yokota

Inventor： Hirohisa Narahashi ,  Shigeo Nakamura ,  Tadahiko Yokota

IPC: H05K1/00 ,  B32B37/00 ,  B32B33/00

CPC classification number: H05K3/025 ,  B32B37/025 ,  B32B38/10 ,  B32B2038/0076 ,  B32B2311/00 ,  B32B2457/08 ,  H05K3/386 ,  H05K2201/0358 ,  H05K2203/0264 ,  H05K2203/0769 ,  H05K2203/0786 ,  Y10T428/14 ,  Y10T428/1438 ,  Y10T428/1443 ,  Y10T428/1476 ,  Y10T428/26 ,  Y10T428/263 ,  Y10T428/264 ,  Y10T428/265 ,  Y10T428/266 ,  Y10T428/269

Abstract: Producing a circuit board, by laminating, on a substrate, an adhesive film with a metal film, which comprises a water-soluble polymer release layer, a metal film layer and a curable resin composition layer, which are formed in this order on a support layer, and has a release property enabling detachment of said water-soluble polymer release layer from the support layer after curing of the curable resin composition layer, such that the curable resin composition layer contacts the substrate; curing the curable resin composition layer; detaching the support layer, and removing the water-soluble polymer release layer present on the metal film layer by dissolving the release layer in an aqueous solution, efficiently forms an insulating layer and a metal film layer superior in adhesiveness to the insulating layer and in uniformity. By this method, a metal film layer having high adhesiveness and high property uniformity can be formed on the surface without the need for roughening the surface of an insulating layer with an oxidant such as alkaline potassium permanganate solution and the like. Thus, etching for circuit formation can be performed under milder conditions, which in turn provides a superior effect on micro wiring on circuit boards such as multi-layer printed wiring boards, flexible printed wiring boards, and the like.

Abstract translation: 通过在基板上层叠具有金属膜的粘合膜来制造电路板，所述金属膜包括依次形成在支撑体上的水溶性聚合物剥离层，金属膜层和固化性树脂组合物层 并且具有能够使固化性树脂组合物层固化后使所述水溶性高分子脱离层从支撑层脱离的脱模性，使得固化性树脂组合物层与基材接触; 固化树脂组合物层; 通过将剥离层溶解在水溶液中，分离保护层，除去存在于金属膜层上的水溶性聚合物释放层，有效地形成绝缘层和与绝缘层的粘合性优异的金属膜层，均匀性 。 通过这种方法，可以在表面上形成具有高粘合性和高性能均匀性的金属膜层，而不需要用氧化剂如碱式高锰酸钾溶液等来粗糙化绝缘层的表面。 因此，可以在更温和的条件下进行电路形成蚀刻，这又对诸如多层印刷线路板，柔性印刷线路板等的电路板上的微接线提供了优异的效果。