中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

792 records (took 0.023 seconds)

    Methods and devices for wireless chip-to-chip communications
    71.
    发明授权
    Methods and devices for wireless chip-to-chip communications 有权
    用于无线芯片到芯片通信的方法和设备

    公开(公告)号：US07873122B2

    公开(公告)日：2011-01-18

    申请号：US11970549

    申请日：2008-01-08

    Applicant: Woo Cheol Chung

    Inventor： Woo Cheol Chung

    IPC: H04L27/00 ,  H03K9/00

    CPC classification number: H05K1/0243 ,  H01L23/48 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/16145 ,  H01L2225/06527 ,  H01L2225/06562 ,  H01Q1/2266 ,  H01Q1/521 ,  H01Q17/00 ,  H05K1/0298 ,  H05K1/181 ,  H05K2201/086 ,  H05K2201/10098 ,  H05K2201/10515 ,  H05K2201/10674

    Abstract: Wireless chip-to-chip communications are methods and devices are disclosed. In an example, a wireless chip-to-chip communication device includes a plurality of chips, each of the plurality of chips having at least one antenna and formed on a multi-layered structure. The multi-layered structure includes first and second absorption layers. The first and second absorption layers are configured to enclose a propagation medium having a given dielectric constant. The plurality of chips are configured to wirelessly communicate with each other via the respective antennas in accordance with a given wireless communication protocol via a direct propagation path within the propagation medium.

    Abstract translation: 无线芯片到芯片通信是公开的方法和设备。 在一个示例中，无线芯片到芯片通信设备包括多个芯片，所述多个芯片中的每一个具有至少一个天线并且以多层结构形成。 多层结构包括第一和第二吸收层。 第一和第二吸收层被配置为包围具有给定介电常数的传播介质。 多个芯片被配置为经由相应的天线根据给定的无线通信协议经由传播介质内的直接传播路径彼此无线地进行通信。

    Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors
    73.
    发明申请
    Manufacture and use of planar embedded magnetics as discrete components and in integrated connectors 有权
    制造和使用平面嵌入式磁体作为分立元件和集成连接器

    公开(公告)号：US20100295646A1

    公开(公告)日：2010-11-25

    申请号：US12592771

    申请日：2009-12-01

    Applicant: William Lee Harrison ,  And-Vu Pham ,  James E. Quilici ,  Sidharth Dalmia ,  Steven R. Kubes

    Inventor： William Lee Harrison ,  And-Vu Pham ,  James E. Quilici ,  Sidharth Dalmia ,  Steven R. Kubes

    IPC: H01F27/29 ,  H01F27/28 ,  H01F5/00

    CPC classification number: H01F19/04 ,  H01F17/0033 ,  H01F30/16 ,  H01F41/046 ,  H01R13/6633 ,  H01R13/719 ,  H01R24/64 ,  H05K1/0233 ,  H05K1/183 ,  H05K2201/086 ,  H05K2201/10189

    Abstract: The current invention provides an integrated planar transformer and electronic component that includes at least one wideband planar transformer disposed in a planar substrate, where each wideband planar transformer includes a planar substrate in a fully-cured and rigid state, a ferrite material embedded in the planar substrate, where the ferrite material is enveloped in an elastic and non-conductive material, inter-wound conductors disposed around the embedded ferrite material, where top and bottom conductors are bonded by an insulating adhesive. The top and bottom conductors are connected in an inter-connected pattern by conductive vias disposed on each side of the ferrite material and span through the layers to the conductors. The planar transformer further includes at least one center tap connected to at least one inter-wound conductor. The integrated planar transformer and electronic component further includes at least one electronic component connected to at least one terminal of the wide-band planar transformer.

    Abstract translation: 本发明提供了一种集成平面变压器和电子部件，其包括设置在平面基板中的至少一个宽带平面变压器，其中每个宽带平面变压器包括处于完全固化和刚性状态的平面基板，嵌入平面 衬底，其中铁氧体材料被包裹在弹性和非导电材料中，围绕在埋入的铁氧体材料周围的导体，其中顶部和底部导体通过绝缘粘合剂结合。 顶部和底部导体通过设置在铁氧体材料的每一侧上的导电通孔以相互连接的形式连接，并跨越导体层。 平面变压器还包括连接到至少一个互缠绕导体的至少一个中心抽头。 集成平面变压器和电子部件还包括连接到宽带平面变压器的至少一个端子的至少一个电子部件。

    MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME
    74.
    发明申请
    MINIATURE CIRCUITRY AND INDUCTIVE COMPONENTS AND METHODS FOR MANUFACTURING SAME 审中-公开
    微型电路和电感元件及其制造方法

    公开(公告)号：US20100127814A1

    公开(公告)日：2010-05-27

    申请号：US12639886

    申请日：2009-12-16

    Applicant: Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

    Inventor： Ronald W. Whittaker ,  Joe D. Guerra ,  Ciprian Marcoci

    IPC: H01F27/28

    CPC classification number: H01F17/0033 ,  H01F17/062 ,  H01F19/04 ,  H01F27/266 ,  H01F27/2804 ,  H01F41/046 ,  H01F2017/002 ,  H05K1/165 ,  H05K1/189 ,  H05K3/389 ,  H05K3/429 ,  H05K3/4644 ,  H05K2201/0179 ,  H05K2201/086 ,  H05K2201/097 ,  H05K2201/09809 ,  H05K2201/10416

    Abstract: Miniature circuitry and inductor components in which multiple levels of printed circuitry are formed on each side of a support panel, typically a printed circuit board or rigid flex. Magnetic members are embedded in one or more cavities in said support panel. Electrical connection between the plural levels of circuitry and multiple windings around the magnetic members are provided by plural plated through hole conductors. Small through hole openings accommodate a plurality of the plated through hole conductors since each is insulated from the others by a very thin layer of vacuum deposited organic layer such as parylene having a high dielectric strength. Adhesion of this plated copper to the organic layer is provided by first applying an adhesive promotor to the surface of the organic layer followed by the vacuum deposition of the organic layer.

    Abstract translation: 微型电路和电感器部件，其中在支撑面板的每一侧，通常是印刷电路板或刚性柔性件上形成多层印刷电路。 磁性构件嵌入在所述支撑面板中的一个或多个空腔中。 由多个电镀通孔导体提供多层电路与磁性构件周围的多个绕组之间的电连接。 小的通孔开口容纳多个电镀通孔导体，因为它们通过非常薄的真空沉积的有机层（例如具有高介电强度的聚对二甲苯）绝缘。 通过首先在有机层的表面上施加粘合剂促进剂，然后真空沉积有机层，来提供该镀铜的有机层的附着力。

    Method of Constructing Inductors and Transformers
    76.
    发明申请
    Method of Constructing Inductors and Transformers 有权
    构建电感器和变压器的方法

    公开(公告)号：US20100109123A1

    公开(公告)日：2010-05-06

    申请号：US12262816

    申请日：2008-10-31

    Applicant: Bernhard Strzalkowski ,  Marco Seibt ,  Ulrich Schwarzer

    Inventor： Bernhard Strzalkowski ,  Marco Seibt ,  Ulrich Schwarzer

    IPC: H01L29/66 ,  H01F5/00 ,  H01F7/06 ,  H01L21/20

    CPC classification number: H01F27/2804 ,  H01F17/0013 ,  H01F41/046 ,  H01F2017/002 ,  H01F2017/0066 ,  H05K1/0298 ,  H05K1/165 ,  H05K2201/0187 ,  H05K2201/086 ,  H05K2201/09672 ,  Y10T29/4902

    Abstract: An embodiment of the invention relates to an apparatus including a magnetic device and a related method. A multilayer substrate is constructed with a winding formed in a metallic layer, an electrically insulating layer above the metallic layer, and a via formed in the electrically insulating layer to couple the winding to a circuit element positioned on the multilayer substrate. A depression is formed in the multilayer substrate, and a polymer solution, preferably an epoxy, containing a ferromagnetic component such as nanocrystaline nickel zinc ferrite is deposited within a mold positioned on a surface of the multilayer substrate above the winding and in the depression. An integrated circuit electrically coupled to the winding may be located on the multilayer substrate. The multilayer substrate may be a semiconductor substrate or a printed wiring board, and the circuit element may be an integrated circuit formed on the multilayer substrate.

    Abstract translation: 本发明的实施例涉及一种包括磁性装置和相关方法的装置。 多层基板由形成在金属层中的绕组，金属层上方的电绝缘层和形成在电绝缘层中的通孔构成，以将绕组耦合到位于多层基板上的电路元件。 在多层基板中形成凹陷，并且将含有铁磁性成分如纳米级镍锌铁氧体的聚合物溶液，优选环氧树脂沉积在位于绕组上方和凹陷处的多层基板的表面上的模具中。 电耦合到绕组的集成电路可以位于多层基板上。 多层基板可以是半导体基板或印刷线路板，电路元件也可以是形成在多层基板上的集成电路。

Patent Agency Ranking