公开(公告)号：US4571564A

公开(公告)日：1986-02-18

申请号：US532543

申请日：1983-09-15

Applicant: Maciej E. Znojkiewicz

Inventor： Maciej E. Znojkiewicz

IPC: H01P5/08 ,  H01P5/107 ,  H01P7/00 ,  H01P7/06 ,  H03B19/18 ,  H03D7/02 ,  H03D9/06 ,  H05K1/02 ,  H05K1/16 ,  H05K3/00 ,  H01P5/00 ,  H04B1/26

CPC classification number: H05K1/0239 ,  H03D9/0641 ,  H03B19/18 ,  H05K1/0218 ,  H05K1/0272 ,  H05K1/162 ,  H05K2201/09054 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/09618 ,  H05K2201/10174 ,  H05K3/0061

Abstract: In a microwave device, for example a microwave local oscillator with a harmonic mixer for feedback control, problems of coupling the mixer circuit to the R.F. cavity are overcome by providing a d.c. blocking capacitor of the mixer on a planar surface of a support extending across an aperture in one wall of the cavity. In preferred embodiments the capacitor is a planar device formed by a plurality of interdigitated fingers. These fingers are oriented to couple magnetically with the R.F. energy at the aperture in the cavity. The support conveniently comprises a printed circuit board having a ground plane on the same surface as the capacitor, which is located in a small opening in the ground plane. A second ground plane is provided on the opposite side of the printed circuit board, overlying the opening. The two ground planes are interconnected by plate-through-holes.

Abstract translation: 在微波装置中，例如具有用于反馈控制的谐波混频器的微波本地振荡器，将混频器电路耦合到R.F.的问题。 通过提供直流电流来克服腔体。 混合器的阻塞电容器在穿过空腔的一个壁中的孔的支撑件的平坦表面上。 在优选实施例中，电容器是由多个叉指形成的平面器件。 这些指状物被定向成与R.F. 空腔孔径处的能量。 该支撑件方便地包括印刷电路板，该印刷电路板位于与接地平面中的小开口中的与电容器相同的表面上的接地平面。 第二接地平面设置在印刷电路板的相对侧上，覆盖开口。 两个接地平面通过板通孔相互连接。

公开(公告)号：US20180206324A1

公开(公告)日：2018-07-19

申请号：US15743323

申请日：2016-06-14

Applicant: NEC CORPORATION

Inventor： Makoto HAYAKAWA

IPC: H05K1/02 ,  H01L23/12 ,  H01L23/373 ,  H04B1/38 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01L23/12 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/3736 ,  H04B1/38 ,  H05K1/021 ,  H05K1/141 ,  H05K3/0061 ,  H05K3/368 ,  H05K7/20 ,  H05K7/2049 ,  H05K2201/049 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10416

Abstract: Provided is a mounting structure that can bond a first heat dissipation element to a second substrate through a hole in a first substrate without using a binder such as solder, an adhesive, or the like. A mounting structure of the present disclosure includes a first substrate (10) in which a penetrating hole (11) is formed, a second substrate (20) and a first heat dissipation element (30) overlapped with both surfaces of the first substrate (10), respectively, so as to cover the penetrating hole (11), and a second heat dissipation element (40) sandwiched and attached between the second substrate (20) and the first heat dissipation element (30) inside the penetrating hole (11).

公开(公告)号：US20170188481A1

公开(公告)日：2017-06-29

申请号：US15459637

申请日：2017-03-15

Applicant: Gerald Ho Kim

Inventor： Gerald Ho Kim

IPC: H05K7/20 ,  H05K5/03 ,  H05K5/04 ,  H01L23/427 ,  H05K1/02

CPC classification number: H05K7/2029 ,  F28F3/048 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/427 ,  H01L23/4275 ,  H01L23/467 ,  H01L29/0657 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/0209 ,  H05K5/03 ,  H05K5/04 ,  H05K2201/066 ,  H05K2201/09054 ,  H01L2924/00

Abstract: Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

公开(公告)号：US09507108B2

公开(公告)日：2016-11-29

申请号：US14299655

申请日：2014-06-09

Applicant: FUJITSU OPTICAL COMPONENTS LIMITED

Inventor： Shinichi Aoki

IPC: G02B6/36 ,  G02B6/255 ,  H04B10/00 ,  H05K7/20 ,  G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40

CPC classification number: G02B6/4269 ,  G02B6/4281 ,  H05K1/0204 ,  H05K1/0206 ,  H05K1/189 ,  H05K3/4046 ,  H05K7/205 ,  H05K2201/066 ,  H05K2201/09054 ,  H05K2201/10689

Abstract: An optical module includes: a flexible board having a first surface on which a component is mounted and a second surface opposite to the first surface; a bottom electrode part having a bottom surface on which a heat release electrode is provided, the bottom electrode part mounted on the first surface of the flexible board; and a heat release member configured to absorb heat from the bottom electrode part and release the heat to outside. The heat release member is arranged close to said second surface of the flexible board at a position where the bottom electrode part is mounted.

Abstract translation: 光学模块包括：柔性板，其具有安装有部件的第一表面和与第一表面相对的第二表面; 具有底面的底部电极部分，其上设置有放热电极，所述底部电极部分安装在所述柔性板的第一表面上; 以及散热构件，其构造成从底部电极部吸收热量并将热量释放到外部。 散热构件在安装底部电极部分的位置处靠近柔性板的第二表面设置。

公开(公告)号：US09506637B2

公开(公告)日：2016-11-29

申请号：US14472075

申请日：2014-08-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Hyun Gyu Park ,  Min Jae Kim ,  Se Woong Na ,  In Hee Cho ,  Man Hue Choi ,  Seung Kwon Hong

IPC: F21V7/04 ,  F21V21/14 ,  F21V8/00 ,  H05K1/02 ,  H05K3/00 ,  H05K1/05 ,  G02F1/1335

CPC classification number: F21V21/14 ,  G02B6/0068 ,  G02B6/0091 ,  G02F1/133615 ,  H05K1/0278 ,  H05K1/028 ,  H05K1/056 ,  H05K3/0061 ,  H05K2201/0394 ,  H05K2201/09054 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2203/0195 ,  H05K2203/302

Abstract: Provided is a circuit board including: a support substrate including a first region and a second region extending to be bent from the first region; light emitting devices mounted to the first region of the support substrate; and a bending portion bent between the first region and the second region, wherein the bending portion comprises: an interconnection line arrangement portion that crosses an interconnection line; and an interconnection line protection portion disposed on the periphery of the interconnection line, wherein the interconnection line protection portion protrudes more than the interconnection line arrangement portion.

Abstract translation: 提供一种电路板，包括：支撑基板，包括第一区域和从第一区域延伸成弯曲的第二区域; 安装到支撑基板的第一区域的发光器件; 以及在所述第一区域和所述第二区域之间弯曲的弯曲部分，其中所述弯曲部分包括：穿过互连线的互连线布置部分; 以及布置在所述互连线的周边上的互连线路保护部分，其中所述互连线路保护部分比所述互连线路布置部分突出。

公开(公告)号：US09484515B2

公开(公告)日：2016-11-01

申请号：US13723680

申请日：2012-12-21

Applicant: Shimane Prefectural Government ,  Shimane Electronic Imafuku Works Co., Ltd.

Inventor： Satoshi Komatsubara ,  Kenichi Fukuda ,  Shinobu Otao ,  Toru Furuta

IPC: H01L33/00 ,  H01L33/64 ,  H01L25/075 ,  H01L33/60 ,  H05K1/02 ,  H01L33/48 ,  H01L33/62 ,  F21K99/00 ,  F21Y101/02 ,  F21Y105/00

CPC classification number: H01L33/644 ,  F21K9/00 ,  F21Y2101/00 ,  F21Y2105/10 ,  F21Y2105/16 ,  F21Y2115/10 ,  H01L25/0753 ,  H01L33/483 ,  H01L33/60 ,  H01L33/62 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/021 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided are a semiconductor light emitting module and a method of manufacturing the same, which allow achieving high luminance light emission as well as lightweight and compact features. In a semiconductor light emitting module (101), a projecting portion (202) serving as a reflecting member is formed on a metal thin plate (102) to surround a semiconductor light emitting element (104). The semiconductor light emitting element (104) is connected to a printed board (103) by using a wire (201), for example. The projecting portion (202) is formed by pressing and bending the metal thin plate (102) from a back surface, for example, to surround the element and to be higher than the semiconductor light emitting element (104).

Abstract translation: 提供了一种半导体发光模块及其制造方法，其可实现高亮度发光以及轻量且紧凑的特征。 在半导体发光模块（101）中，在金属薄板（102）上形成用作反射部件的突出部（202），以围绕半导体发光元件（104）。 半导体发光元件（104）例如通过使用导线（201）与印刷电路板（103）连接。 突出部（202）通过例如从后表面压入和弯曲金属薄板（102）而形成，以围绕元件并且高于半导体发光元件（104）。

公开(公告)号：US20160064604A1

公开(公告)日：2016-03-03

申请号：US14686152

申请日：2015-04-14

Applicant: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC.

Inventor： HOU-TE LIN ,  CHAO-HSIUNG CHANG ,  PIN-CHUAN CHEN ,  LUNG-HSIN CHEN

IPC: H01L33/20 ,  H01L33/62 ,  H01L33/50 ,  H01L33/56

CPC classification number: H01L33/20 ,  H01L33/502 ,  H01L33/56 ,  H01L33/62 ,  H01L33/644 ,  H05K1/05 ,  H05K3/284 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2201/10674

Abstract: A flip chip light emitting diode (LED) packaging structure, including a substrate, an LED chip including a P electrode and a N electrode. A protruding platform is formed in a center of the substrate. The protruding platform includes a first connecting portion and a second connecting portion electrically insulating from each other. The P electrode and the N electrode is conductively fixed to the protruding platform by solder, and a bottom edge of the P electrode and the N electrode are beyond a top edge of the protruding platform.

Abstract translation: 一种倒装芯片发光二极管（LED）封装结构，包括基板，包括P电极和N电极的LED芯片。 在基板的中心形成突出平台。 突出平台包括彼此电绝缘的第一连接部分和第二连接部分。 P电极和N电极通过焊料导电地固定到突出平台，并且P电极和N电极的底部边缘超过突出平台的顶部边缘。

公开(公告)号：US09074735B2

公开(公告)日：2015-07-07

申请号：US14230352

申请日：2014-03-31

Applicant: LITE-ON OPTO TECHNOLOGY (CHANGZHOU) CO., LTD. ,  LITE-ON TECHNOLOGY CORPORATION

Inventor： Chen-Hsiu Lin ,  Chia-Hao Wu

IPC: H01L33/00 ,  F21K99/00 ,  H01L33/60 ,  H01L33/40 ,  H01L33/10 ,  H01L33/48 ,  F21Y101/02 ,  F21Y105/00

CPC classification number: F21K9/00 ,  F21Y2105/10 ,  F21Y2115/10 ,  H01L33/10 ,  H01L33/405 ,  H01L33/486 ,  H01L33/60 ,  H01L2224/48091 ,  H05K1/021 ,  H05K2201/09054 ,  H05K2201/10106 ,  H01L2924/00014

Abstract: A light emitting diode (LED) package including a substrate unit, a light emitting unit and an encapsulant. The substrate unit includes a metal substrate and a circuit board. The metal substrate has a first carrier portion and a second carrier portion. The second carrier portion is projected from the first carrier portion. The first carrier portion has a first carrier face. The second carrier portion has a second carrier face located higher than the first carrier face. The circuit board is disposed on the first carrier face, and the second carrier portion passes through the circuit board. The light emitting unit includes at least one LED chip disposed on the second carrier face of the second carrier portion, and the LED chip electrically connected to the circuit board. The encapsulant encapsulates the LED chip.

Abstract translation: 一种包括基板单元，发光单元和密封剂的发光二极管（LED）封装。 基板单元包括金属基板和电路板。 金属基板具有第一载体部分和第二载体部分。 第二载体部分从第一载体部分突出。 第一载体部分具有第一载体面。 第二载体部分具有位于比第一载体面高的第二载体面。 电路板设置在第一载体面上，第二载体部分通过电路板。 发光单元包括设置在第二载体部分的第二载体面上的至少一个LED芯片，以及电连接到电路板的LED芯片。 密封剂封装了LED芯片。

公开(公告)号：US08777463B2

公开(公告)日：2014-07-15

申请号：US13167387

申请日：2011-06-23

Applicant: Paul Pickard ,  Curt Progl

Inventor： Paul Pickard ,  Curt Progl

IPC: F21V21/00

CPC classification number: F21V29/004 ,  F21K9/233 ,  F21V7/0008 ,  F21V29/51 ,  F21V29/74 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106

Abstract: An assembly for use in a solid state directional lamp is disclosed. The assembly includes a multilayer FR4 printed circuit board and a metal heat spreader assembled with the multilayer FR4 printed circuit board. The assembly is configured to mount a plurality of solid state light emitters. The multilayer FR4 printed circuit board defines an aperture and a least a portion of the metal heat spreader is positioned in the aperture of the multilayer FR4 printed circuit board. The portion of the heat spreader positioned in the aperture of the multilayer FR4 printed circuit board is in communication with heat dissipation means.

Abstract translation: 公开了一种用于固态定向灯的组件。 组件包括多层FR4印刷电路板和与多层FR4印刷电路板组装的金属散热器。 组件被配置成安装多个固态发光器。 多层FR4印刷电路板限定孔，并且金属散热器的至少一部分位于多层FR4印刷电路板的孔中。 位于多层FR4印刷电路板的孔中的散热器的部分与散热装置连通。

公开(公告)号：US20140190727A1

公开(公告)日：2014-07-10

申请号：US13738599

申请日：2013-01-10

Applicant: STARLITE LED USA

Inventor： Emily Yu-Hsuan Lee ,  Pao Hsu Chen ,  Chang Han

IPC: H05K1/02 ,  H05K13/00

CPC classification number: H05K1/028 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10106 ,  Y10T29/49155

Abstract: A flexible metal core printed circuit board assembly comprises a flexible printed circuit board structure. The flexible printed circuit board structure includes a flexible substrate, a conductive layer on the flexible substrate and a space formed in the flexible printed circuit board structure. The space extends through the flexible printed circuit board structure. The flexible metal core printed circuit board assembly further comprises a flexible conductive structure having a pillar. The flexible conductive structure is provided underneath the flexible printed circuit board structure with the pillar disposed in the space. The pillar has a top surface that is in a planar surface with a top surface of the flexible printed circuit board structure.

Abstract translation: 柔性金属芯印刷电路板组件包括柔性印刷电路板结构。 柔性印刷电路板结构包括柔性基板，柔性基板上的导电层和形成在柔性印刷电路板结构中的空间。 该空间延伸穿过柔性印刷电路板结构。 柔性金属芯印刷电路板组件还包括具有支柱的柔性导电结构。 柔性导电结构设置在柔性印刷电路板结构的下方，柱体设置在空间中。 支柱具有位于柔性印刷电路板结构的顶表面的平坦表面中的顶表面。