公开(公告)号：US20080164054A1

公开(公告)日：2008-07-10

申请号：US11971854

申请日：2008-01-09

Applicant: Dong-Woo SHIN ,  Dong-Chun LEE ,  Seong-Chan HAN ,  Hyo-Jae BANG ,  Si-Suk KIM ,  Su-Jin JUNG

Inventor： Dong-Woo SHIN ,  Dong-Chun LEE ,  Seong-Chan HAN ,  Hyo-Jae BANG ,  Si-Suk KIM ,  Su-Jin JUNG

IPC: H05K1/00 ,  B23K31/00

CPC classification number: B23K1/0016 ,  B23K1/20 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Example embodiments of the present invention include a printed circuit board (PCB) capable of controlling the size and position of voids during a surface mounting process. To this end, the PCB includes: an insulating plate made of an insulating material; printed circuit patterns formed on the insulating plate; a plurality of lands to support a plurality of solder joints, each land coupled to one end of each of the printed circuit patterns; and anti-wetting layers mounted on a surface of each of the lands for solder joint therein. The anti-wetting layers allow a void produced during a surface mounting process to move to a central surface on a pad, so that the solder joint reliability between the solder ball and the land is increased. As a result, the reliability of a semiconductor device is enhanced.

Abstract translation: 本发明的示例性实施例包括能够在表面安装处理期间控制空隙的尺寸和位置的印刷电路板（PCB）。 为此，PCB包括：由绝缘材料制成的绝缘板; 形成在绝缘板上的印刷电路图案; 多个焊盘以支撑多个焊点，每个焊盘连接到每个印刷电路图案的一端; 以及安装在每个焊盘的表面上的防润湿层，用于焊接接头。 抗潮湿层允许在表面安装过程期间产生的空隙移动到焊盘上的中心表面，使得焊球和焊盘之间的焊点可靠性增加。 结果，提高了半导体器件的可靠性。

公开(公告)号：US07381905B2

公开(公告)日：2008-06-03

申请号：US11138314

申请日：2005-05-27

Applicant: Shinichi Yoshioka

Inventor： Shinichi Yoshioka

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K1/0206 ,  H05K3/341 ,  H05K3/3452 ,  H05K2201/09572 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/0455 ,  Y02P70/613

Abstract: A structure is disclosed for fixing an electronic device having a heat-releasing plate to a substrate. The structure includes a substrate, a land portion which is formed on a front face of the substrate and on which said heat-releasing plate of the electronic device is to be soldered, a through-hole formed in and penetrating said substrate and said land portion. The through-hole is adapted to release heat generated in the electronic device. The structure further includes a partitioning portion provided to be positioned between the heat-releasing plate and the land portion. The partitioning portion is adapted for preventing a solder, which should partially run out from a specific edge portion of the heat-releasing plate on soldering the heat-releasing plate to the land portion, from partially flowing into the through-hole.

Abstract translation: 公开了一种用于将具有散热板的电子装置固定到基板的结构。 该结构包括：基板，形成在基板的前表面上并且其上要焊接电子设备的散热板的接合部，形成并穿透所述基板的通孔和所述接地部分 。 通孔适于释放在电子设备中产生的热量。 该结构还包括设置在定位在散热板和陆部之间的分隔部分。 分隔部适于防止在将散热板焊接到台面部分时部分地从散热板的特定边缘部分流出的焊料部分地流入通孔。

公开(公告)号：US20080023834A1

公开(公告)日：2008-01-31

申请号：US11867527

申请日：2007-10-04

Applicant: Tz-Cheng Chiu ,  Manjula Variyam

Inventor： Tz-Cheng Chiu ,  Manjula Variyam

IPC: H01L23/488

CPC classification number: H05K3/4007 ,  H01L2224/05557 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/111 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0367 ,  H05K2201/099 ,  H05K2201/09909 ,  H01L2924/00

Abstract: A raised solder-mask-defined (SMD) pad configured for receiving a solder ball on a laminate electronic circuit board and a method of creating the raised SMD pad on a laminate electronic circuit board. The method may comprise forming a base bump, covering the base bump with a conductive bump layer and layering a surrounding material over an extended edge of the conductive bump layer. The surrounding material is patterned to expose a pad face and of a portion of the sides of the conductive bump layer, such that the pad face is disposed above the surface of the surrounding material. The surrounding material may be patterned by a photolithography operation or alternatively, a laser-drill operation.

Abstract translation: 一种凸起的焊接掩模限定（SMD）焊盘，其被配置为在叠层电子电路板上接收焊球，以及在叠层电子电路板上形成升高的SMD焊盘的方法。 该方法可以包括形成基底凸起，用导电凸起层覆盖基底凸起并且在导电凸块层的延伸边缘上层叠围绕材料。 将周围材料图案化以暴露出导电凸块层的焊盘面和侧面的一部分，使得焊盘面设置在周围材料的表面上方。 周围的材料可以通过光刻操作或者激光钻孔操作来构图。

公开(公告)号：US07323770B2

公开(公告)日：2008-01-29

申请号：US11302144

申请日：2005-12-14

Applicant: Shinji Moriyama ,  Tomio Yamada

Inventor： Shinji Moriyama ,  Tomio Yamada

IPC: H01L23/52

CPC classification number: H01L23/13 ,  H01L23/10 ,  H01L23/3121 ,  H01L23/3677 ,  H01L23/49811 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/50 ,  H01L23/66 ,  H01L24/48 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3025 ,  H03G3/3042 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/183 ,  H05K3/3405 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/099 ,  H05K2201/09909 ,  H05K2201/10371 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A hybrid integrated circuit device having high mount reliability comprises a module substrate which is a ceramic wiring substrate, a plurality of electronic component parts laid out on the main surface of the module substrate, a plurality of electrode terminals laid out on the rear surface of the module substrate, and a cap which is fixed to the module substrate to cover the main surface of the module substrate. The electrode terminals include a plurality of electrode terminals which are aligned along the edges of the module substrate and power voltage supply terminals which are located inner than these electrode terminals. The electrode terminals aligned along the substrate edges are coated, at least in their portions close to the substrate edge, with a protection film having a thickness of several tens micrometers or less. Connection reinforcing terminals consist of a plurality of divided terminals which are independent of each other, and are ground terminals.

Abstract translation: 具有高安装可靠性的混合集成电路装置包括：模块基板，其是陶瓷布线基板，布置在模块基板的主表面上的多个电子部件部件，布置在模块基板的后表面上的多个电极端子 模块基板和固定到模块基板以覆盖模块基板的主表面的盖。 电极端子包括沿着模块基板的边缘排列的多个电极端子和位于内部的电源电压端子。 沿着基板边缘排列的电极端子至少在其靠近基板边缘的部分中涂覆有几十微米或更小的厚度的保护膜。 连接加强端子由彼此独立的多个分开的端子组成，并且是接地端子。

公开(公告)号：US20070153426A1

公开(公告)日：2007-07-05

申请号：US11698034

申请日：2007-01-26

Applicant: Mitsuhiro Izumi ,  Mitsuaki Yoshida ,  Hisashi Kaneko ,  Tsuneyori Ino ,  Yukihiro Komura ,  Shinji Fujimoto ,  Kei Funabashi

Inventor： Mitsuhiro Izumi ,  Mitsuaki Yoshida ,  Hisashi Kaneko ,  Tsuneyori Ino ,  Yukihiro Komura ,  Shinji Fujimoto ,  Kei Funabashi

IPC: G11B5/55

CPC classification number: G11B33/121 ,  G11B5/4846 ,  G11B33/08 ,  G11B33/122 ,  H05K1/0269 ,  H05K1/0393 ,  H05K3/0058 ,  H05K3/281 ,  H05K3/363 ,  H05K2201/0133 ,  H05K2201/058 ,  H05K2201/09063 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/09918 ,  H05K2201/10386 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/2045 ,  H05K2203/0191 ,  H05K2203/166 ,  H05K2203/167

Abstract: A fixing member is spaced from a head actuator by a predetermined distance. A flexible printed circuit board extends at least from the head actuator to the fixing member. The flexible printed circuit board is superposed on the surface of the fixing member. A viscoelastic layer and a protecting layer are over laid on the surface of the flexible printed circuit board. A clip clips all the fixing member, the flexible printed circuit board, the viscoelastic layer and the protecting layer together. When a head slider is positioned, the head actuator changes its attitude relative to a recording disk. The inertial force based on the rotation causes the first flexible printed circuit board to vibrate when the actuator block stops rotating. The viscoelastic layer serves to absorb this residual vibration of the first flexible printed circuit board. Vibration of the flexible printed circuit board can be suppressed.

Abstract translation: 固定构件与头致动器间隔预定距离。 柔性印刷电路板至少从头致动器延伸到固定构件。 柔性印刷电路板叠置在固定部件的表面上。 在柔性印刷电路板的表面上覆盖粘弹性层和保护层。 A夹将所有固定构件，柔性印刷电路板，粘弹性层和保护层夹在一起。 当头部滑块定位时，头部致动器相对于记录盘改变其姿态。 当致动器块停止转动时，基于旋转的惯性力使第一柔性印刷电路板振动。 粘弹性层用于吸收第一柔性印刷电路板的残余振动。 可以抑制柔性印刷电路板的振动。

公开(公告)号：US20070152330A1

公开(公告)日：2007-07-05

申请号：US11485964

申请日：2006-07-14

Applicant: Sung-Fei Wang

Inventor： Sung-Fei Wang

IPC: H01L23/48 ,  H01L21/44

CPC classification number: H01L24/10 ,  H01L23/49838 ,  H01L24/13 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05011 ,  H01L2224/05023 ,  H01L2224/051 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/14 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/094 ,  H05K2201/099 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A package structure and a manufacturing method thereof are provided. The package structure includes a chip, a substrate and a solder. The chip includes a bump disposed on the surface of the chip. The substrate includes a pad and a solder resistor layer. The pad is disposed on the surface of the substrate and corresponds to the bump. The solder resistor layer is disposed on the surface of the substrate. The solder resistor layer has an opening for exposing the pad. The ratio of the width of the opening to the diameter of the bump ranges between 1 and 1.5. The solder is disposed in the opening and around the bump. The solder, the bump and the pad are welded together for electrically connecting the chip and the substrate.

Abstract translation: 提供一种封装结构及其制造方法。 封装结构包括芯片，基板和焊料。 芯片包括设置在芯片表面上的凸块。 衬底包括衬垫和焊料电阻层。 衬垫设置在衬底的表面上并对应于凸块。 焊料电阻层设置在基板的表面上。 焊料电阻层具有用于使焊盘露出的开口。 开口宽度与凸起直径之比在1和1.5之间。 焊料设置在开口中并且在凸块周围。 将焊料，凸块和焊盘焊接在一起以电连接芯片和基板。

公开(公告)号：US20070114674A1

公开(公告)日：2007-05-24

申请号：US11285001

申请日：2005-11-22

Applicant: Matthew Brown

Inventor： Matthew Brown

IPC: H01L23/48

CPC classification number: H05K1/111 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05557 ,  H01L2224/05567 ,  H01L2224/05569 ,  H01L2224/05572 ,  H01L2224/13 ,  H01L2224/13021 ,  H01L2224/13023 ,  H01L2224/13099 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H05K3/243 ,  H05K3/3452 ,  H05K3/3457 ,  H05K2201/0367 ,  H05K2201/09736 ,  H05K2201/099 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2924/00012

Abstract: Disclosed herein is a solder pad interface for a solder joint on a substrate. The solder pad interface includes a soldermask defined (SMD) interface between a solder pad (202) and the substrate, and a non-soldermask defined (NSMD) interface between the solder pad and the solder joint. The SMD interface can include a layer of insulating material (208) configured as an overlaid stencil with apertures through which the NSMD interface of the solder pad is substantially accessible. The SMD interface can include a soldermask (210) configured to cover an outer portion (212) of the solder pad. The NSMD interface includes a raised central portion (214) of the solder pad having a top. The layer of insulating material can be substantially flush with the top of the raised central portion. The raised central portion can provide the NSMD interface between the solder pad and the solder joint.

Abstract translation: 这里公开了一种用于衬底上的焊接接头的焊盘界面。 焊盘接口包括在焊盘（202）和衬底之间限定的（SMD）接口和在焊料焊盘和焊接接头之间的非焊接掩模界定（NSMD）界面。 SMD接口可以包括被配置为具有孔的覆盖模板的绝缘材料层（208），焊料垫的NSMD界面基本可接近。 SMD接口可以包括被配置为覆盖焊盘的外部部分（212）的焊接掩模（210）。 NSMD接口包括具有顶部的焊盘的凸起的中心部分（214）。 绝缘材料层可以与凸起的中心部分的顶部基本齐平。 凸起的中心部分可以在焊盘和焊点之间提供NSMD接口。

公开(公告)号：US20070108257A1

公开(公告)日：2007-05-17

申请号：US11280419

申请日：2005-11-16

Applicant: Chih-Chin Liao ,  Ken Wang ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Jack Chien ,  Shrikar Bhagath ,  Cheemen Yu ,  Hem Takiar

Inventor： Chih-Chin Liao ,  Ken Wang ,  Han-Shiao Chen ,  Chin-Tien Chiu ,  Jack Chien ,  Shrikar Bhagath ,  Cheemen Yu ,  Hem Takiar

IPC: B23K31/02 ,  B23K31/00

CPC classification number: H05K1/111 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3452 ,  H05K2201/09427 ,  H05K2201/09663 ,  H05K2201/0989 ,  H05K2201/099 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10727 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/00014

Abstract: A semiconductor package having a low profile is disclosed. In embodiments, a surface mounted component may be mounted directly to the core of the semiconductor package substrate, so that there is no conductive layer, plating layers or solder paste between the component and the substrate core. The surface mounted component may be any type of component which may be surface mounted on a substrate according to an SMT process, including for example passive components and various packaged semiconductors.

Abstract translation: 公开了一种具有低轮廓的半导体封装。 在实施例中，表面安装部件可以直接安装到半导体封装基板的芯部，使得在部件和基板芯之间不存在导电层，镀层或焊膏。 表面安装部件可以是根据SMT工艺可以表面安装在基板上的任何类型的部件，包括例如无源部件和各种封装半导体。

公开(公告)号：US20070096327A1

公开(公告)日：2007-05-03

申请号：US11476557

申请日：2006-06-29

Applicant: Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

Inventor： Yoichiro Kawamura ,  Shigeki Sawa ,  Katsuhiko Tanno ,  Hironori Tanaka ,  Naoaki Fujii

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H05K3/3478 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2224/81192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H05K3/3452 ,  H05K2201/0191 ,  H05K2201/099 ,  H05K2203/041 ,  H05K2203/0557 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A printed wiring board comprises a wiring substrate provided with at least one conductor circuit, a solder resist layer formed on the surface of the wiring substrate, covering the at least one conductor circuit, conductor pads formed on a part of the at least one conductor circuit exposed from respective openings provided in the solder resist layer for mounting electronic parts, and solder bumps formed on the respective conductor pads. Connection reliability and insulation reliability are easily improved by making the ratio (H/D) of a height H from solder resist layer surface the solder bump to an opening diameter of the opening about 0.55 to about 1.0 even in narrow pitch structure under the pitch of the opening provided in the solder resist layer of about 200 μm or less.

Abstract translation: 一种印刷电路板，包括设置有至少一个导体电路的布线基板，形成在所述布线基板的表面上的阻焊层，覆盖所述至少一个导体电路，形成在所述至少一个导体电路的一部分上的导体焊盘 从设置在用于安装电子部件的阻焊层中的各个开口露出，以及形成在各个导体焊盘上的焊料凸块。 通过使窄阻抗层的高度H与焊锡凸块的比例（H / D）在开口直径大约0.55至1.0左右，在窄间距结构下，在距离 设置在阻焊层中的开口约为200μm以下。

公开(公告)号：US07185799B2

公开(公告)日：2007-03-06

申请号：US10812625

申请日：2004-03-29

Applicant: Tom E. Pearson ,  Dudi I. Amir ,  Terrance J. Dishongh

Inventor： Tom E. Pearson ,  Dudi I. Amir ,  Terrance J. Dishongh

IPC: B23K31/02 ,  H05K1/11

CPC classification number: H05K3/3436 ,  H01L21/4853 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K1/0263 ,  H05K1/162 ,  H05K3/3452 ,  H05K2201/09236 ,  H05K2201/094 ,  H05K2201/099 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00

Abstract: Solder connections are created between the substrate of an electronic package and a circuit board having lengths that are longer than the width. The solder connections are created by locating solder balls of power or ground connections close enough to one another so that, upon reflow to the circuit board the solder balls combine, creating a larger solder connection. Signal solder balls, however, remain separated. The power or ground solder balls on a particular bond pad are separated from one another by portions of a removable solder mask that keep the solder balls spherical in shape during solder ball attachment to the electronic package. However, it is removed prior to reflow to the circuit board, thus creating a larger, longer solder connection between the electronic package and circuit board.

Abstract translation: 在电子封装的基板和长度大于宽度的电路板之间产生焊接连接。 焊接连接是通过将功率或接地连接的焊球定位得彼此靠近而形成的，使得当回流到电路板时，焊球组合，产生更大的焊接连接。 然而，信号焊球保持分离。 特定接合焊盘上的电源或接地焊球通过可拆卸焊接掩模的一部分彼此分开，以在焊球附着到电子封装期间使焊球保持球形。 然而，它在回流到电路板之前被去除，从而在电子封装和电路板之间产生更大的更长的焊接连接。