公开(公告)号：US07425139B2

公开(公告)日：2008-09-16

申请号：US11554805

申请日：2006-10-31

Applicant: Cheng-Chia Hsu ,  Teng-Kang Chang ,  Yu-Cheng Pan

Inventor： Cheng-Chia Hsu ,  Teng-Kang Chang ,  Yu-Cheng Pan

IPC: H01R12/00

CPC classification number: H01R33/09 ,  H05K3/308 ,  H05K2201/10113 ,  H05K2201/10401 ,  H05K2201/1059 ,  Y10S439/915

Abstract: In a fixation structure for fixing a lamp on a printed circuit board (PCB), a connection end of the lamp is received within a connection hole of the PCB and a sleeve having approximately cone shape is disposed between the lamp and the PCB. When the connection end of the lamp is continuously inserted into the connection hole of the PCB, a contact area between the connection end and the connection hole is increased, thereby effectively enhancing a contact-and-on performance of the lamp and the PCB. Sleeves may be located on lamps leads or alternatively placed in the connection hole of the PCB.

Abstract translation: 在用于将灯固定在印刷电路板（PCB）上的固定结构中，灯的连接端被接收在PCB的连接孔内，并且具有近似锥形的套筒设置在灯和PCB之间。 当灯的连接端连续插入到PCB的连接孔中时，连接端和连接孔之间的接触面积增加，从而有效地提高了灯和PCB的接触性能。 套管可以位于灯头上，或者可以放置在PCB的连接孔中。

公开(公告)号：US20060227551A1

公开(公告)日：2006-10-12

申请号：US11391841

申请日：2006-03-29

Applicant: Kenneth Houck

Inventor： Kenneth Houck

IPC: F21V33/00

CPC classification number: G02B6/0021 ,  F21V11/16 ,  F21W2111/00 ,  F21Y2115/10 ,  G02B6/0023 ,  H05K1/0274 ,  H05K1/182 ,  H05K2201/0108 ,  H05K2201/09063 ,  H05K2201/10113

Abstract: A circuit board assembly includes a light receiving surface that is capable of transmitting light through the circuit board. The light receiving surface is part of an opening within which an illumination device such as a light bulb is positioned. A slot or other opening is disposed between the light receiving surface and an area of the circuit board in which illumination is not desired. The slot prevents the transmission of light through the thickness of the circuit board and thereby provides for the blocking of light into areas of the circuit board that it is not desired.

Abstract translation: 电路板组件包括能够通过电路板传输光的光接收表面。 光接收表面是其中定位诸如灯泡的照明装置的开口的一部分。 狭缝或其他开口设置在光接收表面和不需要照明的电路板的区域之间。 插槽防止光通过电路板的厚度传输，从而提供将光阻挡在电路板的不希望的区域中。

公开(公告)号：US5660270A

公开(公告)日：1997-08-26

申请号：US618930

申请日：1996-03-20

Applicant: Elmer W. Martin ,  Peter J. Banks ,  David R. Ganser ,  John A. Stuhlmacher

Inventor： Elmer W. Martin ,  Peter J. Banks ,  David R. Ganser ,  John A. Stuhlmacher

IPC: H01H23/02 ,  H05K1/18 ,  H05K3/34 ,  H01H9/00

CPC classification number: H05K1/189 ,  H01H23/025 ,  H05K2201/055 ,  H05K2201/10113 ,  H05K2201/10446 ,  H05K2201/10651 ,  H05K3/3421

Abstract: An electrical switch having an internal lighting circuit which does not interfere with the movements of the internal components of the switch. The lighting circuit of the electrical switch employs a circuit board for connecting one or more lamps to electrical contacts disposed on a wall of the switch housing thereby avoiding the manufacturing problems and expenses associated with employing the extended lead wires found in prior art switches.

Abstract translation: 具有内部照明电路的电开关，其不干扰开关的内部部件的移动。 电气开关的照明电路采用电路板，用于将一个或多个灯连接到设置在开关壳体的壁上的电触点，从而避免与使用现有技术开关中发现的延长引线相关的制造问题和费用。

公开(公告)号：US4670813A

公开(公告)日：1987-06-02

申请号：US802924

申请日：1985-11-29

Applicant: Robert W. Reynolds

Inventor： Robert W. Reynolds

IPC: G01R31/02 ,  H01R29/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01R29/00 ,  H05K1/0293 ,  H05K1/0266 ,  H05K1/029 ,  H05K2201/09727 ,  H05K2201/10113 ,  H05K2203/1115 ,  H05K2203/173 ,  H05K2203/175

Abstract: An encodable printed circuit board is provided. The circuit board has a plurality of circuit runs disposed on its surface, each of the circuit runs corresponding to a unique bit in an encoded word. Each of the plurality of circuit runs includes a conductor which has a single necked-down section. This single necked-down section can be burned out with the passage of sufficient current through it.

Abstract translation: 提供可编码的印刷电路板。 电路板具有设置在其表面上的多个电路，每个电路对应于编码字中的唯一位。 多个电路运行中的每一个包括具有单个缩小部分的导体。 这个单一的颈缩部分可以通过足够的电流通过它燃烧。

公开(公告)号：US4261773A

公开(公告)日：1981-04-14

申请号：US105681

申请日：1979-12-20

Applicant: Vaughn C. Sterling

Inventor： Vaughn C. Sterling

IPC: H01R33/09 ,  H05K1/05 ,  H05K1/09 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  H01B17/26 ,  B32B3/26

CPC classification number: H01R33/09 ,  H05K3/225 ,  H05K1/053 ,  H05K1/095 ,  H05K2201/10113 ,  H05K2201/10651 ,  H05K2203/173 ,  H05K3/305 ,  H05K3/3421 ,  Y10S323/908 ,  Y10T428/12049 ,  Y10T428/12396 ,  Y10T428/20

Abstract: Means are provided to repair one or more flash lamps in a linear type photoflash lamp array which have become disconnected from the circuit board member. Specifically, the disconnected in-lead is secured to the sequential firing circuitry located on the circuit board member with an adhesive deposit of an organic polymer and a surface conductive path thereafter established on said adhesive deposit between the in-lead and the adjacent circuitry. The surface conductive path can also be an organic polymer containing an electrically conductive filler.

Abstract translation: 提供了用于修复已经与电路板构件断开的直线型闪光灯阵列中的一个或多个闪光灯的装置。 具体地，断开的引线被固定到位于电路板部件上的顺序点火电路，其中有机聚合物的粘合沉积物和其后在引线和相邻电路之间的所述粘合剂沉积物上建立的表面导电路径。 表面导电路径也可以是含有导电填料的有机聚合物。

公开(公告)号：US12101877B2

公开(公告)日：2024-09-24

申请号：US17182353

申请日：2021-02-23

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Zhen Huang ,  Junjie Zeng ,  Chenxiang Xu ,  Feifan Chen

IPC: G01S17/894 ,  G03B30/00 ,  H04N23/56 ,  H04N23/57 ,  H05K1/02

CPC classification number: H05K1/0296 ,  G01S17/894 ,  G03B30/00 ,  H04N23/56 ,  H04N23/57 ,  H05K1/0274 ,  H05K2201/10113 ,  H05K2201/10121

Abstract: The present disclosure provides a circuit board assembly, a TOF camera module including the circuit board assembly and applications thereof. The circuit board assembly is used to support an electronic component, and includes a conductive portion and an insulating portion. The insulating portion is integrally bonded to the conductive portion, and the conductive portion extends through the insulating portion. The electronic component is supported by the conductive portion and is communicated with the conductive portion, so that the electronic component directly dissipates heat through the conductive portion during operation.

公开(公告)号：US20190235684A1

公开(公告)日：2019-08-01

申请号：US15918157

申请日：2018-03-12

Applicant: Long ZHANG

Inventor： Long ZHANG ,  Xiaofeng CHEN

IPC: G06F3/041 ,  H05B37/02 ,  H05K1/18

CPC classification number: G06F3/0414 ,  H05B37/0272 ,  H05K1/18 ,  H05K2201/10113 ,  H05K2201/10121 ,  H05K2201/10136 ,  H05K2201/10151

Abstract: A touch-sensitive dimmer, configured to be electrically coupled to an illumination load to adjust an illuminance of the illumination load. It includes a hollow body, a power source printed circuit board assembly (PCBA) disposed inside the body, a control PCBA, and a touch-sensitive display panel, touch-sensing components and a display element disposed on the control PCBA. The display element displays changes of illumination load adjustment modes based on trigger signals generated by the touch-sensing components. The touch-sensitive display panel includes touch keys which correspond to the touch-sensing components and a display window which corresponds to the display element, and is assembled with the control printed circuit board assembly. The touch-sensitive dimmer combines touch-sensing functions and display screen functions to achieve intelligent control. By incorporating a wireless communication module, the dimmer can further achieve remote by a remote control device.

公开(公告)号：US20180192507A1

公开(公告)日：2018-07-05

申请号：US15736802

申请日：2016-05-18

Applicant: OSRAM GmbH

Inventor： Michael Schöwel ,  Peter Helbig ,  Jozsef Szekely ,  Sven Seifritz

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/02 ,  H05K3/46 ,  H05K3/00 ,  F21S41/19

CPC classification number: H05K1/0204 ,  F21S41/192 ,  H05K1/0203 ,  H05K1/0373 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/0061 ,  H05K3/02 ,  H05K3/202 ,  H05K3/284 ,  H05K3/4644 ,  H05K2201/0104 ,  H05K2201/0224 ,  H05K2201/068 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/2036

Abstract: A circuit support for an electronic circuit may include at least one conductor track, a first insulation material with which the at least one conductor track is encapsulated by injection molding so as to form an insulating matrix and so as to leave open at least one first region for the connection of at least one electronic component of the electronic circuit, and a heat sink. The conductor track is encapsulated by injection molding with the first insulation material in such a way that the insulating matrix furthermore leaves open at least one second region which is arranged between the conductor track and the heat sink. The circuit support may further include a large number of spacers which are designed and arranged in order to set a height of the second region. The circuit support may further include a second insulation material with which the second region is filled.

公开(公告)号：US20170290147A1

公开(公告)日：2017-10-05

申请号：US15623202

申请日：2017-06-14

Applicant: Taiwan Green Point Enterprises Co., Ltd.

Inventor： Pen-Yi LIAO ,  Hung-San PAN ,  Yu-Cheng CHEN ,  Hui-Ching CHUANG ,  Wen-Chia TSAI

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/18

CPC classification number: H05K3/0061 ,  H05K1/0203 ,  H05K1/0284 ,  H05K3/185 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2203/0709 ,  Y10T29/49156

Abstract: Disclosed herein is a circuit-and-heat-dissipation assembly which includes: a heat sink including a heat absorbing base and a heat dissipating element, the heat absorbing base having a circuit-forming surface and an element-forming surface, the heat dissipating element protruding from the element-forming surface for dissipating heat conducted from the heat absorbing base into an ambient environment; an insulator layer formed on the circuit-forming surface; and a patterned circuit formed on the insulator layer and having an electroless plating layer which has a patterned catalyst seed layer comprising an active metal and formed on the insulator layer, and a reduced metal layer formed on the catalyst seed layer. Also disclosed herein is a method of making the circuit-and-heat-dissipation assembly.

公开(公告)号：US09772101B2

公开(公告)日：2017-09-26

申请号：US14478327

申请日：2014-09-05

Applicant: Molex, LLC

Inventor： Yi-Tse Ho

IPC: F21S4/00 ,  F21V21/00 ,  F21V29/83 ,  F21V19/00 ,  F21V29/77 ,  H05K1/02 ,  H05K3/18 ,  F21K9/232 ,  F21V3/00 ,  H05K3/00 ,  H05K3/10 ,  H05K3/38 ,  F21Y115/10 ,  F21Y107/40

CPC classification number: F21V29/83 ,  F21K9/232 ,  F21V3/00 ,  F21V19/0055 ,  F21V29/77 ,  F21Y2107/40 ,  F21Y2115/10 ,  H05K1/0204 ,  H05K1/0209 ,  H05K1/0284 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/182 ,  H05K3/381 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/09154 ,  H05K2201/09645 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2201/10113 ,  H05K2201/10287 ,  H05K2201/10409 ,  H05K2203/107

Abstract: An illumination device comprises a holder, a plurality of light emitting elements, a translucent cover and a lamp cap structure. The holder comprises a heat dissipating base body and a carrying unit. The carrying unit is connected to a top portion of the heat dissipating base body and comprises a carrying base body, a circuit pattern and a heat dissipating pattern, the circuit pattern and the heat dissipating pattern are directly formed to a surface of the carrying base body, the circuit pattern has a plurality of mounting positions, the heat dissipating pattern at least extends from a region close to the mounting position to a region where the heat dissipating pattern can contact the heat dissipating base body. The plurality of light emitting elements are respectively provided at the plurality of the mounting positions and establish an electrical connection with the circuit pattern.