公开(公告)号：US20060139892A1

公开(公告)日：2006-06-29

申请号：US10543398

申请日：2003-12-18

Applicant: Cornelis Mies

Inventor： Cornelis Mies

IPC: H05K7/20

CPC classification number: H05K7/20518 ,  H05K1/0203 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10659

Abstract: An electronic appliance, such as a computer and the like, comprising a printed circuit board with printed circuits arranged thereon and electromagnetic components electrically connected thereto, as well as a heat dissipating arrangement for dissipating heat generated by the components to the surrounding atmosphere, a special feature being the fact that the heat dissipating arrangement comprises a heat sink with several separate thermal conductors which are thermically connected to the printed circuits, which thermal conductors can be arranged on the printed circuit board in various positions, each position corresponding to a predetermined heat dissipation direction.

Abstract translation: 诸如计算机等的电子设备包括布置有印刷电路的印刷电路板和与其电连接的电磁部件，以及用于将组件产生的热量散发到周围大气的散热装置，特别的 特征在于散热装置包括散热器，散热器具有几个独立的热导体，其热连接到印刷电路，这些热导体可以以各种位置布置在印刷电路板上，每个位置对应于预定的散热 方向。

公开(公告)号：US07051432B2

公开(公告)日：2006-05-30

申请号：US10813841

申请日：2004-03-31

Applicant: Garry M. Loy ,  Kenneth C. Shuey

Inventor： Garry M. Loy ,  Kenneth C. Shuey

IPC: H05K3/30

CPC classification number: B23K1/0008 ,  B23K2101/32 ,  G01R22/065 ,  H01R13/193 ,  H05K3/308 ,  H05K3/368 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2203/0271 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/53174 ,  Y10T29/53183

Abstract: A preferred method for electrically connecting a first and a second component includes inserting a wire pin through a through hole formed in the first component so that a first portion of the wire pin is located within the through hole and a second portion of the wire pin is located within a retaining feature formed at least in part by the second component. The preferred method also includes moving one of the first and the second components in relation to the other of the first and the second components so that the wire pin resiliently deflects thereby establishing a first contact force between the first portion of the wire and the first component, and a second contact force between the second portion of the wire and the second component.

Abstract translation: 用于电连接第一和第二部件的优选方法包括将线销插入形成在第一部件中的通孔，使得线销的第一部分位于通孔内，并且引线的第二部分是 位于至少部分地由第二部件形成的保持特征内。 优选的方法还包括相对于第一和第二部件中的另一个部件移动第一和第二部件中的一个，使得线销弹性偏转，从而在导线的第一部分和第一部件之间建立第一接触力 和第二部分之间的第二接触力。

公开(公告)号：US20060110164A1

公开(公告)日：2006-05-25

申请号：US10993251

申请日：2004-11-19

Applicant: Kirk Cook ,  Yung-Shun Wu ,  James Duncan

Inventor： Kirk Cook ,  Yung-Shun Wu ,  James Duncan

IPC: H04B10/00

CPC classification number: G02B6/4201 ,  G02B6/4246 ,  G02B6/428 ,  H05K1/14 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/10121 ,  H05K2201/10303 ,  H05K2201/10446

Abstract: A transceiver including a transmitter, a receiver, a first printed circuit board assembly, and a second printed circuit board assembly. The transmitter is configured to convert electrical signals to fiber optic signals. The receiver is configured to convert fiber optic signals to electrical signals. The first printed circuit board assembly is electrically coupled with the transmitter and configured to be electrically coupled with a host system via a first plurality of host interface pins. The second printed circuit board assembly is electrically coupled with the receiver and configured to be electrically coupled with the host system via a second plurality of host interface pins.

Abstract translation: 收发器包括发射器，接收器，第一印刷电路板组件和第二印刷电路板组件。 发射器被配置为将电信号转换成光纤信号。 接收器被配置为将光纤信号转换成电信号。 第一印刷电路板组件与发射器电耦合并且被配置为经由第一多个主机接口引脚与主机系统电耦合。 第二印刷电路板组件与接收器电耦合并且被配置成经由第二多个主机接口引脚与主机系统电耦合。

公开(公告)号：US06974263B2

公开(公告)日：2005-12-13

申请号：US11033722

申请日：2005-01-13

Applicant: Shunsuke Sato ,  Naoki Nishiyama

Inventor： Shunsuke Sato ,  Naoki Nishiyama

IPC: G02B6/42 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  G02B6/36 ,  G02B6/00 ,  H05K7/00

CPC classification number: G02B6/4201 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/2036 ,  H05K2203/1572

Abstract: An optical data link 20 comprises a mounting member 22, an optical element assembly 24, a circuit board 26, and a spacer 32. The PGA substrate 22 has a substrate 22a and a plurality of electrically conductive pins 22b. The circuit board 26 has a pair of surfaces. Electronic components 34a to 34e are mounted on the pair of surfaces. The optical element assembly 24 includes a semiconductor optical element 24f. The semiconductor optical element 24f is connected to an electrically conductive layer on the circuit board 26. The spacer 32 functions so as to distance the circuit board 26 from the PGA substrate 22. Since the circuit board 26 is distanced from the PGA substrate 22, the electronic components 34a to 34e can be mounted on both surfaces of the circuit board 22.

Abstract translation: 光学数据链路20包括安装构件22，光学元件组件24，电路板26和间隔件32。 PGA基板22具有基板22a和多个导电销22b。 电路板26具有一对表面。 电子部件34a至34e安装在该对表面上。 光学元件组件24包括半导体光学元件24f。 半导体光学元件24f连接到电路板26上的导电层。 间隔件32用于使电路板26与PGA基板22间隔开。 由于电路板26远离PGA基板22，电子部件34a至34e可以安装在电路板22的两个表面上。

公开(公告)号：US20050212122A1

公开(公告)日：2005-09-29

申请号：US10863153

申请日：2004-06-07

Applicant: Michael Duggan ,  Nazario Lopes

Inventor： Michael Duggan ,  Nazario Lopes

IPC: H01L21/44 ,  H01L23/34 ,  H05K1/14 ,  H05K3/34

CPC classification number: H05K1/144 ,  H05K3/3447 ,  H05K2201/10166 ,  H05K2201/10303

Abstract: A power array includes a plurality of FET power assemblies and each FET power assembly has at least one field effect transformer mounted to a circuit board. The circuit boards are arranged atop each other. A power supply pin extends through the circuit boards and is connected to a power input of each field effect transformer. A power output of each FET power assembly is connected to a power output pin which extends through each of the circuit boards. A heat sink is mounted to the power array beneath the lowest FET power assembly and is thermally connected to the field effect transformers of each FET power assembly. A method of assembling a power array including a plurality of FET power assemblies with at least one field effect transformer.

Abstract translation: 功率阵列包括多个FET功率组件，并且每个FET功率组件具有安装到电路板的至少一个场效应变换器。 电路板彼此顶置。 电源引脚延伸穿过电路板，并连接到每个场效应变压器的电源输入。 每个FET功率组件的功率输出连接到延伸穿过每个电路板的功率输出引脚。 散热器安装在最低FET功率组件下方的功率阵列上，并且热连接到每个FET功率组件的场效应变压器。 一种组装具有至少一个场效应变压器的多个FET功率组件的功率阵列的方法。

公开(公告)号：US06941537B2

公开(公告)日：2005-09-06

申请号：US10067244

申请日：2002-02-07

Applicant: Rebecca A. Jessep ,  David W. Boggs ,  Carolyn McCormick ,  John H. Dungan ,  Daryl A. Sato

Inventor： Rebecca A. Jessep ,  David W. Boggs ,  Carolyn McCormick ,  John H. Dungan ,  Daryl A. Sato

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K1/14 ,  H05K3/30 ,  G06F17/50

CPC classification number: H01L24/81 ,  H01L23/49811 ,  H01L23/49827 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/1319 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01057 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/351 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/145 ,  H05K3/303 ,  H05K3/308 ,  H05K2201/09809 ,  H05K2201/10022 ,  H05K2201/10303 ,  H05K2201/1053 ,  H05K2201/10568 ,  H05K2201/10659 ,  H05K2201/10734 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A standoff device provides predetermined control of a standoff distance between electrical components mounted together with opposing conductive grid array patterns. In an embodiment, a predetermined electrical function is provided by the device to at least one of the electrical components. The standoff device comprises a plurality of rigid one-piece standoff pins which, in an embodiment, contains one or more stops which buttress against the electrical components to serve as a distancing control structure. In an embodiment, the standoff device is integral with one of the electrical components.

Abstract translation: 对接装置提供了通过相对的导电栅格阵列图案安装在一起的电气部件之间的间隔距离的预定控制。 在一个实施例中，预定的电功能由该装置提供给至少一个电气部件。 间隔装置包括多个刚性的一体式支座销，在一个实施例中，该销钉包含一个或多个支撑电气部件以用作隔离控制结构的止挡件。 在一个实施例中，支座装置与电气部件之一是一体的。

公开(公告)号：US06939147B2

公开(公告)日：2005-09-06

申请号：US10337160

申请日：2003-01-06

Applicant: Cheol Seob Lee ,  Yang Youn Choi ,  Jong Keun Song

Inventor： Cheol Seob Lee ,  Yang Youn Choi ,  Jong Keun Song

IPC: B23K1/00 ,  B23K1/008 ,  B23K1/08 ,  B23K1/20 ,  H05K1/02 ,  H05K3/34 ,  H05K7/02 ,  H01R12/00 ,  H01K1/00

CPC classification number: B23K1/008 ,  B23K1/0016 ,  B23K1/08 ,  B23K1/20 ,  B23K2101/42 ,  H05K1/0263 ,  H05K3/3447 ,  H05K7/026 ,  H05K2201/10295 ,  H05K2201/10303

Abstract: A printed circuit board junction box including an outer case and a printed circuit board. The outer case has a top cover and a bottom cover. The printed circuit board has female and male electrical terminals mounted in through-holes that extend from an upper surface to a lower surface of the printed circuit board. One side of the printed circuit board has only male electrical terminals. The printed circuit board is soldered by raising a molten solder container to contact the lower surface of the printed circuit board. The printed circuit board is turned in a heating chamber so that the molten solder flows through the through-holes in the printed circuit board to solder the female and male electrical terminals to the printed circuit board.

Abstract translation: 一种印刷电路板接线盒，包括外壳和印刷电路板。 外壳具有顶盖和底盖。 印刷电路板具有安装在从印刷电路板的上表面延伸到下表面的通孔中的阴和阳电气端子。 印刷电路板的一侧只有公电端子。 通过升高熔融焊料容器来与印刷电路板的下表面接触来焊接印刷电路板。 印刷电路板在加热室中转动，使得熔融的焊料流过印刷电路板中的通孔，以将阴和阳电端子焊接到印刷电路板。

公开(公告)号：US20050135758A1

公开(公告)日：2005-06-23

申请号：US11033722

申请日：2005-01-13

Applicant: Shunsuke Sato ,  Naoki Nishiyama

Inventor： Shunsuke Sato ,  Naoki Nishiyama

IPC: G02B6/42 ,  H05K1/14 ,  H05K1/18 ,  H05K3/34 ,  G02B6/36

CPC classification number: G02B6/4201 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/141 ,  H05K1/144 ,  H05K1/182 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/2036 ,  H05K2203/1572

Abstract: An optical data link 20 comprises a mounting member 22, an optical element assembly 24, a circuit board 26, and a spacer 32. The PGA substrate 22 has a substrate 22a and a plurality of electrically conductive pins 22b. The circuit board 26 has a pair of surfaces. Electronic components 34a to 34e are mounted on the pair of surfaces. The optical element assembly 24 includes a semiconductor optical element 24f. The semiconductor optical element 24f is connected to an electrically conductive layer on the circuit board 26. The spacer 32 functions so as to distance the circuit board 26 from the PGA substrate 22. Since the circuit board 26 is distanced from the PGA substrate 22, the electronic components 34a to 34e can be mounted on both surfaces of the circuit board 22.

Abstract translation: 光学数据链路20包括安装构件22，光学元件组件24，电路板26和间隔件32.PGA基板22具有基板22a和多个导电销22b。 电路板26具有一对表面。 电子部件34a至34e安装在该对表面上。 光学元件组件24包括半导体光学元件24f。 半导体光学元件24f连接到电路板26上的导电层。间隔物32用于使电路板26与PGA基板22距离。由于电路板26远离PGA基板22， 电子部件34a至34e可以安装在电路板22的两个表面上。

公开(公告)号：US20050070131A1

公开(公告)日：2005-03-31

申请号：US10673652

申请日：2003-09-29

Applicant: Allen McLenaghan

Inventor： Allen McLenaghan

IPC: H01L23/48 ,  H01R12/00 ,  H01R13/20 ,  H01R13/24 ,  H05K3/32

CPC classification number: H01R13/2435 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/13011 ,  H01L2224/1308 ,  H01L2224/16227 ,  H01L2224/81193 ,  H01L2224/83899 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01R13/20 ,  H05K3/325 ,  H05K2201/0367 ,  H05K2201/10303 ,  H05K2201/10333

Abstract: An assembly of the present invention has an integrated circuit device electrically and mechanically connected to the substrate. At least one electrically conductive connecting element is on one of the substrate and circuit device and at least one socket is on the other of the substrate and circuit device. The socket receives the at least one connecting element and comprises at least two resilient members. The resilient members are biased against the connecting element so that the circuit device and the substrate are held in electrical and mechanical connection by the biasing force of the resilient members against the connecting element.

Abstract translation: 本发明的组件具有电气和机械连接到基板的集成电路装置。 至少一个导电连接元件位于基板和电路装置中的一个上，并且至少一个插座位于基板和电路装置的另一个上。 插座容纳至少一个连接元件并且包括至少两个弹性构件。 弹性构件被偏置抵靠连接元件，使得电路装置和基板通过弹性构件的抵抗连接元件的偏置力保持在电气和机械连接中。

公开(公告)号：US20050061544A1

公开(公告)日：2005-03-24

申请号：US10934455

申请日：2004-09-07

Applicant: Kiyoshi Nakakuki

Inventor： Kiyoshi Nakakuki

IPC: H05K1/05 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K3/46

CPC classification number: H05K1/147 ,  H05K3/0061 ,  H05K3/3447 ,  H05K3/363 ,  H05K2201/096 ,  H05K2201/0969 ,  H05K2201/09845 ,  H05K2201/10303 ,  H05K2201/10878

Abstract: A circuit board includes: a metallic plate having an opening; a flexible circuit board disposed on a first surface of the metallic plate; and a printed circuit board disposed in the opening of the metallic plate. The flexible circuit board is protruded to the opening of the metallic plate so that a part of the flexible circuit board is bonded to the printed circuit board. The printed circuit board includes a first land disposed on a first surface of the printed circuit board, which is disposed on the first surface of the metallic plate. The flexible circuit board includes a second land disposed on a first surface of the flexible circuit board, which is opposite to the metallic plate. The first and second lands are electrically connected each other with a connecting member.

Abstract translation: 电路板包括：具有开口的金属板; 设置在所述金属板的第一表面上的柔性电路板; 以及布置在金属板的开口中的印刷电路板。 柔性电路板突出到金属板的开口，使得柔性电路板的一部分结合到印刷电路板。 印刷电路板包括设置在印刷电路板的第一表面上的第一焊盘，该第一焊盘设置在金属板的第一表面上。 柔性电路板包括设置在柔性电路板的与金属板相对的第一表面上的第二焊盘。 第一和第二平台通过连接构件彼此电连接。