公开(公告)号：US20010045611A1

公开(公告)日：2001-11-29

申请号：US09141217

申请日：1998-08-27

Applicant: 3M Innovative Properties Company

Inventor： WILLIAM J. CLATANOFF ,  GAYLE R.T SCHUELLER ,  ROBERT J. SCHUBERT ,  YUSUKE SAITO ,  HIDEO YAMAZAKI ,  HIDEAKI YASUI

IPC: H01L023/48

CPC classification number: H01L24/32 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/10681 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

Abstract: A circuit includes a substrate having a dielectric layer with a first surface and a second surface. A conductive layer is formed on the first surface. A beveled via is formed in a dielectric layer of the substrate. The via has a first opening of a first width in the first surface, and a second opening of a second width in the second surface, the second width being greater than the first width. A conductive plug is connected to the conductive layer. The plug is formed in the via and extends from adjacent the first opening toward the second opening, and terminates adjacent the second opening at a plug interface surface. A conductive solder ball is connected to the plug interface surface and extends to protrude from the second surface.

Abstract translation: 电路包括具有第一表面和第二表面的电介质层的衬底。 导电层形成在第一表面上。 在基板的电介质层中形成斜面通孔。 通孔具有第一表面中的第一宽度的第一开口和第二表面中的第二宽度的第二开口，第二宽度大于第一宽度。 导电插头连接到导电层。 插塞形成在通孔中并且从邻近第一开口朝向第二开口延伸并且在插头接口表面处邻近第二开口终止。 导电焊球连接到插头接口表面并延伸以从第二表面突出。

公开(公告)号：US20010018225A1

公开(公告)日：2001-08-30

申请号：US09788503

申请日：2001-02-21

Inventor： Hideki Tanaka

IPC: H01L021/00

CPC classification number: H01L21/67132 ,  H01L2224/73204 ,  H05K1/028 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2201/09981 ,  H05K2201/10681

Abstract: A tape carrier type semiconductor device includes a flexible substrate, on which a driver circuit is mounted and on whose surface wiring is formed. Formed in the flexible substrate are the first slit for releasing external stress and the second slit for folding the tape carrier type semiconductor device. A connector for connecting both sides of the first slit is prepared at the center of the slit, whereby the unnecessary warp of the tape carrier type semiconductor device can be reduced.

Abstract translation: 载带型半导体器件包括其上安装有驱动电路并形成其表面布线的柔性基板。 形成在柔性基板中的是用于释放外部应力的第一狭缝和用于折叠带状半导体器件的第二狭缝。 在狭缝的中央准备用于连接第一狭缝的两侧的连接器，由此可以减少带状半导体器件的不必要的翘曲。

公开(公告)号：US20010009447A1

公开(公告)日：2001-07-26

申请号：US09793921

申请日：2001-02-28

Inventor： Masuyuki Ohta ,  Masahiro Ishi ,  Kikuo Ono ,  Nobuyuki Suzuki

IPC: G02F001/136 ,  G02F001/1333 ,  G02F001/1343

CPC classification number: G02F1/134363 ,  G02F1/133345 ,  G02F1/1368 ,  G02F2001/136218 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/10136 ,  H05K2201/10681

Abstract: An active matrix type liquid crystal display device including first and second substrates, a liquid crystal composition layer provided between the first and second substrates, a plurality of drain lines and gate lines formed on the first substrate and crossing each other in a matrix form, a plurality of counter lines formed on the first substrate, and a plurality of pixels formed by adjoining the drain lines and the gate lines. At least one counter electrode is formed on one of the drain lines with an insulating layer therebetween. A layer on which one of the counter lines is formed and a layer on which the at least one counter electrode formed are different, and the one of the counter lines and the at least one counter electrode for one of the pixels are connected via a through hole.

Abstract translation: 一种有源矩阵型液晶显示装置，包括第一和第二基板，设置在第一和第二基板之间的液晶组合物层，形成在第一基板上并以矩阵形式彼此交叉的多个排出线和栅极线， 形成在第一基板上的多个反向线，以及通过邻接漏极线和栅极线而形成的多个像素。 至少一个对电极形成在一条漏极线上，其间具有绝缘层。 其上形成有一个反向线的层和形成有至少一个对电极的层不同，并且用于一个像素的反向线和至少一个对电极之一经由通孔 孔。

公开(公告)号：US06201193B1

公开(公告)日：2001-03-13

申请号：US09302957

申请日：1999-04-30

Applicant: Nobuaki Hashimoto

Inventor： Nobuaki Hashimoto

IPC: H05K116

CPC classification number: H05K3/3457 ,  H01L2924/0002 ,  H05K1/0269 ,  H05K3/303 ,  H05K3/3421 ,  H05K3/3452 ,  H05K3/3489 ,  H05K3/46 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/09918 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2201/10977 ,  H05K2203/0143 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/0315 ,  H05K2203/043 ,  H05K2203/0485 ,  H05K2203/0588 ,  H05K2203/161 ,  Y02P70/613 ,  H01L2924/00

Abstract: A printed circuit board is provided to which a device such as a tape carrier package having a multiplicity of leads arranged with a small pitch is connected by a local heating method using a bonding tool. The upper surfaces of solder layers provided on lands formed on the printed circuit board are flattened prior to leads of an electronic part to be mounted being placed on the solder layers. The leads are soldered to the lands by being pressed and heated with the bonding tool. At least a region of the printed circuit board corresponding to the bottom surface of the bonding tool has a height lower than that of the leads superposed on the lands, so that the desired parallelism of the bottom surface of the bonding tool with respect to the printed circuit board is maintained. Positioning parts are provided in a region of the printed circuit board where the electronic part is to be mounted, to position the electronic part onto the printed circuit board.

Abstract translation: 提供一种印刷电路板，通过使用接合工具的局部加热方法连接诸如具有以小间距布置的多个引线的带状载体封装的装置。 在形成在印刷电路板上的焊盘上的焊料层的上表面在被安装在焊料层上的电子部件的引线之前变平。 用焊接工具将引线焊接到土地上。 对应于接合工具的底面的印刷电路板的至少一个区域的高度低于重叠在焊盘上的引线的高度，使得焊接工具的底面相对于印刷的期望的平行度 维护电路板。 定位部件设置在印刷电路板的要安装电子部件的区域中，以将电子部件定位到印刷电路板上。

公开(公告)号：US6146920A

公开(公告)日：2000-11-14

申请号：US113183

申请日：1998-07-10

Applicant: Kosuke Inoue ,  Tatsuya Yoneda ,  Takamichi Suzuki ,  Ryosuke Kimoto ,  Junichi Suzuki

Inventor： Kosuke Inoue ,  Tatsuya Yoneda ,  Takamichi Suzuki ,  Ryosuke Kimoto ,  Junichi Suzuki

IPC: H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H01L24/50 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/86 ,  H05K3/3478 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19042 ,  H05K2201/10681 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/081 ,  H05K2203/082 ,  H05K2203/1545 ,  Y10T29/5137 ,  Y10T29/5142

Abstract: A method for forming bumps in an LSI package in which: semiconductor chips are mounted onto a flexible printed circuit board; electrically conductive balls are temporarily fixed by using a fixing liquid including one selected from a group including flux, solder paste and an adhesive containing an electrically conductive agent, onto pads which are provided on the flexible printed circuit board so as to be electrically connected to the semiconductor chips; the flexible printed circuit board having the electrically conductive balls temporarily fixed thereto is wound up onto a reel; the flexible printed circuit board having the electrically conductive balls temporarily fixed thereto is fed out from the reel and heated to thereby form bumps thereon; and the flexible printed circuit board having the bumps formed thereon is wound up onto another reel; and the flexible printed circuit board is cleansed and trimmed to thereby form LSI packages.

Abstract translation: 一种用于在LSI封装中形成凸块的方法，其中：将半导体芯片安装在柔性印刷电路板上; 通过使用包括从包括焊剂，焊膏和含有导电剂的粘合剂组成的组中的一个的定影液临时固定到设置在柔性印刷电路板上的焊盘上，以便电连接到 半导体芯片; 将具有暂时固定在其上的导电球的柔性印刷电路板卷绕到卷轴上; 将具有临时固定的导电球的柔性印刷电路板从卷轴送出并加热，从而在其上形成凸块; 并且其上形成有凸块的柔性印刷电路板卷绕到另一个卷轴上; 并且柔性印刷电路板被清洁和修整，从而形成LSI封装。

公开(公告)号：US6050830A

公开(公告)日：2000-04-18

申请号：US947301

申请日：1997-10-08

Applicant: Shinichi Tanaka

Inventor： Shinichi Tanaka

IPC: H01L21/60 ,  H01L23/498 ,  H05K1/02 ,  H05K1/11 ,  H05K3/36 ,  H01R9/09

CPC classification number: H01L23/4985 ,  H01L24/50 ,  H05K3/361 ,  H01L2924/07811 ,  H01L2924/14 ,  H05K1/0269 ,  H05K1/0271 ,  H05K1/117 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10681 ,  H05K2203/0195

Abstract: A tape carrier package having many pins with a fine pitch can be simultaneously attained through a simplified positioning during the connection to external devices. Leads (4) and (5) are formed from an over coat area (3), which is formed at the central area of a base film (2), which is made of a resin, such as polymide, for example. Furthermore, outer leads (4a) at the input side and outer leads (5a) at the output side are respectively formed in a manner so that they extend towards both edge areas of the base film (2). A notched section 6 is formed between the outer leads (5a) at the output side of the base film (2), and through this, each of the regions (2a) and (2b) expands independently during a thermocompression bonding. The notched section 6 is provided almost at the central area of the base film (2) in the longitudinal direction, and outer leads (5) at the output side in the same number (256 for example) are formed at both of its sides in a pitch of approximately 70 .mu.m. A reinforcing device (13) is provided across the notch.

Abstract translation: 通过在与外部设备的连接期间的简化定位，可以同时获得具有许多具有细间距的引脚的带状载体封装。 引线（4）和（5）由形成在例如聚酰亚胺等树脂制的基膜（2）的中心区域的外涂覆区域（3）形成。 此外，输入侧的外引线（4a）和输出侧的外引线（5a）分别形成为使得它们朝向基膜（2）的两个边缘区域延伸。 在基膜（2）的输出侧的外引线（5a）之间形成有切口部6，通过这一点，热压接期间各区域（2a）和（2b）分别膨胀。 切口部6几乎位于基膜（2）的长度方向的中央区域，相同数量的输出侧的外引线（例如256）形成在两侧 大约70亩。 加强装置（13）跨越凹口设置。

公开(公告)号：US5838064A

公开(公告)日：1998-11-17

申请号：US423455

申请日：1995-04-19

Applicant: Yuzo Shimada ,  Takayuki Suyama ,  Yoshimasa Tanaka

Inventor： Yuzo Shimada ,  Takayuki Suyama ,  Yoshimasa Tanaka

IPC: H01L21/48 ,  H01L23/40 ,  H01L23/495 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H01L23/10 ,  H01L23/34

CPC classification number: H01L21/486 ,  H01L23/4006 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/50 ,  H05K3/301 ,  H05K3/363 ,  H01L2023/4043 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10568 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K3/3457

Abstract: An electronic package includes a supporting member, an electronic device, a carrier, a substrate a cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling is attached onto and supported by the upper surface of the plate.

Abstract translation: 电子包装包括支撑部件，电子装置，载体，基板，冷却装置。 支撑构件包括用于支撑板的板和底腿。 底脚的第一端连接到板的下表面。 载体具有用于接收底部支腿的孔。 电子装置连接到载体上并附着到板的下表面。 底脚的第二端插入托架的孔中。 底脚的第二端连接到基底的上表面。 电子设备位于支撑构件的板和基板之间。 冷却被附着到板的上表面并由其支撑。

公开(公告)号：US5815919A

公开(公告)日：1998-10-06

申请号：US511056

申请日：1995-08-03

Applicant: Tohru Nakanishi ,  Hideo Ohkuma

Inventor： Tohru Nakanishi ,  Hideo Ohkuma

IPC: B23K1/14 ,  H05K3/34

CPC classification number: H05K3/3421 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10424 ,  H05K2201/10681 ,  H05K2201/10689 ,  H05K2203/0195 ,  Y02P70/613 ,  Y10T29/49144

Abstract: To prevent solder bridges that will easily occur in soldering an element whose leads are narrow in spacing. In a solder resist, there is provided an excess-solder absorbing region in which solder resist is not provided, between an end of a solder pad and the distal end of a lead. When a great deal of solder paste is applied to the solder pad for soldering the lead, an excess of solder melted due to the heat of a heater, flows along the lead and into the excess-solder absorbing region toward the distal end of the lead. Since the excess of solder does not flow across the solder resist provided between the leads, no solder bridge is formed.

Abstract translation: 为了防止焊接引线间距窄的元件容易发生的焊料桥。 在阻焊剂中，在焊料的端部和引线的远端之间设置有不设置阻焊剂的过剩焊料吸收区域。 当将大量的焊膏施加到用于焊接引线的焊盘时，由于加热器的热量而熔化的过量的焊料沿着引线流动到引线的多余焊料吸收区域中，朝向引线的远端 。 由于多余的焊料不会流过提供在引线之间的阻焊剂，所以不会形成焊料桥。

公开(公告)号：US5814535A

公开(公告)日：1998-09-29

申请号：US573131

申请日：1995-12-15

Applicant: Yuzo Shimada ,  Takayuki Suyama ,  Yoshimasa Tanaka

Inventor： Yuzo Shimada ,  Takayuki Suyama ,  Yoshimasa Tanaka

IPC: H01L21/48 ,  H01L23/40 ,  H01L23/495 ,  H01L23/498 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H01L21/00 ,  H01L21/70 ,  H01L23/34

CPC classification number: H01L21/486 ,  H01L23/4006 ,  H01L23/49572 ,  H01L23/4985 ,  H01L24/50 ,  H05K3/301 ,  H05K3/363 ,  H01L2023/4043 ,  H01L2023/4056 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2224/73253 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H05K1/0201 ,  H05K2201/062 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2201/10568 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K3/3457

Abstract: An electronic package according to the present invention comprises a supporting member, an electronic device, a carrier, a substrate and cooling means. The supporting member includes a plate and a bottom leg for supporting the plate. A first end of the bottom leg is joined to the lower surface of the plate. The carrier has a hole for receiving the bottom leg. The electronic device is connected to the carrier and is attached to the lower surface of the plate. A second end of the bottom leg is inserted into the hole of the carrier. The second end of the bottom leg is joined to the upper surface of the substrate. The electronic device is positioned between the plate of the supporting member and the substrate. The cooling means is attached onto and supported by the upper surface of the plate.

Abstract translation: 根据本发明的电子封装包括支撑构件，电子装置，载体，基板和冷却装置。 支撑构件包括用于支撑板的板和底腿。 底脚的第一端连接到板的下表面。 载体具有用于接收底部支腿的孔。 电子装置连接到载体上并附着到板的下表面。 底脚的第二端插入托架的孔中。 底脚的第二端连接到基底的上表面。 电子设备位于支撑构件的板和基板之间。 冷却装置附接到板的上表面并由板的上表面支撑。

公开(公告)号：US5801449A

公开(公告)日：1998-09-01

申请号：US666389

申请日：1996-06-19

Applicant: Gerard Dehaine ,  Yves Stricot

Inventor： Gerard Dehaine ,  Yves Stricot

IPC: H01L21/60 ,  H01L23/498 ,  H01L23/50 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H01L23/48 ,  H01L23/52

CPC classification number: H01L24/81 ,  H01L23/49816 ,  H01L23/4985 ,  H05K3/3436 ,  H05K3/3478 ,  H05K3/363 ,  H01L2224/81801 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01061 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/0394 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10568 ,  H05K2201/10681 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K3/321 ,  H05K3/3457 ,  Y02P70/613

Abstract: An integrated circuit (IC) package (10), having an integrated circuit (11) and a connecting substrate (12) comprising an insulating film (13), one side of which carries conductors (14) and the other side of which carries balls (15) connected to the respective conductors by means of via holes (16) in the film. The balls (15) are fixed directly to said via holes, the base of which is formed by the respective conductors. The balls are preferably made of a remeltable material such as tin lead and the fixation can be made initially by an adhesive substance. The process for connecting two connecting substrates (12, 22) by means of balls (15), one of which substrates comprises a film (13), one side of which is provided with conductors (14) and the other side of which is provided with via holes (16), consists of fixing the balls directly to the conductors in the via holes by remelting the balls. The balls can be soldered or prefixed by an adhesive substance to connecting pads (23) of a board (22).

Abstract translation: PCT No.PCT / FR95 / 01670 Sec。 371日期1996年6月19日 102（e）日期1996年6月19日PCT提交1995年12月14日PCT公布。 第WO96 / 19013 PCT公开 日期：1996年6月20日具有集成电路（11）的集成电路（IC）封装（10）和包括绝缘膜（13）的连接基板（12），其一侧承载导体（14）和另一侧 其侧面通过薄膜中的通孔（16）承载连接到各个导体的球（15）。 球（15）直接固定在所述通孔上，其通孔由相应的导体形成。 球优选由诸如锡铅的重熔材料制成，并且固定可以由粘合剂物质最初制成。 用于通过滚珠（15）连接两个连接基板（12,22）的工艺，其中一个基板包括薄膜（13），其一侧设置有导体（14），另一侧设置有 通孔（16）包括通过重新熔化球将滚珠直接固定在通孔中的导体上。 球可以被粘合剂物质焊接或者前缀到板（22）的连接垫（23）。