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公开(公告)号：US09581512B2
公开(公告)日：2017-02-28
申请号：US14522014
申请日：2014-10-23
Applicant: InvenSense, Inc.
Inventor： Chung-Hsien Lin , Rene Hummel , Ulrich Bartsch , Marion Hermersdorf , Tsung Lin Tang , Wang Shen Su , Chia Min Lin
CPC classification number: G01L9/0073 , B23P19/04 , B81B7/0051 , B81B7/0054 , B81B2201/0264 , B81B2207/012 , B81B2207/095 , B81C2203/0792 , G01L9/12 , G01L19/0084 , G01L19/145 , G01L19/146 , Y10T29/49165 , Y10T29/49904
Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.
Abstract translation: 压力传感器包括第一基板和附接到第一基板的盖。 盖包括处理电路，空腔和分离空腔的可变形膜和通向压力传感器外部的端口。 提供感测装置，用于将可变形膜的响应转换成端口处的压力，使其成为能够被处理电路处理的信号。 盖子附接到第一基板，使得可变形膜面向第一基板，并且使得在可变形膜和第一基板之间提供间隙，该间隙有助于端口。 第一基板包括盖附接的支撑部分，用于将压力传感器电连接到外部装置的接触部分以及用于将支撑部分从接触部分悬挂的一个或多个悬挂元件。
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公开(公告)号：US09581468B2
公开(公告)日：2017-02-28
申请号：US14170355
申请日：2014-01-31
Applicant: DunAn Sensing LLC
Inventor： Tom T. Nguyen
IPC: G01D11/24 , H01L23/10 , G01L19/14 , G01L19/06 , G01L5/16 , B23P11/00 , G01D11/26 , B81B7/00 , B81C1/00
CPC classification number: G01D11/245 , B23P11/005 , B81B7/0032 , B81B2201/0264 , B81C1/00261 , B81C3/00 , B81C2203/019 , G01D11/26 , G01L5/165 , G01L19/0672 , G01L19/14 , G01L19/145 , G12B9/06 , H01L23/10 , Y10T29/49872 , Y10T29/49874 , Y10T29/49913 , Y10T29/49915
Abstract: Methods for fabricating a hermetic seal to seal a portion of an apparatus, for example and without limitation, a portion having a MEMS sensor. One such method uses crimping devices to compress a seal in a cavity formed in a housing that includes a MEMS sensor attached to a stress isolator. Under such compression, the seal deforms to hermetically seal surfaces around the inside, outside and bottom of the stress isolator.
Abstract translation: 用于制造气密密封件以密封装置的一部分的方法，例如但不限于具有MEMS传感器的部分。 一种这样的方法使用压接装置来压缩形成在壳体中的空腔中的密封件，该密封件包括附接到应力隔离器的MEMS传感器。 在这种压缩状态下，密封件变形成密封密封应力隔离器内部，外部和底部的表面。
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公开(公告)号：US20170052083A1
公开(公告)日：2017-02-23
申请号：US15350787
申请日：2016-11-14
Applicant: Infineon Technologies AG
Inventor： Andreas Wiesbauer , Alfons Dehe
CPC classification number: G01L9/0073 , B81B3/0021 , B81B2201/0264 , G01L9/0042 , G01L9/0052 , G01L9/0072 , G01L9/0082 , G01L9/08 , G01L9/085 , H04R1/08 , H04R2201/003
Abstract: According to various embodiments, a dynamic pressure sensor includes a substrate, a reference volume formed in the substrate, a deflectable membrane sealing the reference volume, a deflection sensing element coupled to the membrane and configured to measure a deflection of the membrane, and a ventilation hole configured to equalize an absolute pressure inside the reference volume with an absolute ambient pressure outside the reference volume.
Abstract translation: 根据各种实施例，动态压力传感器包括衬底，形成在衬底中的参考体积，密封参考体积的可偏转膜，耦合到膜并被配置成测量膜偏转的偏转感测元件，以及通气 孔被配置为使参考体积内的绝对压力与参考体积外的绝对环境压力相等。
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84.发明授权Various stress free sensor packages using wafer level supporting die and air gap technique 有权各种无压力传感器封装采用晶圆级支撑模和气隙技术公开(公告)号：US09574959B2
公开(公告)日：2017-02-21
申请号：US14517387
申请日：2014-10-17
Applicant: Apple Inc.
Inventor： Caleb C. Han , Tongbi Jiang , Jun Zhai
CPC classification number: G01L7/08 , B81B7/0048 , B81B2201/025 , B81B2201/0264 , B81B2203/0127 , B81B2203/0315 , B81B2207/012 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C2203/0792 , G01L9/0045 , G01L9/0048 , G01L19/0618 , G01L19/146 , G01L19/148 , H01L41/094 , H01L41/1136 , H01L2224/16225 , H01L2224/32145 , H01L2224/48095 , H01L2224/73204 , H01L2224/73265 , H01L2224/94 , H01L2924/1461 , H01L2924/16151 , H01L2924/16195
Abstract: Sensor packages and manners of formation are described. In an embodiment, a sensor package includes a supporting die characterized by a recess area and a support anchor protruding above the recess area. A sensor die is bonded to the support anchor such that an air gap exists between the sensor die and the recess area. The sensor die includes a sensor positioned directly above the air gap.
Abstract translation: 描述传感器封装和形成方式。 在一个实施例中，传感器封装包括支撑模具，其特征在于凹部区域和在凹部区域上方突出的支撑锚固件。 传感器模具结合到支撑锚定件，使得在传感器模具和凹部区域之间存在气隙。 传感器模具包括位于空气间隙正上方的传感器。
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公开(公告)号：US09573805B2
公开(公告)日：2017-02-21
申请号：US14713946
申请日：2015-05-15
Inventor： Guangcai Fu , Haiyong Ni
CPC classification number: B81C1/00531 , B81B3/007 , B81B7/0058 , B81B2201/0264 , B81C1/00801 , B81C1/00849 , G01L9/0073
Abstract: A method of manufacturing a pressure sensor is provided. The method includes: providing a substrate, wherein a bottom electrode and a pressure sensing film are disposed on the substrate; forming an etch stop assembly on the pressure sensing film at a location corresponding to a pressure trench; forming a cover layer on the substrate covering the etch stop assembly and the pressure sensing film; forming a mask layer on the cover layer, wherein an opening of the mask layer is formed above the etch stop assembly and exposes a portion of the cover layer at the location corresponding to the pressure trench; etching the cover layer using the mask layer so as to form the pressure trench in the cover layer; removing the etch stop assembly at a bottom of the pressure trench; and removing the mask layer.
Abstract translation: 提供一种制造压力传感器的方法。 该方法包括：提供衬底，其中底部电极和压力感测膜设置在衬底上; 在对应于压力沟槽的位置处在所述压力感测膜上形成蚀刻停止组件; 在覆盖所述蚀刻停止组件和所述压力感测膜的所述衬底上形成覆盖层; 在所述覆盖层上形成掩模层，其中所述掩模层的开口形成在所述蚀刻停止组件上方，并且在对应于所述压力沟槽的位置处暴露所述覆盖层的一部分; 使用掩模层蚀刻覆盖层，以在覆盖层中形成压力沟槽; 在所述压力沟槽的底部移除所述蚀刻停止组件; 并去除掩模层。
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Patent Agency Ranking
公开(公告)号：US20170036909A1
公开(公告)日：2017-02-09
申请号：US15299161
申请日：2016-10-20
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Chun-Wen CHENG , Chia-Hua CHU
CPC classification number: B81C1/00285 , B81B7/0038 , B81B7/02 , B81B2201/0264 , B81C1/00238 , B81C1/00293
Abstract: A method for forming a micro-electro mechanical system (MEMS) device is provided. The method includes bonding a semiconductor substrate with a carrier substrate through a dielectric layer and patterning the semiconductor substrate into multiple elements. The method also includes partially removing the dielectric layer to release some of the elements such that the released elements become one (or more) first movable element and one (or more) second movable element. The method further includes bonding a cap substrate with the semiconductor substrate to form a first closed chamber containing the first movable element and a second closed chamber containing the second movable element. In addition, the method includes opening the second closed chamber and sealing the second closed chamber after vacuumizing the second closed chamber such that the second closed chamber has a reduced pressure smaller than that of the first closed chamber.
Abstract translation: 提供了一种用于形成微机电系统（MEMS）装置的方法。 该方法包括通过电介质层将半导体衬底与载体衬底接合并将半导体衬底图案化成多个元件。 该方法还包括部分去除电介质层以释放一些元件，使得释放的元件变为一个（或多个）第一可移动元件和一个（或更多个）第二可移动元件。 该方法还包括将盖衬底与半导体衬底接合以形成容纳第一可移动元件的第一封闭室和包含第二可移动元件的第二封闭室。 此外，该方法包括打开第二封闭室并且在对第二封闭室抽真空之后密封第二封闭室，使得第二封闭室的压力小于第一封闭室的压力。
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公开(公告)号：US20170036906A1
公开(公告)日：2017-02-09
申请号：US15297661
申请日：2016-10-19
Applicant: MKS Instruments, Inc.
Inventor： Lei Gu , Stephen F. Bart
CPC classification number: B81B7/0048 , B81B2201/0264 , B81C1/00325 , B81C1/00547 , B81C2201/013 , H01L2224/48091 , H01L2924/00014
Abstract: Stress relief structures and methods that can be applied to MEMS sensors requiring a hermetic seal and that can be simply manufactured are disclosed. The system includes a sensor having a first surface and a second surface, the second surface being disposed away from the first surface, the second surface also being disposed away from a package surface and located between the first surface and the package surface, a number of support members, each support member extending from the second surface to the package surface, the support members being disposed on and operatively connected to only a portion of the second surface. The support member are configured to reduce stress produced by package-sensor interaction.
Abstract translation: 公开了可应用于需要气密密封并且可以简单制造的MEMS传感器的应力消除结构和方法。 所述系统包括具有第一表面和第二表面的传感器，所述第二表面远离所述第一表面设置，所述第二表面还远离封装表面设置并位于所述第一表面和所述封装表面之间， 支撑构件，每个支撑构件从第二表面延伸到包装表面，支撑构件设置在第二表面的一部分上并且可操作地连接到第二表面。 支撑构件被配置为减少由包传感器相互作用产生的应力。
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公开(公告)号：US20170029267A1
公开(公告)日：2017-02-02
申请号：US15290361
申请日：2016-10-11
Inventor： Colin Robert Jenkins , Tsjerk Hans Hoekstra , Euan James Boyd
CPC classification number: H04R19/005 , B81B3/0021 , B81B3/0075 , B81B2201/0257 , B81B2201/0264 , B81B2203/0127 , B81C1/00158 , H01L41/09 , H01L41/0926 , H01L2224/16225 , H01L2224/48091 , H01L2924/1461 , H01L2924/16151 , H01L2924/16152 , H04R1/222 , H04R23/006 , H04R2201/003 , Y10T29/49005 , H01L2924/00014
Abstract: A MEMS capacitive transducer with increased robustness and resilience to acoustic shock. The transducer structure includes a flexible membrane supported between a first volume and a second volume, and at least one variable vent structure in communication with at least one of the first and second volumes. The variable vent structure includes at least one moveable portion which is moveable in response to a pressure differential across the moveable portion so as to vary the size of a flow path through the vent structure. The variable vent may be formed through the membrane and the moveable portion may be a part of the membrane, defined by one or more channels, that is deflectable away from the surface of the membrane. The variable vent is preferably closed in the normal range of pressure differentials but opens at high pressure differentials to provide more rapid equalisation of the air volumes above and below the membrane.
Abstract translation: 一种MEMS电容式换能器，具有增强的抗震性能和弹性。 换能器结构包括支撑在第一体积和第二体积之间的柔性膜，以及与第一和第二体积中的至少一个连通的至少一个可变排气口结构。 可变排气结构包括至少一个可移动部分，其可响应于可移动部分上的压差而移动，以便改变通过排气结构的流动路径的尺寸。 可变通气口可以通过膜形成，并且可移动部分可以是由一个或多个通道限定的膜，其可偏离膜的表面偏转。 可变排气口优选在正常的压差范围内封闭，但在高压差下打开以提供膜上方和下方的空气体积的更快速平衡。
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公开(公告)号：US20170018471A1
公开(公告)日：2017-01-19
申请号：US15182657
申请日：2016-06-15
Applicant: Hitachi, Ltd.
Inventor： Takanori AONO , Tomonori SEKIGUCHI , Takashi SHIOTA , Yuudai KAMADA , Atsushi ISOBE
IPC: H01L23/053 , G01L9/02 , G01P15/18 , G01P3/44 , H01L23/498 , B81B7/00
CPC classification number: G01L9/02 , B81B7/0048 , B81B2201/0235 , B81B2201/0242 , B81B2201/0264 , B81B2207/07 , G01C19/5783 , G01L9/12 , G01P1/006 , G01P1/023 , H01L23/057 , H01L23/49838 , H01L23/49861 , H01L2224/16225
Abstract: To provide a physical quantity sensor in which the influence of deformation of a package substrate on the measuring accuracy of a sensor element can be suppressed. A physical quantity sensor includes a sensor element that detects a predetermined physical quantity and outputs an electrical signal, a plurality of lead portions that are connected to the sensor element, and a package substrate that accommodates the sensor element and the plurality of lead portions. The plurality of lead portions are connected at proximal end sides thereof to the package substrate side, and connected at distal end sides thereof to the sensor element side, and the plurality of lead portions support the sensor element in such a manner that the sensor element does not contact the package substrate and that the transmission of deformation of the package substrate side to the sensor element is suppressed.
Abstract translation: 提供能够抑制封装基板的变形对传感器元件的测量精度的影响的物理量传感器。 物理量传感器包括检测预定物理量并输出电信号的传感器元件，连接到传感器元件的多个引线部分和容纳传感器元件和多个引线部分的封装基板。 多个引线部分在其近端侧连接到封装基板侧，并且在其远端侧连接到传感器元件侧，并且多个引线部分以传感器元件的方式支撑传感器元件 不接触封装基板，并且抑制封装基板侧向传感器元件的变形的传输。
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公开(公告)号：US20170015548A1
公开(公告)日：2017-01-19
申请号：US14963362
申请日：2015-12-09
Applicant: Texas Instruments Incorporated
Inventor： Jie Mao , Hau Nguyen , Luu Nguyen , Anindya Poddar
CPC classification number: B81C1/00873 , B81B7/007 , B81B2201/0214 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , B81B2201/0278 , B81B2201/0292 , B81B2201/047 , B81B2207/07 , B81B2207/098 , B81C1/00333 , B81C2201/0125 , B81C2201/0132 , B81C2201/0159 , B81C2201/0181 , B81C2201/0188 , B81C2203/0136 , H01L21/561 , H01L21/568 , H01L21/6836 , H01L23/3121 , H01L24/19 , H01L2221/68359 , H01L2224/04105 , H01L2224/96 , H01L2924/3511
Abstract: A method for fabricating packaged semiconductor devices (100) with an open cavity (110a) in panel format; placing (process 201) on an adhesive carrier tape a panel-sized grid of metallic pieces having a flat pad (230) and symmetrically placed vertical pillars (231); attaching (process 202) semiconductor chips (101) with sensor systems face-down onto the tape; laminating (process 203) and thinning (process 204) low CTE insulating material (234) to fill gaps between chips and grid; turning over (process 205) assembly to remove tape; plasma-cleaning assembly front side, sputtering and patterning (process 206) uniform metal layer across assembly and optionally plating (process 209) metal layer to form rerouting traces and extended contact pads for assembly; laminating (process 212) insulating stiffener across panel; opening (process 213) cavities in stiffener to access the sensor system; and singulating (process 214) packaged devices by cutting metallic pieces.
Abstract translation: 一种以面板格式制造具有开口腔（110a）的封装半导体器件（100）的方法; 将具有平垫（230）和对称放置的垂直柱（231）的金属片的面板尺寸网格放置（处理201）在粘合剂载带上。 将具有传感器系统的半导体芯片（工艺202）面朝下地附接到带上; 层压（工艺203）和减薄（工艺204）低CTE绝缘材料（234）以填充芯片和网格之间的间隙; 翻转（过程205）组装以去除胶带; 等离子体清洁组件正面，溅射和图案化（工艺206）跨组合均匀的金属层和任选的电镀（工艺209）金属层以形成重新布线迹线和扩展的接触垫用于组装; 层压（工艺212）跨板的绝缘加强件; 在加强件中打开（过程213）空腔以接近传感器系统; 并通过切割金属片来分割（处理214）包装的装置。
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