公开(公告)号：US20120152601A1

公开(公告)日：2012-06-21

申请号：US13374858

申请日：2012-01-19

Applicant: Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

Inventor： Aleksandar Aleksov ,  Vladimir Noveski ,  Sujit Sharan ,  Shankar Ganapathysubramanian

IPC: H05K1/03 ,  B23K1/20 ,  B23K31/02 ,  B05D5/12 ,  B05D3/00

CPC classification number: H05K1/0201 ,  H01L21/4807 ,  H01L23/15 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/107 ,  H05K3/205 ,  H05K3/388 ,  H05K3/4617 ,  H05K3/4629 ,  H05K3/4647 ,  H05K2201/0175 ,  H05K2201/0187 ,  H05K2201/0376 ,  H05K2201/096 ,  H05K2201/09881 ,  H05K2203/0733 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A layer or layers for use in package substrates and die spacers are described. The layer or layers include a plurality of ceramic wells lying within a plane and separated by metallic vias. Recesses within the ceramic wells are occupied by a dielectric filler material.

Abstract translation: 描述了用于封装衬底和管芯间隔件的层或层。 层或层包括位于平面内并由金属通孔分开的多个陶瓷阱。 陶瓷井内的凹陷由介电填料材料占据。

公开(公告)号：US20120125664A1

公开(公告)日：2012-05-24

申请号：US12954001

申请日：2010-11-24

Applicant: Ian Niemi ,  Ilkka Johannes Kartio ,  Kimmo Markus Perala ,  Kari Viljo Jalmari Virtanen ,  Hannu Vaino Kalevi Ventomaki

Inventor： Ian Niemi ,  Ilkka Johannes Kartio ,  Kimmo Markus Perala ,  Kari Viljo Jalmari Virtanen ,  Hannu Vaino Kalevi Ventomaki

IPC: H05K1/00 ,  H05K3/36

CPC classification number: H05K3/4694 ,  H05K1/165 ,  H05K3/4691 ,  H05K2201/0187

Abstract: An apparatus including a first printed wiring board section and a second printed wiring board section. The first printed wiring board section includes a first dielectric material layer. The first dielectric material layer has a first dissipation factor. The second printed wiring board section is directly attached with the first printed wiring board section to form a unitary printed wiring board structure. The second printed wiring board section includes a second dielectric material layer and an antenna on the second dielectric material layer. The second dielectric material layer has a different second dissipation factor.

Abstract translation: 一种包括第一印刷线路板部分和第二印刷线路板部分的装置。 第一印刷线路板部分包括第一介电材料层。 第一介电材料层具有第一损耗因子。 第二印刷线路板部分与第一印刷线路板部分直接连接以形成一体的印刷线路板结构。 第二印刷线路板部分包括在第二电介质材料层上的第二电介质层和天线。 第二介质材料层具有不同的第二损耗因子。

公开(公告)号：US08139368B2

公开(公告)日：2012-03-20

申请号：US12781857

申请日：2010-05-18

Applicant: Masato Nomura

Inventor： Masato Nomura

IPC: H05K1/18

CPC classification number: H05K1/186 ,  H01L23/3677 ,  H01L23/49822 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H01L2924/3025 ,  H05K1/0206 ,  H05K1/0306 ,  H05K3/4605 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09845 ,  H05K2201/10636 ,  H05K2201/10674 ,  Y02P70/611 ,  Y10T29/49206 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A component-containing module includes a core substrate which includes a lower surface including recessed portions and a raised portion, and an upper surface facing the lower surface and which includes a plurality of in-plane conductors, an integrated circuit element arranged at a location which is above the upper surface and which corresponds to the raised portion, a first passive element and a second passive element disposed in the recessed portions of the lower surface, a composite resin layer which underlies the lower surface and which has a flat or substantially flat surface, and an external terminal electrode which is disposed on the flat or substantially flat surface of the composite resin layer and which is electrically connected to the in-plane conductors of the core substrate. The component-containing module enables electronic components, such as integrated circuit elements and passive elements, to be densely arranged and to be reduced in profile and size.

Abstract translation: 含有元件的模块包括：芯基板，其包括具有凹部和凸起部分的下表面，以及面向下表面的上表面，并且包括多个面内导体，集成电路元件，其布置在 在上表面上方并且对应于凸起部分，第一无源元件和设置在下表面的凹部中的第二无源元件，复合树脂层，其在下表面下方并且具有平坦或基本平坦的表面 以及外部端子电极，其设置在复合树脂层的平坦或基本上平坦的表面上并且电连接到芯基板的面内导体。 含元件的模块使诸如集成电路元件和无源元件之类的电子元件能够紧密地布置并且在外形和尺寸上减小。

公开(公告)号：US08130356B2

公开(公告)日：2012-03-06

申请号：US12348743

申请日：2009-01-05

Applicant: Jung-Sun Lee ,  Young-Kwang Kim

Inventor： Jung-Sun Lee ,  Young-Kwang Kim

IPC: G02F1/1345

CPC classification number: H05K1/028 ,  H05K3/28 ,  H05K2201/0133 ,  H05K2201/0187

Abstract: Disclosed are a flexible printed circuit board capable of improving the display quality and a display device having the flexible printed circuit board. The flexible printed circuit board includes a base film, a signal interconnection layer and a protective layer. The signal interconnection layer is formed on the base film. The protective layer is formed on the signal interconnection layer. The protective layer includes a first region and a second region. The second region has a stiffness smaller than a stiffness of the first region.

Abstract translation: 公开了能够提高显示质量的柔性印刷电路板和具有柔性印刷电路板的显示装置。 柔性印刷电路板包括基膜，信号互连层和保护层。 信号互连层形成在基膜上。 保护层形成在信号互连层上。 保护层包括第一区域和第二区域。 第二区域的刚度小于第一区域的刚度。

公开(公告)号：US08120926B2

公开(公告)日：2012-02-21

申请号：US12275051

申请日：2008-11-20

Applicant: Timothy A. Lemke ,  Charles C. Byer

Inventor： Timothy A. Lemke ,  Charles C. Byer

IPC: H05K1/14

CPC classification number: H05K1/14 ,  H05K1/0219 ,  H05K1/0222 ,  H05K1/116 ,  H05K1/141 ,  H05K3/222 ,  H05K2201/0187 ,  H05K2201/044 ,  H05K2201/09063 ,  H05K2201/10189

Abstract: A backplane has through holes for conductors to project through the backplane in arrays corresponding to respective circuit boards arranged along the front side of the backplane. The through holes include ground holes for receiving ground conductors in connection with a ground plane, and signal holes for receiving signal conductors free of connections with the ground plane. In accordance with a principal feature, the backplane is free of circuitry configured to interconnect signal conductors in the signal holes. This avoids problems associated with circuit density within the structure of a backplane. In accordance with another principal feature, each signal hole is wide enough to provide clearance for a respective signal conductor to extend fully through the signal hole free of contact with the backplane. The clearance contains air that serves as a dielectric to increase the impedance between adjacent signal holes, and thereby to reduce crosstalk and other problems associated with close proximity between signal holes. Additional through holes provide additional impedance at locations between adjacent conductor through holes. Such additional through holes for impedance control can be included in the circuit boards as well as the backplane.

Abstract translation: 背板具有用于导体的通孔，用于沿着背板的前侧布置的相应电路板的阵列突出通过背板。 通孔包括用于接收与接地平面连接的接地导体的接地孔，以及用于接收不与接地平面连接的信号导体的信号孔。 根据主要特征，背板没有被配置为互连信号孔中的信号导体的电路。 这避免了与背板结构内的电路密度有关的问题。 根据另一个主要特征，每个信号孔足够宽以为相应的信号导体提供间隙，以完全延伸穿过与背板无接触的信号孔。 间隙包含作为电介质的空气，以增加相邻信号孔之间的阻抗，从而减少串扰和与信号孔之间的紧密接近相关的其它问题。 额外的通孔在相邻的导体通孔之间的位置提供额外的阻抗。 这种用于阻抗控制的附加通孔可以包括在电路板以及背板中。

公开(公告)号：US08119924B2

公开(公告)日：2012-02-21

申请号：US12295286

申请日：2007-03-30

Applicant: Katsumi Abe ,  Kenichiro Fujii ,  Atsumasa Sawada

Inventor： Katsumi Abe ,  Kenichiro Fujii ,  Atsumasa Sawada

IPC: H05K1/00

CPC classification number: H05K1/0271 ,  H01L23/49822 ,  H01L23/4985 ,  H01L23/562 ,  H01L2224/05022 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/3511 ,  H05K1/0281 ,  H05K1/189 ,  H05K3/4614 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/10674 ,  H05K2201/2009 ,  H05K2203/302 ,  Y10T428/24777 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Stress concentration at the connecting portion of the electronic component and the curved board and the area around the connecting portion is suppressed. In a flexible wiring board, insulation layers (11, 13) and wiring layers (12, 15) are piled up alternately and wiring layers (12, 15) are via-connected each other. The board comprises reinforced area (10a) reinforced against external stress, bending area (10c) bending easier than the reinforced area (10a) by external stress, and a stress relaxation area (10b) provided in area between the reinforced area (10a) and the bending area (10c), bending easier than the reinforced area (10a) but not easier than the bending area (10c) by the external stress, and relaxing the stress carried from the bending area (10c) to the reinforced area (10a).

Abstract translation: 电子部件和弯曲板的连接部的应力集中以及连接部周围的区域被抑制。 在柔性布线板中，绝缘层（11,13）和布线层（12,15）交替堆叠，并且布线层（12,15）彼此通孔连接。 所述板包括加强区域（10a），抵抗外部应力增强，弯曲区域（10c）比外部应力比加强区域（10a）弯曲得更容易;以及应力松弛区域（10b），设置在加强区域（10a）和 所述弯曲区域（10c）比所述加强区域（10a）弯曲变得容易，但是通过外部应力不易弯曲区域（10c），并且缓和从所述弯曲区域（10c）向所述加强区域（10a）承受的应力， 。

公开(公告)号：US20120012368A1

公开(公告)日：2012-01-19

申请号：US13242043

申请日：2011-09-23

Applicant: Michimasa TAKAHASHI

Inventor： Michimasa TAKAHASHI

IPC: H05K1/02 ,  H05K3/36

CPC classification number: H05K3/4691 ,  H05K1/0218 ,  H05K1/142 ,  H05K3/36 ,  H05K3/4602 ,  H05K2201/0187 ,  H05K2201/0715 ,  H05K2201/0909 ,  H05K2201/09127 ,  H05K2201/096

Abstract: A wiring board including a main substrate including a base material and having an opening portion, and a flex-rigid printed wiring board connected to the main substrate in the opening portion of the main substrate and including a rigid substrate and a flexible substrate, the rigid substrate including a non-flexible base material, the flexible substrate including a flexible base material.

Abstract translation: 一种布线基板，包括：具有基材的主基板和具有开口部分;以及柔性刚性印刷布线板，其与主基板连接在主基板的开口部分中，并且包括刚性基板和柔性基板，刚性 基材包括非柔性基材，柔性基材包括柔性基材。

公开(公告)号：US20110296679A1

公开(公告)日：2011-12-08

申请号：US13215653

申请日：2011-08-23

Applicant: Michimasa TAKAHASHI ,  Masakazu Aoyama

Inventor： Michimasa TAKAHASHI ,  Masakazu Aoyama

IPC: H05K3/36

CPC classification number: H05K3/4691 ,  H01L2224/05001 ,  H01L2224/05023 ,  H01L2224/05568 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2924/00014 ,  H05K1/0366 ,  H05K1/148 ,  H05K3/0052 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09845 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: A method of manufacturing a wiring board including forming a first wiring board, the forming of the first board including forming a substrate, forming a first insulation layer on a surface of the substrate and a second insulating layer on the opposite surface of the substrate, forming a via in one of the layers, and cutting the first layer in a first area and cutting the second layer in a second area offset from the first area to form a first substrate laminated to a second substrate with the substrate interposed therebetween, the second substrate having a smaller mounting area than that of the first substrate such that the first substrate extends beyond edge of the second substrate, connecting a pliable member to the substrate, and connecting the member to a second wiring board to connect the first and second boards. One or more insulation layers are a non-pliable layer.

Abstract translation: 一种制造布线板的方法，包括形成第一布线板，第一板的形成包括形成基板，在基板的表面上形成第一绝缘层，在基板的相对表面上形成第二绝缘层，形成 在一个层中的通孔，并且在第一区域中切割第一层，并且在与第一区域偏移的第二区域中切割第二层，以形成层压到第二基板的第一基板，其中介于其间的基板，第二基板 具有比第一基板更小的安装面积，使得第一基板延伸超过第二基板的边缘，将柔性构件连接到基板，并且将构件连接到第二布线板以连接第一和第二板。 一个或多个绝缘层是非柔性层。

公开(公告)号：US08072768B2

公开(公告)日：2011-12-06

申请号：US11988289

申请日：2006-07-04

Applicant: Ulrich Ockenfuss ,  Thomas Gottwald

Inventor： Ulrich Ockenfuss ,  Thomas Gottwald

IPC: H05K1/18

CPC classification number: H05K1/185 ,  H01L2224/16227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/15192 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2924/3511 ,  H05K1/141 ,  H05K3/284 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/0187 ,  H05K2201/049 ,  H05K2201/09509 ,  H05K2201/10674 ,  H05K2201/2036 ,  Y10T428/24917 ,  H01L2924/00

Abstract: The invention relates to a multilayer printed circuit board structure comprising a stack of plurality of electrically insulating and/or electroconductive layers and at least one passive or active electrical component arranged inside the stack of layers, the component extending laterally only in part of the surface extension of the stack of layers. The invention also relates to a passive or active electrical component mounted on the stack, to an associated wiring, and to a corresponding production method. According to the invention, the insert is embedded between two electrically insulating liquid resin layers or prepreg layers extending over the entire surface and covering the insert on both sides, the insert being surrounded by a resin material that is liquefied by compression or lamination of the structure. The invention structure can be used in printed circuit board technology.

Abstract translation: 本发明涉及一种多层印刷电路板结构，其包括多个电绝缘和/或导电层的堆叠以及布置在层叠层内的至少一个无源或有源电气元件，所述元件横向延伸仅部分表面延伸部分 的堆叠层。 本发明还涉及安装在堆叠上的无源或有源电气部件，相关布线以及相应的制造方法。 根据本发明，插入物嵌入两个在整个表面上延伸并且在两侧覆盖插入物的电绝缘液体树脂层或预浸料层之间，插入物由树脂材料包围，该树脂材料通过压缩或层压结构液化 。 本发明的结构可用于印刷电路板技术。

公开(公告)号：US08068345B2

公开(公告)日：2011-11-29

申请号：US12704736

申请日：2010-02-12

Applicant: Minoru Takizawa ,  Hidenori Tanaka

Inventor： Minoru Takizawa ,  Hidenori Tanaka

IPC: H05K5/00

CPC classification number: G06F1/183 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0271 ,  H05K3/3436 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/09063 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2224/0401

Abstract: According to one embodiment, an electronic device includes a housing, a first substrate having rigidity and including a slit, contained in the housing, a part mount portion provided on the first substrate and adjacent to the slit, an electronic part mounted on the part mount portion and a second substrate having flexibility. The second substrate is stacked on an inside of the first substrate and an inside of the part mount portion, and it crosses the slit, thereby supporting the part mount portion to be displaceable with respect to the first substrate.

Abstract translation: 根据一个实施例，一种电子设备包括壳体，具有包含在壳体中的刚性并包括狭缝的第一基板，设置在第一基板上并与狭缝相邻的部件安装部分，安装在部件安装件上的电子部件 部分和具有柔性的第二基底。 第二基板层叠在第一基板的内侧和部件安装部的内侧，并与该狭缝交叉，从而将部件安装部支承为相对于第一基板移动。