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    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE
    85.
    发明申请
    ELECTRONIC DEVICE AND METHOD OF MANUFACTURING ELECTRONIC DEVICE 有权
    电子设备及制造电子设备的方法

    公开(公告)号：US20150116971A1

    公开(公告)日：2015-04-30

    申请号：US14519327

    申请日：2014-10-21

    Applicant: Seiko Instruments Inc.

    Inventor： Atsushi KOZUKI ,  Hideshi HAMADA ,  Yoshifumi YOSHIDA

    IPC: H05K1/11 ,  H05K3/46 ,  H05K3/00 ,  H05K1/18 ,  H05K1/09

    CPC classification number: H05K3/247 ,  H01L2224/16225 ,  H01L2924/16152 ,  H05K1/092 ,  H05K1/113 ,  H05K2201/035

    Abstract: An electronic device of the present invention includes an insulating base substrate in which a plurality of through electrodes are formed, an electronic element which is electrically connected to the through electrodes and is mounted on one surface of the base substrate, a lid which accommodates the electronic element and is bonded to the one surface of the base substrate, and an external electrode which covers a region from an end face of the through electrode, which is exposed by the other surface of the base substrate, to the other surface in the vicinity of the end face. The external electrode includes a conductive film which covers a region ranging from the end face to the other surface in the vicinity of the end face, and a paste film which covers a surface of the conductive film and is formed of a conductive paste. The paste film is formed by a printing method and is formed of tin or a tin alloy.

    Abstract translation: 本发明的电子设备包括：绝缘基底，其中形成有多个通孔，电连接到贯通电极并安装在基底基片的一个表面上的电子元件，容纳电子元件的盖子 并且结合到基底基板的一个表面，并且外部电极覆盖由基底基板的另一个表面暴露的通孔的端面的区域附近的另一个表面 端面。 外部电极包括覆盖从端面附近的端面到另一表面的区域的导电膜，以及覆盖导电膜的表面并由导电膏形成的糊状膜。 糊状膜通过印刷法形成，并由锡或锡合金形成。

    Method and apparatus for using flex circuit technology to create an electrode
    87.
    发明授权
    Method and apparatus for using flex circuit technology to create an electrode 有权
    使用柔性电路技术制造电极的方法和装置

    公开(公告)号：US08546701B2

    公开(公告)日：2013-10-01

    申请号：US13276646

    申请日：2011-10-19

    Applicant: Kenneth M. Curry

    Inventor： Kenneth M. Curry

    IPC: H05K1/11 ,  H05K1/03

    CPC classification number: H05K3/247 ,  A61B5/1486 ,  A61B2562/125 ,  A61N1/05 ,  G01N27/3271 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/28 ,  H05K3/4664 ,  H05K2201/035 ,  H05K2201/09436 ,  H05K2203/0574 ,  Y10T29/4916 ,  H01L2924/00

    Abstract: A method of creating an active electrode that may include providing a flex circuit having an electrode made of a first material and providing a first mask over the flex circuit, the first mask having an offset region and an opening that exposes the electrode. The method may also include depositing a second material over the offset region and the opening, the second material being different from the first material and providing a second mask over the second material, the second mask having an opening over a portion of the second material that is over the offset region.

    Abstract translation: 一种产生有源电极的方法，其可以包括提供具有由第一材料制成的电极并在柔性电路上提供第一掩模的柔性电路，第一掩模具有偏移区域和暴露电极的开口。 该方法还可以包括在偏移区域和开口上沉积第二材料，第二材料不同于第一材料并且在第二材料上提供第二掩模，第二掩模在第二材料的一部分上具有开口， 在偏移区域之上。

    Electric component and component and method for the production thereof
    88.
    发明授权
    Electric component and component and method for the production thereof 有权
    电气部件及其制造方法

    公开(公告)号：US08415251B2

    公开(公告)日：2013-04-09

    申请号：US13037918

    申请日：2011-03-01

    Applicant: Sebastian Brunner ,  Thomas Feichtinger ,  Günter Pudmich ,  Horst Schlick ,  Patrick Schmidt-Winkel

    Inventor： Sebastian Brunner ,  Thomas Feichtinger ,  Günter Pudmich ,  Horst Schlick ,  Patrick Schmidt-Winkel

    IPC: H01L21/44

    CPC classification number: H05K3/4061 ,  H01L2924/0002 ,  H05K3/248 ,  H05K3/28 ,  H05K2201/035 ,  Y10T29/49155 ,  H01L2924/00

    Abstract: A method for producing an electrical component (1) is proposed, in which a ceramic base body (5) that contains a through-hole contact (10) and at least one metallization surface (20C) electroconductively connected to the through-hole contact is provided in a method step A). On the surface of the base body, an electrically insulating first material is arranged in layer form at least above the through-hole contact in method step B), and thereafter an electrically conductive second material is applied above through-hole contact (10) in method step C). Then a solder contact (30B) that electroconductively connects through-hole contact (10) through passivation layer (25B), which is formed from the first material by sintering, is formed by hardening in method step D).

    Abstract translation: 提出了一种电气部件（1）的制造方法，其中，包含通孔接触部（10）的陶瓷基体（5）和与通孔接触部电连接的至少一个金属化表面（20C）为 以方法步骤A）提供。 在基体的表面上，在方法步骤B）中，电绝缘的第一材料至少在通孔接触面上方形成层状，然后将导电的第二材料施加在通孔接触件（10）上方 方法步骤C）。 然后通过方法步骤D）中的硬化形成通过烧结由第一材料形成的通孔钝化层（25B）的通孔接触（10）的导电连接的焊料接触（30B）。

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