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    SUBSTRATE FOR SUSPENSION, AND PRODUCTION PROCESS THEREOF
    87.
    发明申请
    SUBSTRATE FOR SUSPENSION, AND PRODUCTION PROCESS THEREOF 审中-公开
    暂停基材及其生产工艺

    公开(公告)号：US20170048987A1

    公开(公告)日：2017-02-16

    申请号：US15338860

    申请日：2016-10-31

    Applicant: DAI NIPPON PRINTING CO., LTD.

    Inventor： Yoichi MIURA ,  Tsuyoshi YAMAZAKI

    IPC: H05K3/46 ,  G11B5/48 ,  H05K3/28 ,  H05K1/02 ,  H05K1/05

    CPC classification number: H05K3/4644 ,  G11B5/48 ,  G11B5/4826 ,  G11B5/4833 ,  G11B5/49 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/05 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0394 ,  H05K2201/09081 ,  H05K2201/09781 ,  Y10T428/1171 ,  Y10T428/1179 ,  Y10T428/1193

    Abstract: The present invention provides a substrate for suspension that includes a first structural part including a metal supporting substrate, an insulating layer, a wiring layer, and a cover layer, and a second structural part formed so as to extend continuously from the first structural part and has no metal supporting substrate. A position of an edge of an upper surface of the insulating layer coincides with a position of an edge of the lower surface of the cover layer or the position of the edge of the upper surface of the insulating layer is positioned on a side closer to the wiring layer than to the position of the edge of the lower surface of the cover layer at a boundary region between the first structural part and the second structural part.

    Abstract translation: 本发明提供了一种悬架用基板，其具备包括金属支撑基板，绝缘层，布线层和覆盖层的第一结构部件和形成为从第一结构部件连续延伸的第二结构部件， 没有金属支撑基板。 绝缘层的上表面的边缘的位置与覆盖层的下表面的边缘的位置一致，或者绝缘层的上表面的边缘的位置位于靠近 布线层比在第一结构部分和第二结构部分之间的边界区域处的覆盖层的下表面的边缘的位置。

    Interconnect for battery packs
    88.
    发明授权
    Interconnect for battery packs 有权
    互连电池组

    公开(公告)号：US09545010B2

    公开(公告)日：2017-01-10

    申请号：US14836946

    申请日：2015-08-26

    Applicant: CelLink Corporatopm

    Inventor： Kevin Michael Coakley ,  Malcolm Brown

    IPC: H01L23/00 ,  H05K3/00 ,  H01L23/538 ,  H05K1/11 ,  H05K1/18 ,  H05K3/40 ,  H01M2/20 ,  H01M10/42

    CPC classification number: H05K3/0058 ,  H01L23/5386 ,  H01M2/202 ,  H01M2/206 ,  H01M10/4257 ,  H01M10/48 ,  H05K1/0268 ,  H05K1/118 ,  H05K1/189 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/10037

    Abstract: Provided are interconnect circuits for interconnecting arrays of battery cells and methods of forming these interconnect circuits as well as connecting these circuits to the battery cells. An interconnect circuit may include a conductive layer and one or more insulating layers. The conductive layer may be patterned with openings defining contact pads, such that each pad is used for connecting to a different battery cell terminal. In some embodiments, each contact pad is attached to the rest of the conductive layer by a fusible link formed from the same conductive layer as the contact pad. The fusible link controls the current flow to and from this contact pad. The insulating layer is laminated to the conductive layer and provides support to the contacts pads. The insulating layer may also be patterned with openings, which allow forming electrical connections between the contact pads and cell terminals through the insulating layer.

    Abstract translation: 提供了用于互连电池单元阵列的互连电路以及形成这些互连电路的方法以及将这些电路连接到电池单元。 互连电路可以包括导电层和一个或多个绝缘层。 导电层可以用限定接触焊盘的开口图案化，使得每个焊盘用于连接到不同的电池单元端子。 在一些实施例中，每个接触垫通过由与接触垫相同的导电层形成的可熔连接件附接到导电层的其余部分。 熔断链路控制来自该接触焊盘的电流。 绝缘层被层压到导电层上并提供对接触垫的支撑。 绝缘层也可以用开口图案化，这允许通过绝缘层在接触焊盘和电池端子之间形成电连接。

    Computer program product for electro-optical assembly
    90.
    发明授权
    Computer program product for electro-optical assembly 有权
    用于电光装配的计算机程序产品

    公开(公告)号：US09323009B2

    公开(公告)日：2016-04-26

    申请号：US14243075

    申请日：2014-04-02

    Applicant: International Business Machines Corporation

    Inventor： Stefano Sergio Oggioni ,  Jonas R. Weiss ,  Bert Jan Offrein

    IPC: G02B6/13 ,  G02B6/42 ,  G02B6/43 ,  H05K1/02 ,  H05K13/00 ,  G02B6/38 ,  H05K1/18 ,  H05K3/34 ,  G02B6/12

    CPC classification number: G02B6/42 ,  G02B6/13 ,  G02B6/3885 ,  G02B6/4214 ,  G02B6/43 ,  G02B2006/12166 ,  H05K1/0274 ,  H05K1/184 ,  H05K1/189 ,  H05K3/3405 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10121 ,  H05K2201/10674 ,  H05K2203/0195 ,  Y10T29/49002 ,  Y10T29/49037 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53

    Abstract: A computer program product for fabricating an optical assembly having stored computer readable program code including a first program to place a flexible portion of a substrate including a waveguide, the waveguide exposed at one end edge of the substrate upon a horizontally movable stage of a flip-chip bonder, a second program to vertically move a clamp through the stage opening to place the waveguide exposed end in a vertical position, a third program to vertically downwardly move a bond head containing an optical component upon the waveguide exposed substrate edge to position the optical component with the exposed waveguide, a fourth program to fixably mount the optical component to the substrate edge, and a fifth program to release the optical component from the bond head while moving the clamp vertically downward through the stage opening unbending the flexible portion of the substrate with the optical component mounted thereon.

    Abstract translation: 一种用于制造具有存储的计算机可读程序代码的计算机程序产品，所述计算机可读程序代码包括第一程序，以放置包括波导的基板的柔性部分，所述波导在所述基板的一个端部边缘暴露在触发器的水平移动台上， 第二程序，用于垂直移动夹具穿过平台开口以将波导暴露端放置在垂直位置;第三程序，用于垂直向下移动包含光学部件的接合头在波导暴露的基板边缘上以将光学 具有暴露的波导的组件，将光学部件可固定地安装到基板边缘的第四程序，以及第五程序，用于在将夹具垂直向下移动通过平台开口的同时从接合头释放光学部件，而不弯曲基板的柔性部分 其上安装有光学部件。

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