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    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE
    81.
    发明申请
    WIRING SUBSTRATE AND METHOD FOR MANUFACTURING WIRING SUBSTRATE 有权
    接线基板及制造接线基板的方法

    公开(公告)号：US20120298413A1

    公开(公告)日：2012-11-29

    申请号：US13480985

    申请日：2012-05-25

    Applicant: Kenichi MORI

    Inventor： Kenichi MORI

    IPC: H05K1/11 ,  H05K3/00

    CPC classification number: H05K3/425 ,  H01L21/486 ,  H01L23/147 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/002 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0152 ,  H05K2203/1572 ,  Y10T29/49124 ,  H01L2924/00

    Abstract: A wiring substrate includes a body including first and second surfaces, a trench having an opening on the first surface and including, a bottom surface, a side surface, and a slope surface that connects a peripheral part of the bottom surface to a one end part of the side surface and widens from the peripheral part to the one end part, the one end part being an end part opposite from the first surface, a hole including an end communicating with the bottom surface and another end being open on the second surface, a first layer filling at least a portion of the hole and including a top surface toward the trench, a second layer covering the top surface and formed on at least a portion of the trench except for a part of the side surface, and a third layer covering the second layer and filling the trench.

    Abstract translation: 布线基板包括：主体，其包括第一表面和第二表面;沟槽，其在第一表面上具有开口，并且包括底表面，侧表面以及将底表面的周边部分连接到一个端部的倾斜表面 并且从所述周边部向所述一个端部变宽，所述一端部为与所述第一面相反的端部，所述端部与所述底面相连通，所述另一端在所述第二面上开口， 填充所述孔的至少一部分并且包括朝向所述沟槽的顶表面的第一层，覆盖所述顶表面并形成在除了所述侧表面的一部分之外的所述沟槽的至少一部分上的第二层，以及第三层 覆盖第二层并填充沟槽。

    Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layer
    82.
    发明授权
    Printed circuit board comprised of an insulating layer having buried microstrip lines and conductors with widths that narrow into the insulation layer 失效
    印刷电路板由具有埋入微带线的绝缘层和宽度窄到绝缘层中的导体组成

    公开(公告)号：US08294529B2

    公开(公告)日：2012-10-23

    申请号：US12361781

    申请日：2009-01-29

    Applicant: Heung-Kyu Kim

    Inventor： Heung-Kyu Kim

    IPC: H01P3/08

    CPC classification number: H01P3/081 ,  H01P11/003 ,  H05K1/0221 ,  H05K3/205 ,  H05K2201/0376 ,  H05K2201/0715 ,  H05K2201/09509 ,  H05K2201/09827

    Abstract: A printed circuit board having a micro strip line, a printed circuit board having a strip line and a method of manufacturing thereof are disclosed. The printed circuit board having a micro strip line in accordance with an embodiment of the present invention includes a first insulation layer, a signal line buried in one surface of the first insulation layer, a plurality of conductors penetrating through the first insulation layer and being disposed on both sides of the signal line in parallel with the signal line, and a ground layer formed to be electrically connected to the conductor on the other surface of the first insulation layer.

    Abstract translation: 公开了一种具有微带线的印刷电路板，具有带状线的印刷电路板及其制造方法。 根据本发明实施例的具有微带线的印刷电路板包括第一绝缘层，埋在第一绝缘层的一个表面中的信号线，穿过第一绝缘层并被布置的多个导体 在与信号线并联的信号线的两侧，以及形成为与第一绝缘层的另一个表面上的导体电连接的接地层。

    METHOD FOR MANUFACTURING PRINTED WIRING BOARD
    83.
    发明申请
    METHOD FOR MANUFACTURING PRINTED WIRING BOARD 有权
    制造印刷电路板的方法

    公开(公告)号：US20120213944A1

    公开(公告)日：2012-08-23

    申请号：US13325105

    申请日：2011-12-14

    Applicant: Tsutomu YAMAUCHI ,  Satoru Kawai

    Inventor： Tsutomu YAMAUCHI ,  Satoru Kawai

    IPC: H05K3/00 ,  B05D3/06

    CPC classification number: H05K3/0032 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/1476 ,  H05K2203/1572

    Abstract: A method for manufacturing a printed wiring board including forming a penetrating hole in a core substrate, forming a first conductor on a first surface of the substrate, forming a second conductor on a second surface of the substrate, and filling a conductive material in the hole such that a through-hole conductor is formed in the hole and the first and second conductors are connected via the through-hole conductor. The forming of the hole includes forming a first opening in the first surface, forming a second opening from the bottom of the first opening toward the second surface such that the second opening has a smaller diameter than the first opening, forming a third opening in the second surface, and forming a fourth opening from the bottom of the third opening toward the first surface such that the fourth opening has a smaller diameter than the third opening.

    Abstract translation: 一种制造印刷线路板的方法，包括在芯基板中形成贯通孔，在基板的第一表面上形成第一导体，在基板的第二表面上形成第二导体，并在该孔中填充导电材料 使得在孔中形成通孔导体，并且第一和第二导体经由通孔导体连接。 孔的形成包括在第一表面中形成第一开口，从第一开口的底部朝向第二表面形成第二开口，使得第二开口具有比第一开口更小的直径，在第二开口中形成第三开口 并且从第三开口的底部朝向第一表面形成第四开口，使得第四开口具有比第三开口小的直径。

    MULTILAYER PRINTED WIRING BOARD
    84.
    发明申请
    MULTILAYER PRINTED WIRING BOARD 审中-公开
    多层印刷接线板

    公开(公告)号：US20120199386A1

    公开(公告)日：2012-08-09

    申请号：US13325414

    申请日：2011-12-14

    Applicant: Takema Adachi ,  Liyi Chen

    Inventor： Takema Adachi ,  Liyi Chen

    IPC: H05K1/02 ,  H05K3/02

    CPC classification number: H05K3/445 ,  H01L23/142 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/056 ,  H05K3/0032 ,  H05K3/3478 ,  H05K3/4608 ,  H05K3/4652 ,  H05K3/4661 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/09854 ,  H05K2203/0323 ,  H05K2203/1572

    Abstract: A printed wiring board including a core substrate having a metal layer, a first resin insulation layer on a surface of the metal layer and a second resin insulation layer on the opposite surface of the metal layer, a first conductive circuit formed on the first layer, a second conductive circuit formed on the second layer, and a through-hole conductor formed in a penetrating hole through the substrate and connecting the first and second circuits. The metal layer has an opening filled with a filler resin, the penetrating hole has a first opening in the first layer, a second opening in the second layer and a third opening in the filler resin, the first opening tapers toward the filler resin, the second opening tapers toward the filler resin, and the third opening is connecting the first and second openings.

    Abstract translation: 一种印刷电路板，包括具有金属层的芯基板，在所述金属层的表面上的第一树脂绝缘层和在所述金属层的相对表面上的第二树脂绝缘层，形成在所述第一层上的第一导电电路， 形成在第二层上的第二导电电路，以及形成在穿过基板的穿透孔中并连接第一和第二电路的通孔导体。 金属层具有填充有填充树脂的开口，贯通孔在第一层中具有第一开口，在第二层中具有第二开口，在填充树脂中具有第三开口，第一开口朝着填充树脂逐渐变细， 第二开口朝向填充树脂逐渐变细，第三开口连接第一和第二开口。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    85.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    印刷线路板及其制造方法

    公开(公告)号：US20120186868A1

    公开(公告)日：2012-07-26

    申请号：US13435450

    申请日：2012-03-30

    Applicant: Kota Noda ,  Tsutomu Yamauchi

    Inventor： Kota Noda ,  Tsutomu Yamauchi

    IPC: H05K1/11

    CPC classification number: H05K1/115 ,  H05K1/0269 ,  H05K3/0032 ,  H05K3/0038 ,  H05K3/423 ,  H05K3/427 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09918 ,  H05K2203/0554 ,  H05K2203/1572 ,  H05K2203/166 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49165

    Abstract: A wiring board having a penetrating hole formed by forming holes with different shapes from both surfaces of a substrate. In such a penetrating hole, the depth of a first opening portion formed in the first-surface side of the substrate is shallower than the depth of a second opening portion formed in the second-surface side, and the diameter of a first opening is greater than the diameter of a second opening. Even if the gravity line of the first opening portion and the gravity line of the second opening portion are shifted from each other, the region of the second opening portion inserted into the inner space of the first opening portion may be made larger.

    Abstract translation: 一种布线板，具有通过从基板的两个表面形成具有不同形状的孔而形成的贯通孔。 在这样的贯通孔中，形成在基板的第一表面侧的第一开口部的深度比形成在第二表面侧的第二开口部的深度浅，第一开口的直径更大 比第二开口的直径。 即使第一开口部分的重力线和第二开口部分的重力线彼此偏移，可以使插入第一开口部分的内部空间的第二开口部分的区域更大。

    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME
    89.
    发明申请
    WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 有权
    接线板及其制造方法

    公开(公告)号：US20110209904A1

    公开(公告)日：2011-09-01

    申请号：US12952864

    申请日：2010-11-23

    Applicant: Atsushi ISHIDA ,  Ryojiro Tominaga ,  Kenji Sakai

    Inventor： Atsushi ISHIDA ,  Ryojiro Tominaga ,  Kenji Sakai

    IPC: H05K1/11 ,  H05K1/09 ,  H05K1/00 ,  H05K3/42

    CPC classification number: H05K3/4038 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49165

    Abstract: A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.

    Abstract translation: 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。

    ELECTRICAL CONNECTOR WITH SOLDER COLUMNS
    90.
    发明申请
    ELECTRICAL CONNECTOR WITH SOLDER COLUMNS 有权
    带金属柱的电气连接器

    公开(公告)号：US20110203838A1

    公开(公告)日：2011-08-25

    申请号：US12710189

    申请日：2010-02-22

    Applicant: Alan MacDougall ,  Robert Daniel Hilty ,  George Jyh-Shann Chou

    Inventor： Alan MacDougall ,  Robert Daniel Hilty ,  George Jyh-Shann Chou

    IPC: H01R12/04

    CPC classification number: H01R12/52 ,  G01R1/0416 ,  H05K3/32 ,  H05K3/3436 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2203/0278 ,  H05K2203/162 ,  Y02P70/613

    Abstract: An electrical connector is provided for mating with an electrical component. The connector includes a substrate having a mating side, and a solder column extending from the mating side of the substrate. The solder column includes a base that is engaged with the substrate. The solder column extends a length away from the mating side of the substrate to a tip. The tip includes a contact surface that is configured to engage and electrically connect to an electrical contact of the electrical component. The solder column is linearly tapered along at least a portion of the length from the base to the tip.

    Abstract translation: 提供电连接器用于与电气部件配合。 连接器包括具有配合侧的基板和从基板的配合侧延伸的焊料柱。 焊料柱包括与基底接合的基底。 焊料柱从衬底的配合侧向尖端延伸一段长度。 尖端包括被配置为接合并电连接到电气部件的电触点的接触表面。 焊料柱沿着从基部到尖端的长度的至少一部分线性渐缩。

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