Patent search cpc:"H05K2201/10878" Page 9

81.

发明申请
CIRCUIT BOARD AND MANUFACTURING METHOD OF CIRCUIT BOARD 审中-公开
Title translation: 电路板电路板及其制造方法

公开(公告)号：US20150264810A1

公开(公告)日：2015-09-17

申请号：US14636356

申请日：2015-03-03

Applicant: FUJITSU LIMITED

Inventor： Shunji BABA , Manabu WATANABE , Kenji FUKUZONO , Satoshi OHSAWA , Tetsuro YAMADA , Akihiro WAKABAYASHI , Yasushi MASUDA , Yohei MIURA

IPC: H05K1/11 , H05K3/30 , H05K3/10 , H05K1/18

CPC classification number: H05K1/115 , H01L23/3675 , H01L24/16 , H01L24/32 , H01L24/73 , H01L2224/16227 , H01L2224/16245 , H01L2224/32245 , H01L2224/73253 , H01L2924/15311 , H01L2924/16235 , H01L2924/16251 , H01L2924/167 , H01L2924/19041 , H01L2924/19106 , H05K1/0263 , H05K1/11 , H05K1/144 , H05K1/184 , H05K1/185 , H05K3/22 , H05K3/325 , H05K3/40 , H05K3/4046 , H05K2201/0311 , H05K2201/042 , H05K2201/045 , H05K2201/10 , H05K2201/10189 , H05K2201/10303 , H05K2201/10659 , H05K2201/10666 , H05K2201/10878 , H05K2201/10901 , H05K2203/176 , Y10T29/4913 , Y10T29/49147

Abstract: A circuit board includes: a substrate; a through hole formed in the substrate; and a connection terminal provided in the through hole; wherein the connection terminal includes a pedestal portion provided within the through hole and a pin which is provided at a center of the pedestal portion and extends from the pedestal portion toward a first surface of the substrate, so that a first end portion protrudes from the first surface.

Abstract translation: 电路板包括：基板; 形成在基板中的通孔; 以及设置在通孔中的连接端子; 其中，所述连接端子包括设置在所述通孔内的基座部分和设置在所述基座部分的中心并且从所述基座部朝向所述基板的第一表面延伸的销，使得所述第一端部从所述第一端部突出，表面。

82.

发明授权
PCB connector having a conductive base body having a spring body and a put-through body 有权
Title translation: PCB连接器，具有导体基体，其具有弹簧体和穿通体

公开(公告)号：US09124040B2

公开(公告)日：2015-09-01

申请号：US14248888

申请日：2014-04-09

Applicant: Knuerr GmbH

Inventor： Josef Feigl

IPC: H01R12/00 , H01R12/70 , H01R12/58 , H05K3/40 , H01R12/52

CPC classification number: H01R12/7082 , H01R12/523 , H01R12/585 , H05K1/113 , H05K1/144 , H05K3/368 , H05K3/40 , H05K2201/042 , H05K2201/09863 , H05K2201/10303 , H05K2201/1059 , H05K2201/10878

Abstract: The invention relates to a PCB connector for fastening a first printed circuit board on a second printed circuit board. The PCB connector may have a longitudinal base body with a clamping and fastening device for tool-free fastening of the PCB connector on a printed circuit board. The clamping and fastening device has a put-through body and a spring body which is formed extendable upon putting-through the put-through body through the land. The base body is thus pressed against the printed circuit board by the spring body.

Abstract translation: 本发明涉及一种用于将第一印刷电路板固定在第二印刷电路板上的PCB连接器。 PCB连接器可以具有带有夹紧和紧固装置的纵向基体，用于将PCB连接器无缝地固定在印刷电路板上。夹紧和紧固装置具有穿透体和弹簧体，弹性体在穿过穿过体穿过脊部时形成为可延伸的。基体因此被弹簧体压靠在印刷电路板上。

83.

发明申请
Enlarged Press-Fit Hole 审中-公开
Title translation: 放大压孔

公开(公告)号：US20150173181A1

公开(公告)日：2015-06-18

申请号：US14107069

申请日：2013-12-16

Applicant: Cisco Technology, Inc.

Inventor： Dewen Xu , Jingping Wang , Jianqun Fu , Jiang Wang , Jing An

IPC: H05K1/02 , H05K3/00

CPC classification number: H05K3/325 , H05K3/308 , H05K2201/09845 , H05K2201/1059 , H05K2201/10878 , Y10T29/49153

Abstract: An apparatus may be provided. The apparatus may comprise a circuit board and a bore. The circuit board may have a component side surface and a bottom side surface. The bore may be disposed in the circuit board. The bore may extent from the component side surface to the bottom side surface. The bore may comprise a first portion and a second portion. The first portion may have a first diameter. The second portion may be disposed between the first portion and the component side surface. The second portion may have a second diameter greater than the first diameter.

Abstract translation: 可以提供一种装置。该装置可以包括电路板和孔。电路板可以具有部件侧表面和底侧表面。孔可以设置在电路板中。孔可以从部件侧表面到底侧表面。孔可以包括第一部分和第二部分。第一部分可以具有第一直径。第二部分可以设置在第一部分和部件侧表面之间。第二部分可以具有大于第一直径的第二直径。

84.

发明申请
ELECTRICAL CONNECTOR AND ASSEMBLY OF THE ELECTRICAL CONNECTOR AND A CIRCUIT BOARD 审中-公开
Title translation: 电气连接器和电气连接器和电路板的组件

公开(公告)号：US20150044889A1

公开(公告)日：2015-02-12

申请号：US14318851

申请日：2014-06-30

Applicant: LITE-ON ELECTRONICS (GUANGZHOU) LIMITED , LITE-ON TECHNOLOGY CORP.

Inventor： CHUNG-FU WANG , NIEN-HUNG YAO , HSIN-YU YANG , YU-SHAN KAO

IPC: H01R4/02 , H05K1/11 , H01R12/57

CPC classification number: H01R4/02 , H01R12/57 , H01R12/585 , H01R12/707 , H01R12/716 , H05K1/11 , H05K3/3447 , H05K2201/10189 , H05K2201/10856 , H05K2201/10878

Abstract: An electrical connector includes an insulating body having a bottom surface, a receiving groove formed in the bottom surface, and at least one support block projecting downwardly from the bottom surface for connection with a circuit board and cooperating with the bottom surface to define a venting space that communicates with the receiving groove and a solder hole in the circuit board. A conductive terminal includes a first positioning portion extending into and positioned in the receiving groove, and a second positioning portion connected to the first positioning portion and extending through the venting space and adapted to be positioned in the solder hole.

Abstract translation: 电连接器包括具有底表面的绝缘体，形成在底表面中的接收槽，以及从底表面向下伸出的至少一个支撑块，用于与电路板连接并与底表面配合以形成通气空间其与电路板中的接收槽和焊接孔连通。导电端子包括延伸到接收槽中并定位在接收槽中的第一定位部分和连接到第一定位部分并延伸穿过通气空间并适于定位在焊料孔中的第二定位部分。

85.

发明申请
EYE-OF-THE NEEDLE PIN CONTACT 有权
Title translation: 眼睛指针联系人

公开(公告)号：US20140099839A1

公开(公告)日：2014-04-10

申请号：US13647143

申请日：2012-10-08

Applicant: Tyco Electronics Corporation

Inventor： David Allison Trout

IPC: H01R4/26

CPC classification number: H01R4/26 , H01R12/585 , H05K3/308 , H05K2201/10189 , H05K2201/1059 , H05K2201/10878

Abstract: An eye-of-the needle (EON) pin contact is provided for being received within an electrical via that includes conductive material. The EON pin contact includes a compliant segment having two opposing spring arms and an opening defined between the spring arms. The compliant segment is configured to be received within the electrical via such that the spring arms engage the conductive material of the electrical via. A tip segment extends from the compliant segment. The tip segment is configured to be received into the electrical via before the compliant segment is received into the electrical via. The tip segment includes a broach that is configured to displace the conductive material as the tip segment is received into the electrical via to plow a path through the conductive material for reception of a corresponding one of the spring arms.

Abstract translation: 提供了针（EON）针接头，用于接收在包括导电材料的电通孔内。 EON针触点包括具有两个相对的弹簧臂的柔顺部分和在弹簧臂之间限定的开口。柔性段被配置为被接收在电通孔内，使得弹簧臂接合电通孔的导电材料。尖端部分从适应部分延伸。尖端段被配置为在柔性段被接收到电通路内之前被接收到电通路中。尖端段包括拉杆，其被配置为当尖端段被接收到电通孔中时移动导电材料，以犁穿通过导电材料的路径以接收相应的一个弹簧臂。

86.

发明申请
UNIVERSAL PRESS-FIT CONNECTION FOR PRINTED CIRCUIT BOARDS 有权
Title translation: 用于印刷电路板的通用压力连接

公开(公告)号：US20130316551A1

公开(公告)日：2013-11-28

申请号：US13481176

申请日：2012-05-25

Applicant: James A. Day, JR. , Zachary B. Durham , Luke D. Remis , Tony C. Sass , Gregory D. Sellman

Inventor： James A. Day, JR. , Zachary B. Durham , Luke D. Remis , Tony C. Sass , Gregory D. Sellman

IPC: H01R12/58 , H05K3/30

CPC classification number: H05K13/04 , H01R12/585 , H05K1/115 , H05K3/308 , H05K3/325 , H05K2201/09845 , H05K2201/1059 , H05K2201/10856 , H05K2201/10878

Abstract: A universal press-fit connection allows a component having a connector pin to be connected to a compatible plated through hole of a circuit board regardless of circuit board thickness. The connector pin includes a proximate end adjacent the component, a distal end with a fork lock, and a compliant portion between the proximate and distal ends. A multi-width through hole includes a first portion partially extending through the circuit board and a second, wider portion extending beyond the first portion. The fork lock initially moves radially inward upon insertion into the first portion via flexing of the compliant portion, and re-expands when entering the second portion. The compliant portion engages the through hole and the fork lock secures the connector pin in the through hole.

Abstract translation: 通用压配合连接允许具有连接器引脚的部件连接到电路板的兼容的电镀通孔，而与电路板厚度无关。连接器销包括邻近部件的近端，具有叉锁的远端以及近端和远端之间的柔顺部分。多宽度通孔包括部分延伸穿过电路板的第一部分和延伸超过第一部分的第二较宽部分。当通过柔性部分的弯曲插入到第一部分中时，叉锁首先向内径向移动，并且当进入第二部分时，叉锁重新膨胀。柔性部分接合通孔，叉锁将连接器销固定在通孔中。

87.

发明授权
Probe card assembly and kit, and methods of making same 失效
Title translation: 探针卡组装和试剂盒，以及制作方法

公开(公告)号：US08373428B2

公开(公告)日：2013-02-12

申请号：US12535070

申请日：2009-08-04

Applicant: Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu

Inventor： Benjamin N. Eldridge , Gary W. Grube , Igor Y. Khandros , Gaetan L. Mathieu

IPC: G01R31/00

CPC classification number: B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D7/12 , C25D21/02 , G01R1/07342 , G01R1/07378 , G01R31/2884 , G01R31/2886 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/49811 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L25/16 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/73203 , H01L2224/81801 , H01L2224/85201 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/10329 , H01L2924/12042 , H01L2924/14 , H01L2924/1532 , H01L2924/15787 , H01L2924/19041 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H05K1/141 , H05K3/20 , H05K3/308 , H05K3/326 , H05K3/3421 , H05K3/3426 , H05K3/368 , H05K3/4015 , H05K2201/068 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , Y02P70/613 , Y10T29/49155 , Y10T29/49222 , H01L2924/00

Abstract: A probe card assembly includes a probe card, a space transformer having resilient contact structures (probe elements) mounted directly to (i.e., without the need for additional connecting wires or the like) and extending from terminals on a surface thereof, and an interposer disposed between the space transformer and the probe card. The space transformer and interposer are “stacked up” so that the orientation of the space transformer, hence the orientation of the tips of the probe elements, can be adjusted without changing the orientation of the probe card. Suitable mechanisms for adjusting the orientation of the space transformer, and for determining what adjustments to make, are disclosed. The interposer has resilient contact structures extending from both the top and bottom surfaces thereof, and ensures that electrical connections are maintained between the space transformer and the probe card throughout the space transformer's range of adjustment, by virtue of the interposer's inherent compliance. Multiple die sites on a semiconductor wafer are readily probed using the disclosed techniques, and the probe elements can be arranged to optimize probing of an entire wafer. Composite interconnection elements having a relatively soft core overcoated by a relatively hard shell, as the resilient contact structures are described.

Abstract translation: 探针卡组件包括探针卡，具有弹性接触结构（探针元件）的空间变换器，其直接安装到（即，不需要额外的连接线等）并且从其表面上的端子延伸，并且设置有插入器空间变压器和探针卡之间。空间变换器和插入器被堆叠，使得可以调节空间变换器的取向，从而可以调节探针元件的尖端的取向而不改变探针卡的取向。公开了用于调整空间变换器的取向以及用于确定进行什么调整的适当机构。插入器具有从其顶表面和底表面延伸的弹性接触结构，并且确保通过插入件的固有顺应性，在整个空间变压器的调节范围内在空间变压器和探针卡之间保持电连接。使用所公开的技术容易地探测半导体晶片上的多个裸片位置，并且可以布置探针元件以优化整个晶片的探测。作为弹性接触结构的描述，具有由相对硬的外壳覆盖的相对软的芯的复合互连元件。

88.

发明授权
Socket for making with electronic component, particularly semiconductor device with spring packaging, for fixturing, testing, burning-in or operating such a component 失效
Title translation: 用于制造电子元件的插座，特别是具有弹簧封装的半导体器件，用于固定，测试，燃烧或操作这样的部件

公开(公告)号：US07534654B2

公开(公告)日：2009-05-19

申请号：US11733562

申请日：2007-04-10

Applicant: David V. Pedersen , Benjamin N. Eldridge , Igor Y. Khandros

Inventor： David V. Pedersen , Benjamin N. Eldridge , Igor Y. Khandros

IPC: H01L21/44 , H01L21/48 , H01L21/50

CPC classification number: H01L25/16 , B23K1/0016 , B23K20/004 , B23K2101/40 , C25D5/08 , C25D5/22 , C25D21/02 , G01R1/0408 , G01R1/0433 , G01R1/06711 , G01R1/07342 , G01R1/07378 , G01R31/01 , G01R31/2863 , G01R31/2886 , G01R31/2889 , H01L21/4853 , H01L21/4889 , H01L21/563 , H01L22/20 , H01L23/04 , H01L23/13 , H01L23/32 , H01L23/49811 , H01L23/5385 , H01L24/06 , H01L24/11 , H01L24/12 , H01L24/16 , H01L24/45 , H01L24/49 , H01L24/72 , H01L24/81 , H01L25/0652 , H01L2223/54473 , H01L2224/0401 , H01L2224/04042 , H01L2224/05553 , H01L2224/05599 , H01L2224/06136 , H01L2224/1134 , H01L2224/13099 , H01L2224/16145 , H01L2224/45144 , H01L2224/49109 , H01L2224/73203 , H01L2224/81136 , H01L2224/81801 , H01L2224/85201 , H01L2224/85399 , H01L2225/0651 , H01L2225/06527 , H01L2225/06555 , H01L2225/06572 , H01L2924/00013 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01028 , H01L2924/01033 , H01L2924/01051 , H01L2924/01061 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/12042 , H01L2924/12044 , H01L2924/14 , H01L2924/1433 , H01L2924/1532 , H01L2924/15787 , H01L2924/16152 , H01L2924/19043 , H05K1/141 , H05K3/20 , H05K3/325 , H05K3/326 , H05K3/3421 , H05K3/368 , H05K3/4015 , H05K2201/09472 , H05K2201/1031 , H05K2201/10318 , H05K2201/10757 , H05K2201/10878 , H05K2201/10909 , H05K2201/10946 , Y02P70/611 , H01L2924/00 , H01L2224/48

Abstract: Products and assemblies are provided for socketably receiving elongate interconnection elements, such as spring contact elements, extending from electronic components, such as semiconductor devices. Socket substrates are provided with capture pads for receiving ends of elongate interconnection elements extending from electronic components. Various capture pad configurations are disclosed. Connections to external devices are provided via conductive traces adjacent the surface of the socket substrate. The socket substrate may be supported by a support substrate. In a particularly preferred embodiment the capture pads are formed directly on a primary substrate such as a printed circuit board.

Abstract translation: 提供产品和组件用于可插拔地接收从电子部件（例如半导体器件）延伸的细长互连元件，例如弹簧接触元件。插座基板设置有用于接收从电子部件延伸的细长互连元件的端部的捕获垫。公开了各种捕获垫结构。通过邻近插座基板表面的导电迹线提供与外部设备的连接。插座基板可以由支撑基板支撑。在特别优选的实施例中，捕获垫直接形成在诸如印刷电路板的主要基底上。

89.

发明申请
LIGHT SOURCE UNIT, BACKLIGHT UNIT AND LIQUID CRYSTAL DISPLAY INCLUDING THE SAME, AND METHOD THEREOF 有权
Title translation: 光源单元，背光单元和包括其的液晶显示器及其方法

公开(公告)号：US20080106898A1

公开(公告)日：2008-05-08

申请号：US11936501

申请日：2007-11-07

Applicant: Jin Hee PARK , Jung Tae KANG , Jin Ho HA , Hyun Chul BAE , Joo Young KIM

Inventor： Jin Hee PARK , Jung Tae KANG , Jin Ho HA , Hyun Chul BAE , Joo Young KIM

IPC: F21V21/00 , H01J9/00

CPC classification number: F21V19/0025 , G02F1/133603 , H01L33/62 , H01L2224/48091 , H05K1/182 , H05K3/308 , H05K2201/10106 , H05K2201/1059 , H05K2201/10651 , H05K2201/10765 , H05K2201/10856 , H05K2201/10878 , H01L2924/00014

Abstract: A light source unit including light emitting diodes mounted on a printed circuit board by not using a soldering method but a fitting method, and a backlight unit and liquid crystal display including the light source unit. The light source unit includes light emitting diodes including lead terminals and a printed circuit board including a fitting hole. Each of the lead terminals includes a base part and a fitting part protruding from the base part. The fitting part of the light emitting diode is fitted into the fitting hole of the printed circuit board and so that the light emitting diode is mounted on the printed circuit board.

Abstract translation: 一种光源单元，包括通过不使用焊接方法而不是使用拟合方法安装在印刷电路板上的发光二极管，以及包括该光源单元的背光单元和液晶显示器。光源单元包括包括引线端子和包括装配孔的印刷电路板的发光二极管。每个引线端子包括基部和从基部突出的嵌合部。发光二极管的装配部分装配到印刷电路板的装配孔中，使得发光二极管安装在印刷电路板上。