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公开(公告)号：AU2021417882A9
公开(公告)日：2024-04-18
申请号：AU2021417882
申请日：2021-12-30
Applicant: IBM
Inventor： CHOW JERRY , GUMANN PATRYK
Abstract: Techniques facilitating transfer port systems for cryogenic environments are provided. In one example, an outer vacuum chamber of a cryostat can comprise a sidewall encompassing an inner chamber comprising a sample mounting surface. The sidewall can comprise a feedthrough port providing access to the sample mounting surface from a region external to the outer vacuum chamber.
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公开(公告)号：CA3136508A1
公开(公告)日：2020-10-15
申请号：CA3136508
申请日：2020-04-06
Applicant: IBM
Inventor： ADIGA VIVEKANANDA , SANDBERG MARTIN , CHOW JERRY , PAIK HANHEE
Abstract: A qubit includes a substrate, and a first capacitor structure having a lower portion formed on a surface of the substrate and at least one first raised portion extending above the surface of the substrate. The qubit further includes a second capacitor structure having a lower portion formed on the surface of the substrate and at least one second raised portion extending above the surface of the substrate. The first capacitor structure and the second capacitor structure are formed of a superconducting material. The qubit further includes a junction between the first capacitor structure and the second capacitor structure. The junction is disposed at a predetermined distance from the surface of the substrate and has a first end in contact with the first raised portion and a second end in contact with the second raised portion.
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公开(公告)号：DE112017003036T5
公开(公告)日：2019-02-28
申请号：DE112017003036
申请日：2017-11-09
Applicant: IBM
Inventor： ABDO BALEEGH , CHOW JERRY
IPC: H03F19/00
Abstract: Ein System zum Ansteuern und Auslesen von Qubits weist einen ersten verlustfreien Mikrowellenschalter auf, der mit einem Quantensystem verbunden ist. Ein zweiter verlustfreier Mikrowellenschalter ist mit dem ersten verlustfreien Mikrowellenschalter verbindbar. Ein quantenlimitierter Verstärker ist mit dem zweiten verlustfreien Mikrowellenschalter verbindbar.
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公开(公告)号：AU2021417883A9
公开(公告)日：2025-03-13
申请号：AU2021417883
申请日：2021-12-30
Applicant: IBM
Inventor： GUMANN PATRYK , GRENDANIN VALERIO , HART SEAN , MCKAY DAVID , CHOW JERRY , ZARSKY DAVID , BAUER GILBERT
Abstract: A cryostat (100), comprising: a thermal shield (210) extending between a thermal stage (141) and a base structure (160) coupled to a bottom plate (116) of an outer vacuum chamber (110), the thermal stage (141) coupled to a top plate (114) of the outer vacuum chamber (110), the thermal shield (210) providing access to a sample mounting surface (430) encompassed within the thermal shield (210) from a region external to the outer vacuum chamber (110) via the top and bottom plates (114, 116) of the outer vacuum chamber (110).
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公开(公告)号：AU2022205759B2
公开(公告)日：2025-01-30
申请号：AU2022205759
申请日：2022-01-05
Applicant: IBM
Inventor： CORCOLES-GONZALEZ ANTONIO , GUMANN PATRYK , CHOW JERRY
Abstract: Techniques facilitating multiple cryogenic systems sectioned within a common vacuum space are provided. In one example, a cryostat can comprise a plurality of thermal stages and a thermal switch. The plurality of thermal stages can intervene between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that can be directly coupled mechanically to the Still stage via a support rod. The thermal switch can be coupled to the intermediate thermal stage and an adjacent thermal stage. The thermal switch can facilitate modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.
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Patent Agency Ranking
公开(公告)号：BR112021025694A2
公开(公告)日：2022-02-08
申请号：BR112021025694
申请日：2020-06-19
Applicant: IBM
Inventor： BERNARDO SALVATORE OLIVADESE , DANIELA FLORENTINA BOGORIN , CHOW JERRY , BRINK MARKUS , NICHOLAS TORLEIV BRONN , JINKA OBLESH , GUMANN PATRYK , HART SEAN
IPC: F25D19/00 , H01L23/367
Abstract: embalagem criogênica para termalização de dispositivos de temperatura baixa. uma estrutura de termalização é formada utilizando uma cobertura configurada com um conjunto de pilares, a cobertura sendo parte de um invólucro criogênico de um dispositivo de baixa temperatura (ltd). um chip incluindo o ltd é configurado com um conjunto de cavidades, uma cavidade no conjunto de cavidades tendo um perfil de cavidade. um pilar a partir do conjunto de pilares e correspondendo à cavidade tem um perfil de pilar de modo que o perfil de pilar faça com que o pilar acople com a cavidade do perfil de cavidade em uma tolerância de folga para termicamente acoplar o chip à cobertura para dissipação de calor em uma operação criogênica do chip.
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公开(公告)号：CA3143396A1
公开(公告)日：2020-12-24
申请号：CA3143396
申请日：2020-06-15
Applicant: IBM
Inventor： CHOW JERRY , ROSENBLATT SAMI
Abstract: A quantum computing device (300) is formed using a first chip (302) and a second chip (306), the first chip having a first substrate (303), a first set of pads (312 A,B), and a set of Josephson junctions (304) disposed on the first substrate. The second chip has a second substrate (307), a second set of pads (308) disposed on the second substrate opposite the first set of pads, and a second layer (310 A, B) formed on a subset of the second set of pads. The second layer is configured to bond the first chip and the second chip. The subset of the second set of pads corresponds to a subset of the set of Josephson junctions selected to avoid frequency collision between qubits in a set of qubits. A qubit is formed using a Josephson junction from the subset of Josephson junctions and another Josephson junction not in the subset being rendered unusable for forming qubits.
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公开(公告)号：AU2020399936A1
公开(公告)日：2022-05-26
申请号：AU2020399936
申请日：2020-12-07
Applicant: IBM
Inventor： ADIGA VIVEKANANDA , SANDBERG MARTIN , SOLGUN FIRAT , CHOW JERRY
Abstract: Devices, systems, methods, computer-implemented methods, apparatus, and/or computer program products that can facilitate a switch device that shifts frequency of a resonator in a quantum device are provided. According to an embodiment, a device (102) comprises a readout resonator (104) coupled to a qubit. The device can further comprise a switch device (108) formed across the readout resonator that shifts frequency of the readout resonator based on position of the switch device. According to another embodiment, a device comprises a bus resonator coupled to a plurality of qubits. The device can further comprise a switch device formed across the bus resonator that shifts frequency of the bus resonator based on position of the switch device.
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公开(公告)号：IL288976D0
公开(公告)日：2022-02-01
申请号：IL28897621
申请日：2021-12-13
Applicant: IBM , CHOW JERRY , ROSENBLATT SAMI
Inventor： CHOW JERRY , ROSENBLATT SAMI
Abstract: A quantum computing device is formed using a first chip and a second chip, the first chip having a first substrate, a first set of pads, and a set of Josephson junctions disposed on the first substrate. The second chip has a second substrate, a second set of pads disposed on the second substrate opposite the first set of pads, and a second layer formed on a subset of the second set of pads. The second layer is configured to bond the first chip and the second chip. The subset of the second set of pads corresponds to a subset of the set of Josephson junctions selected to avoid frequency collision between qubits in a set of qubits. A qubit is formed using a Josephson junction from the subset of Josephson junctions and another Josephson junction not in the subset being rendered unusable for forming qubits.
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公开(公告)号：IL286615D0
公开(公告)日：2021-10-31
申请号：IL28661521
申请日：2021-09-22
Applicant: IBM , ADIGA VIVEKANANDA , SANDBERG MARTIN , CHOW JERRY , PAIK HANHEE
Inventor： ADIGA VIVEKANANDA , SANDBERG MARTIN , CHOW JERRY , PAIK HANHEE
Abstract: A qubit includes a substrate, and a first capacitor structure having a lower portion formed on a surface of the substrate and at least one first raised portion extending above the surface of the substrate. The qubit further includes a second capacitor structure having a lower portion formed on the surface of the substrate and at least one second raised portion extending above the surface of the substrate. The first capacitor structure and the second capacitor structure are formed of a superconducting material. The qubit further includes a junction between the first capacitor structure and the second capacitor structure. The junction is disposed at a predetermined distance from the surface of the substrate and has a first end in contact with the first raised portion and a second end in contact with the second raised portion.
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