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1.
公开(公告)号:MY173413A
公开(公告)日:2020-01-23
申请号:MYPI2014700259
申请日:2012-08-09
Applicant: SOLEXEL INC
Inventor: MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER K -JOSEF , RANA VIRENDRA V , SEUTTER SEAN , DESHPANDE ANAND , CALCATERRA ANTHONY , OLSEN GERRY , MANTEGHI KAMRAN , STALCUP THOM , KAMIAN GEORGE D , WANG DAVID XUAN-QI , SU YEN-SHENG , WINGERT MICHAEL
Abstract: Fabrication methods and structures relating to backplanes for back contact solar cells that provide for solar cell substrate reinforcement and electrical interconnects as well as Fabrication methods and structures for forming thin film back contact solar cells are described. The Most Illustrative Drawing: Figure 4
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公开(公告)号:MY166305A
公开(公告)日:2018-06-25
申请号:MYPI2012700546
申请日:2010-12-09
Applicant: SOLEXEL INC
Inventor: MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER KARL-JOSEF , WANG DAVID XUAN QI , SEUTTER SEAN , RANA VIRENDRA V , CALCATERRA ANTHONY , VAN KERSCHAVER EMMANUEL
IPC: H01L31/0224 , H01L31/18
Abstract: Back contact back junction solar cell and methods for manufacturing are provided. The back contact back junction solar cell comprises a substrate having a light capturing frontside surface with a passivation layer, a doped base region, and a doped backside emitter region with a polarity opposite the doped base region. A backside passivation layer and patterned reflective layer on the emitter form a light trapping backside mirror. An interdigitated metallization pattern is positioned on the backside of the solar cell and a permanent reinforcement provides support to the cell. Figure 13
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公开(公告)号:AU2013337262A1
公开(公告)日:2015-05-21
申请号:AU2013337262
申请日:2013-11-05
Applicant: SOLEXEL INC
Inventor: MOSLEHI MEHRDAD M
IPC: H01L31/042 , H01L31/18
Abstract: According to one aspect of the disclosed subject matter, a monolithically isled solar cell is provided. The solar cell comprises a semiconductor layer having a light receiving frontside and a backside opposite the frontside and attached to an electrically insulating backplane. A trench isolation pattern partitions the semiconductor layer into electrically isolated isles on the electrically insulating backplane. A first metal layer having base and emitter electrodes is positioned on the semiconductor layer backside. A patterned second metal layer providing cell interconnection and connected to the first metal layer by via plugs is positioned on the backplane.
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公开(公告)号:AU2013272248A1
公开(公告)日:2014-11-13
申请号:AU2013272248
申请日:2013-04-24
Applicant: SOLEXEL INC
Inventor: MOSLEHI MEHRDAD M , KAPUR PAWAN , KRAMER KARL-JOSEF
Abstract: Fabrication methods and structures relating to multi-level metallization of solar cells are described. In one embodiment, a back contact solar cell comprises a substrate having a light receiving frontside surface and a backside surface for forming patterned emitter and base regions. A first electrically conductive metallization layer is patterned on the backside base and emitter regions. An electrically insulating layer is formed on the first electrically conductive metallization layer and a second electrically conductive metallization layer is formed on the electrically insulating layer. The second electrically conductive metallization layer is connected to the first electrically conductive metallization layer through conductive via plugs formed in the electrically insulating layer.
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公开(公告)号:MY173459A
公开(公告)日:2020-01-26
申请号:MYPI2013701141
申请日:2011-12-30
Applicant: SOLEXEL INC
Inventor: MOSLEHI MEHRDAD M , RANA VIRENDRA V , ANBALAGAN PRANAV , SARASWAT VIVEK
IPC: B23K26/36 , H01L31/0216 , H01L31/04 , H01L31/18
Abstract: Various laser processing schemes are disclosed for producing various types of hetero junction and homo-junction solar cells. The methods include base and emitter contact opening, selective doping, metal ablation, annealing to improve passivation, and selective emitter doping via laser heating of aluminum. Also, laser processing schemes are disclosed that are suitable for selective amorphous silicon ablation and selective doping for hetero-junction solar cells. Laser ablation techniques are disclosed that leave the underlying silicon substantially undamaged. These laser processing techniques may be applied to semiconductor substrates, including crystalline silicon substrates, and further including crystalline silicon substrates which are manufactured either through wire saw wafering methods or via epitaxial deposition processes, or other cleavage techniques such as ion implantation and heating, that are either planar or textured/three-dimensional. These techniques are highly suited to thin crystalline semiconductor, including thin crystalline silicon films.
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公开(公告)号:AU2013225860B2
公开(公告)日:2017-01-19
申请号:AU2013225860
申请日:2013-02-28
Applicant: SOLEXEL INC
Inventor: KAPUR PAWAN , MOSLEHI MEHRDAD M
IPC: H01L31/042 , H01L31/0735 , H01L31/18
Abstract: Methods and structures are provided for the growth and separation of a relatively thin layer crystalline compound semiconductor material containing III-V device layers, including but not limited to Gallium Arsenide (GaAs), on top of a crystalline silicon template wafer. Solar cell structures and manufacturing methods based on the crystalline compound semiconductor material are described.
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公开(公告)号:AU2012362505B2
公开(公告)日:2015-08-20
申请号:AU2012362505
申请日:2012-12-26
Applicant: SOLEXEL INC
Inventor: MOSLEHI MEHRDAD M , RANA VIRENDRA V , COUTANT SOLENE , DESHAZER HEATHER , ANBALAGAN PRANAV , RATTLE BENJAMIN
IPC: H01L31/042 , H01L31/0236 , H01L31/18
Abstract: Methods for improving the light trapping characteristics of crystalline silicon solar cells are provided. In one embodiment, the backside surface of a crystalline silicon solar cell substrate is textured with a pulsed laser beam. The textured backside surface of the back contact solar cell crystalline silicon substrate is then annealed to remove damage from the laser texturization process. Backside metallization is then formed on backside base and emitter regions.
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公开(公告)号:AU2013267481A1
公开(公告)日:2015-01-22
申请号:AU2013267481
申请日:2013-05-29
Applicant: COUTANT SOLENE , SEUTTER SEAN , KOMMERA SWAROOP , ANBALAGAN PRANAV , SOLEXEL INC , KAPUR PAWAN , RATTLE BENJAMINE , DESHAZER HEATHER , DESHPANDE ANAND , MOSLEHI MEHRDAD , RANA VIRENDRA
Inventor: DESHPANDE ANAND , KAPUR PAWAN , RANA VIRENDRA V , MOSLEHI MEHRDAD M , SEUTTER SEAN M , DESHAZER HEATHER , KOMMERA SWAROOP , ANBALAGAN PRANAV , RATTLE BENJAMINE E , COUTANT SOLENE
Abstract: Fabrication methods and structures relating to multi-level metallization of solar cells are described. In one embodiment, a back contact solar cell comprises a substrate having a substrate having a light receiving frontside surface and a backside surface for forming patterned emitter and non-nested base regions. Interdigitated doped emitter and base regions are formed on a backside surface of a crystalline semiconductor substrate. A patterned electrically insulating layer stack comprising a combination of at least a doped layer and an undoped capping layer is formed on the patterned doped emitter and base regions. A contact metallization pattern is formed comprising emitter metallization electrodes contacting the emitter regions and non-nested base metallization electrodes contacting the base regions wherein the non-nested base metallization electrodes are allowed to go beyond the base regions to overlap at least a portion of said patterned insulator without causing electrical shunts in the solar cell.
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公开(公告)号:AU2013237911A1
公开(公告)日:2014-11-13
申请号:AU2013237911
申请日:2013-03-28
Applicant: SOLEXEL INC
Inventor: SEUTTER SEAN M , MOSLEHI MEHRDAD M , DESPHANDE ANAND , RANA VIRENDRA V , KAPUR PAWAN , KRAMER KARL-JOSEF , CALCATERRA ANTHONY , DUTTON DAVID , YONEHARA TAKAO
IPC: H01L31/042 , H01L31/18
Abstract: Methods and structures for photovoltaic back contact solar cells having multi-level metallization with at least one aluminum- silicon alloy metallization layer are provided.
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公开(公告)号:AU2012358174A1
公开(公告)日:2014-08-14
申请号:AU2012358174
申请日:2012-12-23
Applicant: SOLEXEL INC
Inventor: KRAMER KARL-JOSEF , ASHJAEE JAY , MOSLEHI MEHRDAD M , CALCATERRA ANTHONY , DUTTON DAVID , KAPUR PAWAN , SEUTTER SEAN , FATEMI HOMI
IPC: H01L21/205 , H01L31/04
Abstract: Processing equipment for the metallization of a plurality of workpieces are provided. The equipment comprising a controlled atmospheric region isolated from external oxidizing ambient with at least one deposition zone for the application of a metal layer on a workpiece. A transport system moves the workpiece positioned in a batch carrier plate through the controlled atmospheric region.
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