Abstract:
The current invention provides a method and apparatus that minimizes the destructive effects of non-reflected energy during lithography. More specifically, a cooling system is located within the mask. In one example, a cooling module is integrated into the EUV mask. The cooling module may be thermoelectric. The EUV mask comprises a substrate structure as a base for a reticle, a cooling layer, which is formed on the substrate structure and a planarizing layer deposited on the cooling layer. In another example, a cooling channel is formed within the mask.
Abstract:
There is provided a collector for illumination systems for light having a wavelength null193 nm comprising. The collector includes (a) a first mirror shell adjacent to, and positioned inside of, a second mirror shell around a common axis of rotation, in which the first and second mirror shells are rotationally symmetric, and (b) a component in a region between the first and second mirror shells. The collector is for receiving the light from a light source via an object-side aperture and for illuminating an area in an image-side plane, and the region is not used by the light.
Abstract:
A reflector (15) for cooling or trapping atoms or molecules, the reflector (15) having a reflecting surface (17) forming a perimeter around and facing a central axis (33), the reflecting surface (17) extending along the axis (33), and converging from a first end of the reflector (15) towards a second end of the reflector (15), such that the reflecting surface (17) is arranged to reflect input laser light to form a cooling region (21), wherein an aperture (23) for providing a beam (27) of cooled atoms or molecules from the cooling region (21) is formed in the reflecting surface (17), the aperture (23) perpendicular to the central axis (33), such that the reflector (15) forms a truncated pyramid, and wherein the reflecting surface (17) is formed by three or more planar mirrors (39a-d) arranged around and at an angle to the central axis (33).
Abstract:
A delivery system for use within a lithographic system. The beam delivery system comprises optical elements arranged to receive a radiation beam from a radiation source and to reflect portions of radiation along one or more directions to form a one or more branch radiation beams for provision to one or more tools.
Abstract:
A device for UV curing a coating or printed ink on an workpiece such as an optical fiber comprises dual elliptical reflectors arranged to have a co-located focus. The workpiece is centered at the co-located focus such that the dual elliptical reflectors are disposed on opposing sides of the workpiece. Two separate light sources are positioned at a second focus of each elliptical reflector, wherein light irradiated from the light sources is substantially concentrated onto the surface of the workpiece at the co-located focus.
Abstract:
A mirror includes a mirror base provided with a flow channel through which a heat medium passes for cooling the mirror. The flow channel includes a buffer tank, portion for adjusting a flow rate of the heat medium in the flow channel. A reflective film is provided on the mirror base.
Abstract:
A collector optic assembly (40) for an EUV radiation source (10). The collector optic assembly (40) includes an elleptical meniscus (42) having a reflective Si/Mo coating (44) for collecting and reflecting EUV radiation (32) generated by the source (10). The meniscus (42) is machined from a single piece of silicon. The collector optic assembly (40) further includes a heat exchanger (48) that includes cooling channels (62) through which flows a liquid coolant. The heat exchanger (48) is fabricated from a plurality of machined silicon sections fused together by a glass frit bonding process. The meniscus (42) is fused to a front side of the heat exchanger (48) by a glass frit bonding process. A liquid coolant inlet manifold (70) and a liquid coolant outlet manifold (86) are also each machined from a single silicon block and are mounted to a back side of the heat exchanger (48).
Abstract:
A reflection mirror apparatus, used in a reflection optical system of an exposure apparatus which performs exposure processing by guiding exposure light by reflection, has a mirror having a reflection surface to reflect the exposure light, and radiation plates for radiation-cooling provided in positions away from an outer surface of the mirror. The radiation plates are provided so as to ensure a passage area for the exposure light incident on and reflected from the reflection surface of the mirror. Further, the respective radiation plates are temperature-controlled by cooling liquid flowing through cooling pipes. Thus the temperature rise of the mirror used in the reflection optical system of the exposure apparatus can be suppressed, and the accuracy of surface form of the mirror reflection surface can be maintained.
Abstract:
Ein reflektives optisches Element weist ein Substrat (12), eine Überbeschichtung (16) aus zumindest einer galvanisch oder chemisch abgeschiedenen Schicht auf einer ersten Oberfläche (36) des Substrates (12) und zumindest einen Hohlraum (14) zur Aufnahme eines Fluids auf. Der zumindest eine Hohlraum (14) ist der ersten Oberfläche (36) benachbart angeordnet, wobei die Überbeschichtung (16) sich auch über den zumindest einen Hohlraum (14) hinweg erstreckt. Der zumindest eine Hohlraum (14) ist frei von Material der Überbeschichtung (16). Zumindest eine reflektive Schicht (18) ist auf der dem Substrat (12) abgewandten Oberfläche (46) der Überbeschichtung (16) angeordnet, wobei die zumindest eine reflektive Schicht (18) eine optisch wirksame Oberfläche (20) aufweist. Ein Verfahren zum Herstellen und eine Verwendung des reflektiven optischen Elements werden ebenfalls beschrieben.
Abstract:
An optical arrangement (80) for an EUV projection exposure apparatus comprises an optical component (82), which has a substrate (84) and a surface (86) on a side of the substrate (84) which surface is optically operative in the EUV spectral range, and a cooling device (90) for the optical component (82), said cooling device having a cooling medium (94). The substrate (84) comprises a material having at a temperature Ts -1K-1 and a coefficient of thermal expansion of -6 K-1, and the cooling medium (94) has a temperature of s.