公开(公告)号：EP2119747A1

公开(公告)日：2009-11-18

申请号：EP09006049.2

申请日：2009-05-02

Applicant: Bayer MaterialScience AG

Inventor： Bahnmüller, Stefan, Dr. ,  Eiden, Stefan, Dr. ,  Meier, Stephan Michael, Dr. ,  Storch, Dirk ,  Dunkel, Bernard

IPC: C09D11/00 ,  H05K3/12

CPC classification number: H05K1/097 ,  C09D11/52 ,  H05K3/12 ,  H05K2201/0266 ,  H05K2203/1131 ,  Y10T428/24909

Abstract: Es wird eine druckbare Zusammensetzung zur Erzeugung elektrisch leitfähiger Beschichtungen auf Basis von nanoskaligen Silberpartikeln und mindestens einem polymeren Dispergierhilfsmittel in einer wässrigen Formulierung beschrieben.

Abstract translation: 可印刷组合物包括：（A）5-40重量份的银金属颗粒与在至多150纳米（优选40-80纳米）的有效直径; （B）50-99.5重量份的水和任选的至多30重量份的溶剂; （C）0.01-15重量份的至少一种聚合物分散剂的; （D）0.5-5（优选1-4）（重量）的增稠剂的零件; （E）0-5（优选1-4）（重量）的添加剂的部分; （F）0-5（优选为1-4）按重量计导电，任选的水溶性聚合物的部分; 及（g）30-70重量份金属颗粒。 可印刷组合物包含：（a）5至40重量份的银金属颗粒与在至多150纳米（优选40-80 nm）的确定性开采与激光相关光谱法，其中银颗粒具有双峰粒度分布的有效直径; （B）50-99.5重量份的水和任选的至多30重量份的溶剂; （C）0.01-15重量份的至少一种聚合物分散剂的; （D）0.5-5（优选1-4）（重量）的增稠剂的零件; （E）0-5（优选1-4）（重量）的添加剂的部分; （F）0-5（优选1-4）重量份导电，任选的水溶性聚合物和（g）30-70重量份金属颗粒，所有这一切都被涂覆有银（优选）或铜粒子，具有 至多10微米（优选为500纳米至10微米），的有效直径，其中所述组合物表现出至少1帕·秒的粘度 独立权利要求中包括了：（1）一种制造导体路径包括（i）打印上述可印刷组合物上的基材与屏幕打印 - ，柔性版印刷 - ，凹版打印 - 或胶版印刷-技术的帮助下表面的方法，和 （ⅱ）热处理在至多140 [度]的C用于分离水和任选的溶剂的温度优选; 和（2）底物，优选为透明的塑料基板，其包括由上述组合物得到的导电涂层。

公开(公告)号：EP1874101A1

公开(公告)日：2008-01-02

申请号：EP06745453.8

申请日：2006-04-19

Applicant: DENKI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： OKAJIMA, Yoshihiko, c/o Denki Kagaku Kogyo K.K. ,  YASHIMA, Katsunori, c/o Denki Kagaku Kogyo K.K. ,  TAKANO, Keiji, c/o Denki Kagaku Kogyo K.K. ,  OKADA, Takuya, c/o Denki Kagaku Kogyo K.K.

IPC: H05K1/05

CPC classification number: H05K1/0203 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/13091 ,  H05K1/0233 ,  H05K1/028 ,  H05K1/056 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/281 ,  H05K3/386 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/055 ,  H05K2201/056 ,  H05K2201/086 ,  H05K2201/09318 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2203/0191 ,  H05K2203/063 ,  H05K2203/302 ,  H01L2924/00014 ,  H01L2924/00

Abstract: To provide a thin metal base circuit board which can be not only installed on a flat portion but also closely attached to a side or bottom surface of a case or to a stepped or curved portion and which is excellent in heat dissipation performance, electrical insulating performance and flexibility; a process for its production; and a hybrid integrated circuit, an LED module and a bright, ultra-long-life LED light source employing it.
A metal base circuit board having insulating layers and conductive circuits or metal foils alternately laminated, characterized in that the thickness of each conductive circuit or metal foil is from 5 µm to 450 µm, each insulating layer is made of a cured product of a resin composition comprising an inorganic filler and a thermosetting resin, and the thickness of each insulating layer is from 9 µm to 300 µm; and a hybrid circuit board employing it. The metal base circuit board wherein a coverlay is provided, and a layer having a magnetic loss or a layer having a dielectric loss is laminated on the surface of the coverlay. A LED light source unit having at least one light-emitting diode (LED) mounted on the conductive circuit.

公开(公告)号：EP1164823A3

公开(公告)日：2003-09-10

申请号：EP01113580.3

申请日：2001-06-13

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Andoh, Daizo ,  Echigo, Fumio ,  Nakamura, Tadashi ,  Nakatani, Yasuhiro ,  Ueda, Yoji ,  Nishiyama, Tousaku ,  Ochi, Shozo

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4069 ,  H05K1/0366 ,  H05K1/0373 ,  H05K3/4614 ,  H05K3/462 ,  H05K3/4652 ,  H05K2201/0266 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0191 ,  H05K2203/1461 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: The present invention provides a printed circuit board, which includes a dielectric substrate (201) having via holes formed in the thickness direction, and a conductor (205) including a conductive filler is filled in the via holes. The dielectric substrate (201) has patterned wiring layers (204, 206, 208) on both surfaces, and the wiring layers (204, 206, 208) are connected electrically with each other by the conductor (205). The dielectric substrate (201) is made of a glass cloth or a glass nonwoven fabric impregnated with a thermosetting epoxy resin mixed with fine particles, and the conductive filler in the conductor (205) has an average particle diameter larger than that of the fine particles. Accordingly, the printed circuit board has an improved moisture resistance as a whole and also excellent connection reliability and repair resistance. In addition, the dielectric substrate (201) of the printed circuit board has an improved mechanical strength such as flexural rigidity. The present invention also provides a method of manufacturing such a printed circuit board.

公开(公告)号：EP0651600B1

公开(公告)日：1999-08-11

申请号：EP93203059.6

申请日：1993-11-02

Applicant: Koninklijke Philips Electronics N.V.

Inventor： Van Gerven, Johannes A.H, c/o Int. Octrooibureau ,  De Langen, Michael T.W, c/o Int. Octrooibureau

IPC: H05K3/34 ,  B23K35/34

CPC classification number: H05K3/3484 ,  B23K35/025 ,  H05K2201/0266 ,  H05K2201/10689 ,  H05K2203/043 ,  H05K2203/0545

公开(公告)号：US20180084641A1

公开(公告)日：2018-03-22

申请号：US15704222

申请日：2017-09-14

Applicant: IBIDEN CO., LTD.

Inventor： Hiroyasu NOTO ,  Yoshinori TAKENAKA

IPC: H05K1/03 ,  H01F27/245 ,  H05K3/46 ,  H01F27/28

CPC classification number: H05K1/0306 ,  H01F27/245 ,  H01F27/2804 ,  H01F2027/2809 ,  H01L2924/0002 ,  H05K1/0271 ,  H05K1/0373 ,  H05K3/46 ,  H05K3/4676 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0761 ,  H05K2201/0769

Abstract: A printed wiring board includes a first conductor layer including a first conductor circuit and a second conductor circuit formed adjacent to the first circuit, a resin insulating layer formed on the first conductor layer such that the insulating layer is filling space between the first and second conductor circuits, and a second conductor layer formed on the insulating layer such that distance (T) between the first and second conductor layers is in the range of 4.5 μm to 10.5 μm. The resin insulating layer includes inorganic particles having average particle diameter (D1) such that ratio (D1/S) of the diameter (D1) to distance (S) of the space is less than 0.25 and that ratio (D1/T) of the diameter (D1) to the distance (T) is less than 0.25, where the distance (S) of the space between the first and second conductor circuits is in the range of 4.5 μm to 10.5.

公开(公告)号：US20170145213A1

公开(公告)日：2017-05-25

申请号：US15322929

申请日：2015-07-14

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Kentaro NOMIZU ,  Mitsuru OHTA ,  Masanobu SOGAME ,  Yoshinori MABUCHI

IPC: C08L79/04 ,  H05K1/03 ,  C08J5/24

CPC classification number: C08L79/04 ,  B32B15/08 ,  B32B27/20 ,  C08J5/24 ,  C08J2379/04 ,  C08J2463/04 ,  C08J2479/08 ,  C08K3/34 ,  C08K5/3415 ,  C08K9/02 ,  C08L101/00 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/035 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/06

Abstract: A resin composition including an inorganic filler (B) having an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 μm; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

公开(公告)号：US09554464B2

公开(公告)日：2017-01-24

申请号：US14398616

申请日：2013-08-01

Applicant: Waseda University ,  Fuji Electric Co., Ltd.

Inventor： Yoshimichi Ohki ,  Yuichi Hirose ,  Genta Wada ,  Toshikatsu Tanaka ,  Kenji Okamoto

IPC: H05K1/05 ,  H05K1/09 ,  H05K1/02 ,  H05K1/03

CPC classification number: H05K1/056 ,  C09D7/67 ,  C09D7/68 ,  C09D7/69 ,  C09D163/00 ,  H05K1/0201 ,  H05K1/0204 ,  H05K1/0256 ,  H05K1/0373 ,  H05K1/09 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/0769 ,  H05K2201/10106 ,  Y10T428/24893

Abstract: A highly thermally conductive printed circuit board prevents electrochemical migration by inhibiting elution of copper ions. The printed circuit board is a metal-base printed circuit board including a metal base plate having an insulating resin layer and a copper foil layer stacked thereon in this order. In the printed circuit board, the insulating resin layer contains a first inorganic filler made of inorganic particles having particle diameters of 0.1 nm to 600 nm with an average particle diameter (D50) of 1 nm to 300 nm, and a second inorganic filler made of inorganic particles having particle diameters of 100 nm to 100 μm with an average particle diameter (D50) of 500 nm to 20 μm, and the first inorganic filler and the second inorganic filler are uniformly dispersed in the insulating resin layer.

Abstract translation: 高导热性印刷电路板通过抑制铜离子的洗脱来防止电化学迁移。 印刷电路板是依次包括具有绝缘树脂层和铜箔层的金属基板的金属基印刷电路板。 在印刷电路板中，绝缘树脂层包含由平均粒径（D50）为1nm〜300nm的粒径为0.1nm〜600nm的无机粒子构成的第一无机填充材料和由 平均粒径（D50）为500nm〜20μm的粒径为100nm〜100μm的无机粒子，第一无机填充剂和第二无机填料均匀地分散在绝缘树脂层中。

公开(公告)号：US20160088729A1

公开(公告)日：2016-03-24

申请号：US14889385

申请日：2014-05-27

Applicant: EPCOS AG

Inventor： Hisashi KOBUKE ,  Yousuke FUTAMATA ,  Emi NINOMIYA

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0306 ,  C03C12/00 ,  H05K1/0298 ,  H05K1/09 ,  H05K1/115 ,  H05K3/4617 ,  H05K3/4629 ,  H05K2201/0209 ,  H05K2201/0266

Abstract: A multilayer wiring substrate includes a number of insulating layers, each insulating layer including a glass ceramic. A number of internal conductor layers are formed between the insulating layers. Via conductors penetrate through the insulating layers and mutually connect the internal conductor layers in different layer locations. Surface conductor layers are formed on an outer surfaces in a lamination direction of the insulating layers. The insulating layers include outside insulating layers and inside insulating layers. A first aspect ratio representing an oblateness and sphericity of an external filler contained in the outside insulating layers is larger than a second aspect ratio representing an oblateness and sphericity of an internal filler contained in the inside insulating layers. A thermal expansion coefficient of the outside insulating layers is smaller than a thermal expansion coefficient of the inside insulating layers.

Abstract translation: 多层布线基板包括多个绝缘层，每个绝缘层包括玻璃陶瓷。 在绝缘层之间形成多个内部导体层。 通孔导体穿过绝缘层并将内部导体层互相连接在不同的层位置。 在绝缘层的层叠方向的外表面上形成表面导体层。 绝缘层包括外部绝缘层和内部绝缘层。 表示包含在外侧绝缘层中的外部填料的扁平度和球形度的第一长宽比大于表示内侧绝缘层中包含的内部填料的扁平度和球形度的第二纵横比。 外部绝缘层的热膨胀系数小于内部绝缘层的热膨胀系数。

公开(公告)号：US20160053072A1

公开(公告)日：2016-02-25

申请号：US14753055

申请日：2015-06-29

Applicant: Ticona LLC

Inventor： Paul C. Yung ,  Michael Schaefer

IPC: C08K3/10 ,  C08K3/32 ,  H05K1/03 ,  C08K3/30 ,  C08K7/10 ,  C08K3/34 ,  C08K3/40

CPC classification number: C08K3/10 ,  C08G63/605 ,  C08K3/22 ,  C08K3/30 ,  C08K3/32 ,  C08K3/34 ,  C08K3/40 ,  C08K7/10 ,  C08K2003/2248 ,  C08K2003/2251 ,  C08K2003/3045 ,  C08K2003/325 ,  C08K2201/005 ,  C08L67/03 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/165 ,  H05K3/105 ,  H05K3/106 ,  H05K3/185 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0236 ,  H05K2201/0266 ,  H05K2201/10098 ,  H05K2203/107 ,  C08L67/00

Abstract: A polymer composition that comprises an aromatic polyester, a laser activatable additive, and a mineral filler is provided. The mineral filler has a median size of about 35 micrometers or less and the laser activatable additive has a mean size of about 1000 nanometers or less.

Abstract translation: 提供了包含芳族聚酯，激光可激活添加剂和矿物填料的聚合物组合物。 矿物填料的中值粒径约为35微米或更小，激光活化添加剂的平均粒径约为1000纳米或更小。

公开(公告)号：US20150235122A1

公开(公告)日：2015-08-20

申请号：US14564111

申请日：2014-12-09

Applicant: David Finn ,  Klaus Ummenhofer

Inventor： David Finn ,  Klaus Ummenhofer

IPC: G06K19/077 ,  G06K7/10

CPC classification number: G06K19/07794 ,  G06K7/10009 ,  G06K19/07754 ,  G06K19/07769 ,  H01F27/365 ,  H01F38/14 ,  H01F41/16 ,  H01Q1/2225 ,  H01Q1/2283 ,  H01Q7/00 ,  H05K1/0225 ,  H05K1/0233 ,  H05K1/167 ,  H05K1/183 ,  H05K3/1275 ,  H05K2201/0218 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0266 ,  H05K2201/0317 ,  H05K2201/0323 ,  H05K2201/0723 ,  H05K2201/086 ,  H05K2201/09681 ,  H05K2201/0969 ,  H05K2201/09727 ,  H05K2201/10098

Abstract: Card body (CB) for a dual interface smart card (SC) comprising a metal foil (MF) or metallized layer (ML). An opening in the metal layer may be sized so that a coupler coil (CC) of a booster antenna (BA) is exposed. Improving coupling between a contactless reader and a transponder comprising providing a patch booster antenna (PBA) on a substrate disposed on the reader. Various booster antenna designs are disclosed.

Abstract translation: 包括金属箔（MF）或金属化层（ML）的双接口智能卡（SC）的卡体（CB）。 金属层中的开口的尺寸可以使得增强天线（BA）的耦合线圈（CC）暴露。 改善非接触读取器和应答器之间的耦合，包括在布置在读取器上的衬底上提供贴片增强天线（PBA）。 公开了各种增强天线设计。