公开(公告)号：EP2622972A1

公开(公告)日：2013-08-07

申请号：EP13153170.9

申请日：2013-01-30

Applicant: HAUNI Maschinenbau AG

Inventor： Roßfeldt, Niko

IPC: A24C5/28

CPC classification number: H05K1/0306 ,  A24C5/28 ,  H01L35/30 ,  H05K1/11 ,  H05K3/0067 ,  H05K2201/06 ,  H05K2201/10219 ,  Y10T29/49155

Abstract: Die Erfindung betrifft eine Vorrichtung (10) zum Führen und Halten eines in Transportrichtung T kontinuierlich geförderten Strangs (11) der Tabak verarbeitenden Industrie während eines Schneidvorgangs strangförmiger Artikel (12) von dem Strang (11), umfassend ein mittels eines Antriebs (13) antreibbares Tubenrad (14), das aus einem Antriebskörper (15) und einem Führungskörper (16) gebildet ist, die über mindestens ein Koppelelement (17), dem mindestens eine Tube (22) als Halte- und Führungselement zugeordnet ist, miteinander in Wirkverbindung stehen, wobei der Antriebskörper (15) mit einer Antriebswelle (18) des Antriebs (13) verbunden ist, derart, dass der Antriebskörper (15) um die Rotationsachse A als ortsfeste und verstellfreie Antriebsachse rotierend angetrieben ist, und der Führungskörper (16) an einem Tragarm (20) auf einem Achselement (21) gelagert ist, derart, dass der Führungskörper (16) um eine Rotationsachse B, die versetzt zur Rotationsachse A angeordnet ist, rotierend ausgebildet ist, wobei ein Tubenrad (14) zur Anpassung der Vorrichtung (10) an veränderte, das Format bestimmende Artikellängen gegen ein anderes Tubenrad (14) austauschbar ist, die sich dadurch auszeichnet, dass das oder jedes Koppelelement (17) als Formatteil ausgebildet ist, derart, dass die Länge des oder jedes Koppelelementes (17) an das jeweils zu schneidende Format angepasst ist, so dass die austauschbaren Tubenräder (14) unterschiedlicher Geometrien bei identischer Länge der Tuben (22) einen konstanten Abstand H zwischen der Rotationsachse A und dem zu schneidenden Strang (11) aufweisen. Des Weiteren betrifft die Erfindung einen Tubenradsatz mit mindestens zwei solcher Tubenräder.

Abstract translation: 的装置（10）具有与一个驱动器（13）的驱动轴（18）连接的驱动体（15）做了检查驱动体绕旋转轴（A）。 的引导体（16），在上轴元件（21）的支撑臂（20）被支撑测试所做的引导体围绕另一旋转轴（B）旋转。 的联接元件（17）被形成为一个格式部分搜索没有耦合元件的长度被调整雅丁到一个格式被切割，所以没有管轮（14）具有不同的几何形状呈现出前者轴和连续之间的恒定距离 交付海滩（11）进行切割。 因此独立claimsoft包括用于馈送管轮组和期间在烟草加工业的切削用保持连续递送海滩状物品的海滩。

公开(公告)号：EP1825525A1

公开(公告)日：2007-08-29

申请号：EP05780713.3

申请日：2005-07-21

Applicant: LG Innotek Co., Ltd.

Inventor： PARK, Jun Seok, 906ho, 105dong

IPC: H01L33/00

CPC classification number: H01L33/641 ,  F21K9/00 ,  H01L27/156 ,  H01L33/40 ,  H01L33/483 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L33/642 ,  H01L33/644 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2933/0025 ,  H01L2933/0058 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K3/243 ,  H05K2201/06 ,  Y10S257/918 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting device package, comprising: a base layer (350) having an flat top surface; a light emitting device (360) located directly on the flat top surface of the base layer; an electrical circuit layer (330) located above the flat top surface of the base layer and including at least one end portion placed adjacent to the light emitting device; an electrode layer (322) disposed above a tip portion of each of said end portion of the electrical circuit layer; and a lens (380) extending at least over the light emitting device and the end portion of the electrical circuit layer and covering the electrode layer.

Abstract translation: 一种发光器件封装，包括：具有平坦顶表面的基底层（350） 直接位于基底层的平坦顶面上的发光器件（360）; 位于所述基底层的平坦顶表面上方并且包括邻近所述发光器件放置的至少一个端部的电路层（330） 电极层（322），其设置在所述电路层的所述端部的前端部的上方; 以及至少在发光器件和电路层的端部延伸并覆盖电极层的透镜（380）。

公开(公告)号：EP3170868A4

公开(公告)日：2018-04-04

申请号：EP15821543

申请日：2015-07-14

Applicant: MITSUBISHI GAS CHEMICAL CO

Inventor： NOMIZU KENTARO ,  OHTA MITSURU ,  SOGAME MASANOBU ,  MABUCHI YOSHINORI

IPC: H05K1/03 ,  B32B15/08 ,  B32B27/20 ,  C08J5/24 ,  C08K3/34 ,  C08K5/3415 ,  C08K9/02 ,  C08L101/00

CPC classification number: C08L79/04 ,  B32B15/08 ,  B32B27/20 ,  C08J5/24 ,  C08J2379/04 ,  C08J2463/04 ,  C08J2479/08 ,  C08K3/34 ,  C08K5/3415 ,  C08K9/02 ,  C08L101/00 ,  C08L2203/20 ,  C08L2205/025 ,  C08L2205/035 ,  H05K1/0373 ,  H05K2201/0154 ,  H05K2201/0209 ,  H05K2201/0257 ,  H05K2201/0266 ,  H05K2201/06

Abstract: A resin composition comprising: an inorganic filler (B) comprising an aluminosilicate (A) having a silicon atom content of from 9 to 23% by mass, an aluminum atom content of from 21 to 43% by mass, and an average particle diameter (D50) of from 0.5 to 10 µm; and any one or more thermosetting compounds selected from the group consisting of an epoxy resin (C), a cyanate compound (D), a maleimide compound (E), a phenolic resin (F), an acrylic resin (G), a polyamide resin (H), a polyamideimide resin (I), and a thermosetting polyimide resin (J), wherein a content of the inorganic filler (B) is from 250 to 800 parts by mass based on 100 parts by mass of resin solid content.

公开(公告)号：EP3139407A1

公开(公告)日：2017-03-08

申请号：EP16162014.1

申请日：2016-03-23

Applicant: STMicroelectronics S.r.l.

Inventor： RIZZA, Roberto ,  MINOTTI, Agatino ,  MONTALTO, Gaetano ,  SALAMONE, Francesco

IPC: H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L25/07

CPC classification number: H05K1/0203 ,  H01L23/053 ,  H01L23/08 ,  H01L23/24 ,  H01L23/296 ,  H01L23/3114 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/3735 ,  H01L23/3737 ,  H01L23/492 ,  H01L23/49811 ,  H01L23/49833 ,  H01L23/49838 ,  H01L23/5385 ,  H01L24/27 ,  H01L24/33 ,  H01L24/83 ,  H01L25/072 ,  H01L25/18 ,  H01L25/50 ,  H01L2224/29139 ,  H01L2224/32227 ,  H01L2224/33181 ,  H01L2224/371 ,  H01L2224/37147 ,  H01L2224/40225 ,  H01L2224/83192 ,  H01L2224/8384 ,  H01L2924/1203 ,  H01L2924/13055 ,  H01L2924/15153 ,  H01L2924/19107 ,  H05K1/115 ,  H05K3/10 ,  H05K7/1427 ,  H05K13/0023 ,  H05K2201/06

Abstract: An electronic power module (20) comprising a case (22) that houses a stack (88), which includes: a first substrate (26) of a DBC type or the like; a die (27), integrating an electronic component having one or more electrical-conduction terminals, mechanically and thermally coupled to the first substrate; and a second substrate (29), of a DBC type or the like, which extends over the first substrate and over the die and presents a conductive path (32) facing the die. The die is mechanically and thermally coupled to the first substrate by a first coupling region (30) of a sintered thermoconductive paste, and the one or more conduction terminals of the electronic component are mechanically, electrically, and thermally coupled to the conductive path (32) of the second substrate (29) by a second coupling region (34) of sintered thermoconductive paste.

Abstract translation: 一种电子功率模块（20），包括一个壳体（22）做了房屋的堆叠（88），其中包括：一个DBC型等的第一基板（26）; a是（27），INTEGRA廷到具有一个或多个电传导端子，机械和热耦合到所述第一基板上的电子部件; 和第二基片（29），一个类型DBC或类似物，其延伸在所述第一基底和在所述管芯和具有面向所述模具的导电路径（32）的。 模具是机械和热耦合到由烧结导热膏的第一耦合区（30），所述第一基底和所述电子部件的所述一个或多个导电端子是机械，电和热耦合到所述导电路径（32 ）的第二基片（29）由烧结导热膏的第二联接区域（34）的。

公开(公告)号：EP2792483B1

公开(公告)日：2016-10-19

申请号：EP12865468.8

申请日：2012-01-13

Applicant: JX Nippon Mining & Metals Corporation

Inventor： TANAKA, Koichiro ,  KAMMURI, Kazuki

IPC: B32B15/08 ,  H05K1/02

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f 3 x t 3 )/(f 2 x t 2 ) => 1 wherein t 2 (mm) is a thickness of the copper foil, f 2 (MPa) is a stress of the copper foil under tensile strain of 4%, t 3 (mm) is a thickness of the resin layer, f 3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1

公开(公告)号：EP3050411A1

公开(公告)日：2016-08-03

申请号：EP13893789.1

申请日：2013-09-23

Applicant: Tellabs Operations, Inc.

Inventor： LEI, Zhen ,  BA, Qinzhen ,  DUAN, Zongxian ,  YU, Huihui

IPC: H05K7/20

CPC classification number: H05K7/20409 ,  B23P15/26 ,  H01L23/3677 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/06 ,  H01L2924/00

Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.

Abstract translation: 一种用于散热器组件的装置和系统，以及用于形成散热器组件的步骤。 散热器组件包括散热器，散热器具有基部和从基座延伸的翅片，以及设置在散热片之间的散热片上的弹簧夹。 弹簧夹包括相对于散热器的底部形成第一角度并且包括相对于散热器的底部形成第二角度的第二突出部的第一突出部。 第一和第二突片连接到电路板。 因此，提供了与传统布置相比节省空间并且允许电路板上的更高密度的笼子的保持架的散热器附件。

公开(公告)号：EP3340749A1

公开(公告)日：2018-06-27

申请号：EP17208637.3

申请日：2017-12-19

Applicant: Deere & Company

Inventor： ROAN, Thomas J. ,  SINGH, Brij N.

IPC: H05K1/02

CPC classification number: H05K1/0201 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/06 ,  H05K2201/064 ,  H05K2201/09036

Abstract: An electrical assembly comprises a dielectric substrate (14) and a metallic conductive trace (12) overlying the substrate. The metallic conductive trace has a hollow cross-section (18) that forms a duct (12). An annular member (20) protrudes from the metallic conductive trace. The annular member has an opening (24) in communication with the duct, the opening for receiving pressurized air or gas.

公开(公告)号：EP3231268A1

公开(公告)日：2017-10-18

申请号：EP15784522.3

申请日：2015-10-07

Applicant: Raytheon Company

Inventor： PAINE, Waid ,  WILSON, James S. ,  KYHL, Cary C. ,  ISOM, Robert S.

IPC: H05K7/20 ,  H01Q21/00

CPC classification number: H05K1/0204 ,  H01Q21/0025 ,  H01R12/72 ,  H05K1/0237 ,  H05K1/111 ,  H05K1/183 ,  H05K7/20509 ,  H05K2201/06 ,  H05K2201/09036 ,  H05K2201/10098

Abstract: A radio frequency (RF) module having a plurality of channels includes a heat sink having at least one tapered edge; a substrate disposed over a surface of the heat sink such that the tapered edge of the heat sink extends past a boundary of the substrate. RF, logic and power circuitry is disposed on the substrate and one or more RF signal ports are formed on an edge of the substrate to allow the RF module to be used in an array antenna having a brick architecture. The tapered edge heat sink provides both a ground plane for RF signal components and a thermal path for heat generating circuits disposed in the substrate.

Abstract translation: 具有多个通道的射频（RF）模块包括具有至少一个锥形边缘的散热器; 设置在散热器的表面上方的衬底，使得散热器的锥形边缘延伸超过衬底的边界。 RF，逻辑和电源电路设置在衬底上，并且一个或多个RF信号端口形成在衬底的边缘上，以允许RF模块用于具有砖结构的阵列天线。 锥形边缘散热器提供用于RF信号分量的接地平面和用于设置在衬底中的发热电路的热路径。

公开(公告)号：EP3050411A4

公开(公告)日：2017-08-23

申请号：EP13893789

申请日：2013-09-23

Applicant: CORIANT OPERATIONS INC

Inventor： LEI ZHEN ,  BA QINZHEN ,  DUAN ZONGXIAN ,  YU HUIHUI

IPC: H05K7/20 ,  H01L23/40

CPC classification number: H05K7/20409 ,  B23P15/26 ,  H01L23/3677 ,  H01L23/4093 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/06 ,  H01L2924/00

Abstract: An apparatus and system for a heat sink assembly, and a procedure for forming a heat sink assembly. The heat sink assembly includes a heat sink having a base and fins extending from the base, and a spring clip disposed on the heat sink between the fins. The spring clip includes a first tab that forms a first angle with respect to the base of the heat sink and including a second tab that forms a second angle with respect to the base of the heat sink. The first and second tabs are attached to the circuit board. By virtue thereof, a heat sink attachment to cage is provided that is space-efficient and permits a higher density of cages on a circuit board than do conventional arrangements.

Abstract translation: 一种用于散热器组件的装置和系统以及一种用于形成散热器组件的过程。 散热器组件包括具有基座和从基座延伸的散热片的散热器以及设置在散热片之间的弹簧夹。 弹簧夹包括相对于散热器的基部形成第一角度并且包括相对于散热器的基部形成第二角度的第二凸片的第一凸片。 第一和第二接片连接到电路板。 借助于此，提供了一种散热器附件与保持架相比空间效率高并且与常规配置相比能够在电路板上实现更高密度的保持架。

公开(公告)号：EP3052909A1

公开(公告)日：2016-08-10

申请号：EP14796209.6

申请日：2014-09-29

Applicant: Société Française de Détecteurs Infrarouges - SOFRADIR

Inventor： ROBERT, David ,  ROYER, Yves

IPC: G01J5/06 ,  H05K1/18

CPC classification number: H05K1/0201 ,  G01J5/06 ,  G01J5/061 ,  G01J5/10 ,  H01R12/77 ,  H05K1/0209 ,  H05K1/0218 ,  H05K1/028 ,  H05K1/0296 ,  H05K1/11 ,  H05K1/147 ,  H05K2201/06 ,  H05K2201/066 ,  H05K2201/0715

Abstract: The invention relates to a flexible printed circuit with low emissivity which includes first and second ends (48a, 48b) and a flexible central portion (50) extending between the first and second ends and comprising electrically conductive tracks (52) embedded in a polymer material in order electrically to connect the first and second ends. The flexible central portion is at least partially covered with a heat shield (54) made of a material having lower emissivity than that of the polymer material and the electric conductors.