Abstract:
Provided is a radiant heat circuit board for mounting a plurality of heat generating devices. The radiant heat circuit board includes a metal plate including an integrated metal projection to which the plurality of heat generating devices are attached, an insulation layer exposing the integrated metal projection, the insulation layer being disposed on the metal plate, and a plurality of electrode pads disposed on the insulation layer, the plurality of electrode pads applying a voltage into each of the heat generating devices. Thus, a radiant projection may be disposed between the heat generating devices to improve heat radiation.
Abstract:
The present invention relates to a metal substrate for an electronic component module manufactured by a plasma electrolytic oxidation, an electronic component module comprising same, and a method for manufacturing a metal substrate for an electronic component module. The metal substrate for an electronic component module according to the present invention includes a base metal, an oxide layer formed on at least one surface of the base metal through a plasma electrolytic oxidation, and which has a thickness of 1 to 200?, and a metal wiring layer formed on the oxide layer.
Abstract:
Various system embodiments comprise a substrate of high thermal conductivity, a solid state light emitting device, an electric circuit, and an electric dielectric. The device has a die and a connection point to the die with a low thermal resistance. The connection point is in contact with the substrate. The electric circuit is electrically connected to the light emitting device, and separated from the substrate by the electrical dielectric. Various system embodiments comprise at least four color sources; and a contoller configured to calculate a solution to form a target color using the color sources when the target is outside of a gamut formed by the color sources. The controller is configured to find an equivalent target color with reduced saturation.
Abstract:
A light-emitting device assembly (2) which can be used in many applications has a contact carrier, at least one light-emitting device (10), a heat sink and at least one securing member (300). The contact carrier has a light-emitting device receiving region and resilient contacts which are provided proximate to the light-emitting device receiving region. The at least one light-emitting device (10) has leads which extend therefrom to mechanically and electrically engage the resilient contacts. The heat sink is thermally coupled to the at least one light-emitting device (10). The at least one securing member (300) extends through the contact carrier and into the heat sink to releasably retain the contact carrier and the at least one light-emitting device (10) in position relative to each other and relative to the heat sink.
Abstract:
In accordance with the present invention, a thermally-efficient metal core printed circuit board comprises a metal base (66) including opposing first face and a second face, and the said faces with a plurality of dispersed dielectric (55) or insulating layer selectively fabricated overlying the metal base (66) resulting in a planar surface for the overlying circuitries, a plurality of dispersed thermal metallization layer connected directly to the metal base (66) for optimum thermal performance and a plurality of electrical circuitries connected accordingly to the profile of the metal body for the multi-layer electrical circuit connectivity. The selective dielectric (55) or insulation layer configuration allows direct thermal pad contact to the bulk metal base (66) and insulation for the electrical terminals resulting in high thermal-efficient circuit board for single, matrix, multi-chip device assembly and mother-board applications. The selective dielectric and metallization topology is also applicable to 3D heat sink structure.
Abstract:
The invention relates to an IC component (2) comprising a cooling arrangement (1) which is embodied as an electronic housing provided with a cooling body (7). According to the invention, the IC component (2) is directly arranged on the cooling body (7) in the electronic housing. The invention advantageously provides a cooling arrangement (1) for IC components (2) that enables the IC component (2) to be efficiently and directly cooled and assembled in a simple manner, without requiring additional components. It is especially suitable for applications in electronic housings in the automobile industry.
Abstract:
The present invention describes a method and apparatus for mounting a microelectronic device parallel to a substrate with an interposer and two heat sinks, one on each side of the substrate.
Abstract:
A unique housing (104 and 600) of a portable radio transceiver (100) that takes advantage of the heat sinking, electrical shielding and structural characteristics of a battery. The unique electronic circuitry housing (104 and 600) includes a battery as an integral structural element thereof. In one illustrated housing (104), a stick battery (210) is attached to the side of a transmitter printed circuit panel (213). A logic printed circuit panel (212) and a receiver printed circuit panel (214) are positioned above and below the transmitter printed circuit panel (213), respectively, and are held together by interlocking side rails (206, 207). In a second illustrated housing (600), a flat battery (602) is attached to the sides of a first U-shaped printed circuit panel (604). A second U-shaped printed circuit panel (606) is positioned between the battery and the first panel (604). Heat dissipated by the electrical components on the second panel (606) is conducted away by the flat battery (602). The electronic circuitry housing of the present invention may be advantageously utilized in a variety of applications where electronic circuitry is operated from a battery.