LED INTERCONNECT ASSEMBLY
    95.
    发明申请
    LED INTERCONNECT ASSEMBLY 审中-公开
    LED互连组件

    公开(公告)号:WO2010039178A1

    公开(公告)日:2010-04-08

    申请号:PCT/US2009/005238

    申请日:2009-09-21

    Abstract: A light-emitting device assembly (2) which can be used in many applications has a contact carrier, at least one light-emitting device (10), a heat sink and at least one securing member (300). The contact carrier has a light-emitting device receiving region and resilient contacts which are provided proximate to the light-emitting device receiving region. The at least one light-emitting device (10) has leads which extend therefrom to mechanically and electrically engage the resilient contacts. The heat sink is thermally coupled to the at least one light-emitting device (10). The at least one securing member (300) extends through the contact carrier and into the heat sink to releasably retain the contact carrier and the at least one light-emitting device (10) in position relative to each other and relative to the heat sink.

    Abstract translation: 可用于许多应用的发光器件组件(2)具有接触载体,至少一个发光器件(10),散热器和至少一个固定元件(300)。 接触载体具有靠近发光器件接收区域设置的发光器件接收区域和弹性触点。 至少一个发光装置(10)具有从其延伸的引线以机械地和电接合弹性触点。 散热器热耦合到至少一个发光装置(10)。 所述至少一个固定构件(300)延伸穿过所述接触载体并进入所述散热器以将所述接触载体和所述至少一个发光装置(10)可释放地保持在相对于彼此并且相对于所述散热器的适当位置。

    HIGH THERMAL-EFFICIENT METAL CORE PRINTED CIRCUIT BOARD WITH SELECTIVE ELECTRICAL AND THERMAL CIRCUITRY CONNECTIVITY
    96.
    发明申请
    HIGH THERMAL-EFFICIENT METAL CORE PRINTED CIRCUIT BOARD WITH SELECTIVE ELECTRICAL AND THERMAL CIRCUITRY CONNECTIVITY 审中-公开
    具有选择性电气和热电路连接性的高热能金属核心印刷电路板

    公开(公告)号:WO2008123766A3

    公开(公告)日:2008-12-18

    申请号:PCT/MY2008000028

    申请日:2008-04-04

    Applicant: TAN KIA KUANG

    Inventor: TAN KIA KUANG

    Abstract: In accordance with the present invention, a thermally-efficient metal core printed circuit board comprises a metal base (66) including opposing first face and a second face, and the said faces with a plurality of dispersed dielectric (55) or insulating layer selectively fabricated overlying the metal base (66) resulting in a planar surface for the overlying circuitries, a plurality of dispersed thermal metallization layer connected directly to the metal base (66) for optimum thermal performance and a plurality of electrical circuitries connected accordingly to the profile of the metal body for the multi-layer electrical circuit connectivity. The selective dielectric (55) or insulation layer configuration allows direct thermal pad contact to the bulk metal base (66) and insulation for the electrical terminals resulting in high thermal-efficient circuit board for single, matrix, multi-chip device assembly and mother-board applications. The selective dielectric and metallization topology is also applicable to 3D heat sink structure.

    Abstract translation: 根据本发明,一种热效率金属芯印刷电路板包括金属基底(66),其包括相对的第一面和第二面,并且所述表面具有多个分散电介质(55)或选择性地制造的绝缘层 覆盖金属基底(66),导致用于覆盖电路的平坦表面;多个分散的热金属化层,其直接连接到金属基底(66),以获得最佳的热性能;以及多个电路,其相应地与 金属体为多层电路连接。 选择性电介质(55)或绝缘层配置允许直接散热焊盘接触散装金属基座(66)并为电气端子提供绝缘,从而为单个,矩阵,多芯片器件组装和母机组装提供高热效率的电路板, 板应用程序。 选择性电介质和金属化拓扑也适用于3D散热器结构。

    IC COMPONENT COMPRISING A COOLING ARRANGEMENT
    97.
    发明申请
    IC COMPONENT COMPRISING A COOLING ARRANGEMENT 审中-公开
    具有冷却设计的IC建筑元件

    公开(公告)号:WO2007045520A2

    公开(公告)日:2007-04-26

    申请号:PCT/EP2006065694

    申请日:2006-08-25

    Abstract: The invention relates to an IC component (2) comprising a cooling arrangement (1) which is embodied as an electronic housing provided with a cooling body (7). According to the invention, the IC component (2) is directly arranged on the cooling body (7) in the electronic housing. The invention advantageously provides a cooling arrangement (1) for IC components (2) that enables the IC component (2) to be efficiently and directly cooled and assembled in a simple manner, without requiring additional components. It is especially suitable for applications in electronic housings in the automobile industry.

    Abstract translation: 具有冷却装置(1)的IC部件(2)技术领域本发明涉及一种具有冷却装置(1)的IC部件(2),该冷却装置设计成具有电子器件壳体的冷却体(7) 根据本发明,IC部件(2)直接布置在电子器件壳体中的散热片(7)上。 本发明有利地提供了一种用于在第一时间的冷却装置(1),用于IC器件(2),这允许IC装置(2)和一个简单的组件的有效和直接的冷却而不需要任何附加的部件。 它特别适用于汽车行业电子外壳的应用。

    PORTABLE RADIO TRANSCEIVER HOUSING STRUCTURALLY SUPPORTED BY AN INTEGRAL BATTERY
    100.
    发明申请
    PORTABLE RADIO TRANSCEIVER HOUSING STRUCTURALLY SUPPORTED BY AN INTEGRAL BATTERY 审中-公开
    便携式无线电收发器外壳由一体电池结构支持

    公开(公告)号:WO1987004317A1

    公开(公告)日:1987-07-16

    申请号:PCT/US1986002758

    申请日:1986-12-09

    Applicant: MOTOROLA, INC.

    Abstract: A unique housing (104 and 600) of a portable radio transceiver (100) that takes advantage of the heat sinking, electrical shielding and structural characteristics of a battery. The unique electronic circuitry housing (104 and 600) includes a battery as an integral structural element thereof. In one illustrated housing (104), a stick battery (210) is attached to the side of a transmitter printed circuit panel (213). A logic printed circuit panel (212) and a receiver printed circuit panel (214) are positioned above and below the transmitter printed circuit panel (213), respectively, and are held together by interlocking side rails (206, 207). In a second illustrated housing (600), a flat battery (602) is attached to the sides of a first U-shaped printed circuit panel (604). A second U-shaped printed circuit panel (606) is positioned between the battery and the first panel (604). Heat dissipated by the electrical components on the second panel (606) is conducted away by the flat battery (602). The electronic circuitry housing of the present invention may be advantageously utilized in a variety of applications where electronic circuitry is operated from a battery.

    Abstract translation: 便携式无线电收发器(100)的独特外壳(104和600),其利用电池的散热,电屏蔽和结构特性。 独特的电子电路壳体(104和600)包括作为其整体结构元件的电池。 在一个示出的壳体(104)中,粘贴电池(210)附接到发射器印刷电路板(213)的侧面。 逻辑印刷电路板(212)和接收器印刷电路板(214)分别位于发射机印刷电路板(213)的上方和下方,并通过互锁的侧轨(206,207)保持在一起。 在第二示出的壳体(600)中,平坦电池(602)附接到第一U形印刷电路板(604)的侧面。 第二U形印刷电路板(606)位于电池和第一面板(604)之间。 由第二面板(606)上的电气部件耗散的热量由扁平电池(602)导出。 本发明的电子电路外壳可有利地用于电池从电池操作的各种应用中。

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