公开(公告)号：EP3379906A1

公开(公告)日：2018-09-26

申请号：EP18155960.0

申请日：2018-02-09

Applicant: ZKW Group GmbH

Inventor： Edlinger, Erik ,  Dragosits, Bernd ,  Führinger, Roman

IPC: H05K3/32 ,  H05K3/36 ,  H01L23/49 ,  H05K3/40 ,  H05K3/22 ,  H01R12/57 ,  H01R4/48

CPC classification number: H05K3/366 ,  H01L24/45 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48998 ,  H05K1/117 ,  H05K3/222 ,  H05K2201/0939 ,  H05K2201/10287 ,  H05K2201/10363 ,  H01L2924/00014

Abstract: Ein elektronisches Bauteil (1) mit elektrischen Anschlussstellen (5o, 5u), bei welchem ein zumindest Bonddraht (4) von zumindest einer ersten Anschlussstelle (5o) über die Bauteiloberfläche zu zumindest einer zweiten Anschlussstelle (5u) geführt ist, wobei an der zumindest ersten und an der zumindest zweiten Anschlussstelle eine Bondverbindung des Drahtes mit einer Kontaktfläche der Anschlussstelle hergestellt ist, wobei auf dem Bauteil (1) zumindest eine Abstützung (6) für den zumindest einen Bonddraht (4) vorgesehen ist und zumindest ein Bonddraht zwischen einer ersten Anschlussstelle (5o) und einer zweiten Anschlussstelle (5u) von der Abstützung in einem vorgegeben Abstand von Oberflächenabschnitten des Bauteils gehalten ist, und ein Verfahren zur Herstellung eines solchen Bauteils, bei welchem vor dem Führen des Bonddrahtes (4) von einer ersten (5o) zu einer zweiten (5u) Anschlussstelle auf dem Bauteil (1) zumindest eine Abstützung (6) für den Bonddraht errichtet wird, welche den Bonddraht in einem vorgegeben Abstand von Oberflächenabschnitten des Bauteils hält.

公开(公告)号：EP2566307A3

公开(公告)日：2017-11-15

申请号：EP12005825.0

申请日：2012-08-10

Applicant: Eppendorf AG

Inventor： Reichmuth, Burkardt

IPC: H05K1/02 ,  B01L3/02 ,  G01F11/02 ,  H05K1/03 ,  G01N35/10

CPC classification number: H05K1/0296 ,  B01L3/0227 ,  B01L2200/087 ,  B01L2200/12 ,  G01F11/021 ,  G01N35/1002 ,  H05K1/0393 ,  H05K2201/053 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/0939 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/09972 ,  H05K2201/10151

Abstract: The invention relates to a laboratory sample instrument (200) with a cable holding space (185) in which a printed circuit board cable device (100) is arranged, more particularly to a dispenser or a pipette. The printed circuit board cable device has at least one printed circuit board (102), which has a first and a second side of the board, and, arranged in succession, at least one first printed circuit board section (A), at least one second printed circuit board section (B) and at least one third printed circuit board section (C), with the printed circuit board having a number of conductor tracks (121,122) which, at least in sections, are arranged parallel with respect to one another on the printed circuit board and extend from a first track section, which is arranged in the first printed circuit board section, via the second printed circuit board section to the third printed circuit board section, in which a second track section is arranged, wherein, in the second printed circuit board section, at least one conductor track (121a, 122a) is arranged on the first side of the board and at least one conductor track (121b, 122b) is arranged on the second side of the board.

Abstract translation: 本发明涉及一种具有电缆保持空间（185）的实验室样本器械（200），其中布置有印刷电路板电缆装置（100），更具体地涉及分配器或移液管。 所述印刷电路板电缆装置具有至少一个印刷电路板（102），所述印刷电路板具有所述电路板的第一侧和第二侧，并且依次布置至少一个第一印刷电路板部分（A），至少一个 第二印刷电路板部分（B）和至少一个第三印刷电路板部分（C），其中所述印刷电路板具有多个印刷电路板（121,122），所述印刷电路板至少部分地相对于彼此平行地布置 在印刷电路板上并且从布置在第一印刷电路板部分中的第一轨道部分经由第二印刷电路板部分延伸到布置有第二轨道部分的第三印刷电路板部分，其中， 在第二印刷电路板部分中，至少一个印制导线（121a，122a）布置在板的第一侧上，并且至少一个印制导线（121b，122b）布置在板的第二侧上。

公开(公告)号：EP2533617A4

公开(公告)日：2013-02-13

申请号：EP11736603

申请日：2011-01-10

Applicant: HUAWEI DEVICE CO LTD

Inventor： JIANG ZHIWEI ,  CHEN XIAOCHEN ,  GUO ZHIPENG

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H05K2201/09072 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/042 ,  Y02P70/611

Abstract: Embodiments of the present invention disclose a PCBA chip package component and a soldering component, which can facilitate repairing of a PCBA chip package module. The PCBA chip package component in the embodiments of the present invention includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad. The embodiments of the present invention further provides a soldering component. The embodiments of the present invention may facilitate the repairing of the PCBA chip package component.

Abstract translation: 本发明的实施例公开了PCBA芯片封装部件和焊接部件，其可以有助于修复PCBA芯片封装模块。 本发明实施例中的PCBA芯片封装部件包括：模块板和接口板。 第一焊盘设置在模块板的底部，第二焊垫设置在接口板的顶部上，第二焊垫是城堡型结构。 第一焊盘包括第一焊接区域，第二焊接区域和连接第一焊接区域和第二焊接区域的连接桥。 第一焊接区域对应于第二焊盘的顶表面，并且当第一焊接区域被焊接到第二焊盘时，第二焊接区域位于第二焊盘的外部。 本发明的实施例还提供一种焊接部件。 本发明的实施例可以有助于修复PCBA芯片封装部件。

公开(公告)号：EP2533617A1

公开(公告)日：2012-12-12

申请号：EP11736603.9

申请日：2011-01-10

Applicant: Huawei Device Co., Ltd.

Inventor： JIANG, Zhiwei ,  CHEN, Xiaochen ,  GUO, Zhipeng

IPC: H05K1/11

CPC classification number: H05K1/111 ,  H05K1/112 ,  H05K1/141 ,  H05K3/225 ,  H05K2201/09072 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09663 ,  H05K2203/042 ,  Y02P70/611

Abstract: Embodiments of the present invention disclose a PCBA chip package component and a soldering component, which can facilitate repairing of a PCBA chip package module. The PCBA chip package component in the embodiments of the present invention includes: a module board and an interface board. A first soldering pad is set on the bottom of the module board, a second soldering pad is set on top of the interface board, and the second soldering pad is of a castle-type structure. The first soldering pad includes a first soldering area, a second soldering area, and a connection bridge that connects the first soldering area and the second soldering area. The first soldering area corresponds to a top surface of the second soldering pad, and when the first soldering area is soldered to second soldering pad, the second soldering area is located outside the second soldering pad. The embodiments of the present invention further provides a soldering component. The embodiments of the present invention may facilitate the repairing of the PCBA chip package component.

Abstract translation: 本发明的实施例公开了PCBA芯片封装部件和焊接部件，其可以有助于修复PCBA芯片封装模块。 本发明实施例中的PCBA芯片封装部件包括：模块板和接口板。 第一焊盘设置在模块板的底部，第二焊垫设置在接口板的顶部上，第二焊垫是城堡型结构。 第一焊盘包括第一焊接区域，第二焊接区域和连接第一焊接区域和第二焊接区域的连接桥。 第一焊接区域对应于第二焊盘的顶表面，并且当第一焊接区域被焊接到第二焊盘时，第二焊接区域位于第二焊盘的外部。 本发明的实施例还提供一种焊接部件。 本发明的实施例可以有助于修复PCBA芯片封装部件。

公开(公告)号：EP0971569A1

公开(公告)日：2000-01-12

申请号：EP99304250.6

申请日：1999-06-01

Applicant: Ford Motor Company

Inventor： Jairazbhoy, Vivek Amir ,  Brunner, Bjoern Erik ,  McMillan, Richard Keith

IPC: H05K1/11

CPC classification number: H05K3/3442 ,  H05K1/111 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/10636 ,  H05K2203/0465 ,  Y02P70/611 ,  Y02P70/613

Abstract: There is disclosed herein a printed circuit board (PCB) having enhanced mounting pads useful for overprinting solder paste and for repair of the solder joints. The PCB comprises: a dielectric substrate 10 having at least one mounting pad 20 thereon, wherein each mounting pad is arranged in matched relation with a respective termination 32 of an electronic component 30. Each mounting pad 20 includes a main body portion 24 and one or more fingerlike extensions 26 extending outward from the main body portion and away from a projected footprint 34 of the electronic component.

Abstract translation: 这里公开了一种印刷电路板（PCB），其具有用于套印焊膏和修补焊点的增强的安装焊盘。 PCB包括：电介质基板10，其上具有至少一个安装焊盘20，其中每个安装焊盘与电子部件30的相应终端32配合。每个安装焊盘20包括主体部分24和一个或 更多的手指状的延伸部26从主体部分向外延伸并且远离电子部件的投影足迹34。

公开(公告)号：EP0715489A3

公开(公告)日：1997-02-19

申请号：EP95308025.6

申请日：1995-11-09

Applicant: NCR International, Inc.

Inventor： König, Walter (NMI) ,  Mödl, Albert (NMI) ,  Baur, Peter Franz

IPC: H05K3/36 ,  H01R23/72

CPC classification number: H01R13/2414 ,  H01R12/52 ,  H01R12/714 ,  H01R13/658 ,  H05K1/117 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/0939 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10378 ,  H05K2201/10719

Abstract: A printed circuit board assembly includes two-dimensional arrays of connectors (14,16) to provide significantly higher data transfer rates than typical one-dimensionally arranged connectors, without sacrificing board space. The assembly includes a plurality of connection pads (14,16) on each printed circuit board (10,12). A layer of anisotropically conducting material (26) is placed between the connection pads and the boards are held together by fastening screws (28).

Abstract translation: 印刷电路板组件包括连接器（14,16）的二维阵列，以提供比典型的一维布置的连接器显着更高的数据传输速率，而不牺牲电路板空间。 该组件在每个印刷电路板（10,12）上包括多个连接垫（14,16）。 在连接垫之间放置一层各向异性传导材料（26），并且通过紧固螺钉（28）将这些板保持在一起。

公开(公告)号：EP0615290A2

公开(公告)日：1994-09-14

申请号：EP94102227.9

申请日：1994-02-14

Applicant: International Business Machines Corporation

Inventor： Deutsch, Alina ,  Lewis, David Andrew ,  Narayan. Chandrasekhar ,  Plachy,Anthony Louis

IPC: H01L23/538 ,  H01L23/64

CPC classification number: H01L23/5385 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0216 ,  H05K1/0289 ,  H05K1/111 ,  H05K3/4614 ,  H05K2201/0373 ,  H05K2201/0792 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/10719 ,  H05K2203/061 ,  Y02P70/611 ,  H01L2924/00

Abstract: Electrical interconnection structures are described. The electrical interconnection structures are formed by electrically interconnecting in a stack a plurality of discrete substrates (22, 24). By using a plurality of discrete substrates, a multilayer dielectric/electrical conductor structure can be fabricated from individual discrete substrates each of which can be tested prior to forming a composite stack so that defects in each discrete substrate can be eliminated before inclusion into the stack. Electrical interconnection between adjacent substrate is provided by an array of contact locations on each surface of the adjacent substrates. Corresponding contacts on adjacent substrates are adapted for mutual electrical engagement. Adjacent contact locations can be thermocompression bonded. To reduce the parasitic capacitance and coupled noise between the contact pads (26) the electrical conductors within the interior of each discrete substrate, the contact pads on each substrate have elongated shape. The elongated contact pads or lattice pads on adjacent substrates are nonparallel and preferably orthogonal so that the corresponding pads of adjacent substrates electrically interconnect an intersecting area which varies in location along the elongated contact pads as the placement of the adjacent substrates varies in the manufacture thereof.

Abstract translation: 描述电互连结构。 电互连结构通过在堆叠中电互连多个分立基板（22,24）而形成。 通过使用多个不连续的衬底，可以由各个不连续的衬底制造多层电介质/电导体结构，其中每个衬底都可以在形成复合叠层之前进行测试，从而可以在包含到叠层中之前消除每个离散衬底中的缺陷。 相邻基板之间的电互连由相邻基板的每个表面上的接触位置阵列提供。 相邻衬底上的相应触点适于相互电接合。 相邻的接触位置可以热压接。 为了降低每个分立衬底内部的导电接触垫（26）之间的寄生电容和耦合噪声，每个衬底上的接触垫具有细长的形状。 相邻基板上的细长接触垫或网格垫不平行，并且最好是正交的，这样当相邻基板的位置在其制造过程中变化时，相邻基板的相应垫电互连沿着细长接触垫变化的交叉区域。

公开(公告)号：KR1020170059068A

公开(公告)日：2017-05-30

申请号：KR1020150162778

申请日：2015-11-19

Applicant: 삼성전자주식회사

Inventor： 차남구 ,  김용일 ,  임완태

IPC: H05B33/14 ,  F21V19/00 ,  H05B37/00 ,  F21S2/00 ,  F21V23/00 ,  F21V17/10 ,  H01L33/48 ,  H05B37/02 ,  H01L33/40

CPC classification number: H01L25/0753 ,  H01L33/20 ,  H01L33/38 ,  H01L33/505 ,  H01L33/62 ,  H05K1/00 ,  H05K1/181 ,  H05K1/183 ,  H05K3/301 ,  H05K3/325 ,  H05K2201/083 ,  H05K2201/0939 ,  H05K2201/09472 ,  H05K2201/10106 ,  H05K2201/10674 ,  H05K2201/209 ,  H05K2203/104 ,  H05K2203/168 ,  Y02P70/611

Abstract: 본발명의일 실시예는, 복수의칩 탑재영역을가지며상기각 칩탑재영역에적어도하나의접속패드가배치된회로기판과, 상기복수의칩 탑재영역에각각배치되며볼록하거나오목한형상을갖는적어도하나의정렬용컴포넌트와, 상기복수의칩 탑재영역에각각탑재되어상기접속패드에전기적으로연결된전극을가지며상기정렬용컴포넌트와결합된구조를갖는복수의 LED 칩을포함하는광원모듈을제공한다.

Abstract translation: 本发明的一个实施例中，至少一个具有多个芯片安装区域与至少一个连接焊盘的布置的电路板，设置为凸的或凹的形状，以所述多个芯片上的每个芯片安装区域的安装区域 据分别安装在用于该组件的一个对准，并且所述多个所述芯片安装区域的所述提供一种光源模块，包括多个具有电连接到具有与该组件的对准相关联的结构的连接焊盘上的电极的LED芯片。

公开(公告)号：KR100961514B1

公开(公告)日：2010-06-07

申请号：KR1020080056566

申请日：2008-06-16

Applicant: 삼성전기주식회사

Inventor： 윤관수 ,  프라사드제이비비 ,  정재우 ,  서상훈 ,  조상도

IPC: G06F3/12 ,  B41J2/00

CPC classification number: H05K3/125 ,  H05K1/11 ,  H05K3/0005 ,  H05K3/0008 ,  H05K2201/0939

Abstract: 화상데이터 처리방법 및 이를 위한 프로그램이 기록된 기록매체가 개시된다. 반지름 r을 갖는 잉크를 중첩적으로 토출하여 반지름 R을 갖는 원형의 패드를 인쇄하기 위한 화상데이터를 취득하는 방법으로서, 인접하는 잉크 사이의 기준거리인 기준피치(P)를 설정하는 단계; 패드에 대한 벡터 데이터를 x, y 좌표계 상에 배치하는 단계; 좌표계 상에서 제1 기준점을 설정하는 단계; 제1 기준점으로부터, 45도와 135도 중 어느 한 방향(이하 제1 방향이라 함)으로, x축과 y축 각각 단위거리만큼 이격된 제1 판단점을 선정하는 단계; 제1 기준점으로부터 제1 판단점까지의 거리와, 기준피치(P)를 비교하는 단계; 제1 기준점으로부터 제1 판단점까지의 거리가 기준피치(P)보다 크거나 같은 경우, 제1 판단점의 좌표를 인쇄데이터로 저장하는 단계를 포함하는 화상데이터 처리방법에 따르면, 사용자가 요구하는 해상도 및 잉크밀도에 맞추어, 높은 표면 평탄도와 높은 신뢰도를 갖춘 패드를 인쇄할 수 있다.
잉크젯, 패드, 화상데이터, 기록매체

公开(公告)号：KR20180026005A

公开(公告)日：2018-03-12

申请号：KR20160112457

申请日：2016-09-01

Applicant: SAMSUNG DISPLAY CO LTD

Inventor： JO JUNG YUN ,  YANG JEONG DO

IPC: H05K1/14 ,  G02F1/1345 ,  H01L27/32 ,  H05K1/02 ,  H05K3/32 ,  H05K3/40

CPC classification number: H05K1/111 ,  H05K1/0313 ,  H05K1/09 ,  H05K3/188 ,  H05K3/28 ,  H05K3/4007 ,  H05K2201/09045 ,  H05K2201/0939 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: 본발명에따르면, 베이스기판; 상기베이스기판상에제공되는배선; 상기배선상에제공되는패시베이션층; 상기패시베이션층상에제공되는탄성범프; 및상기탄성범프상에제공되는도전층을포함하고, 상기패시베이션층은상기배선의일부영역을노출시키는제1 개구및 제2 개구를갖고, 제2 개구는제1 개구와인접한영역에배치되는것을특징으로하는회로기판, 상기회로기판을포함하는표시장치, 상기회로기판의제조방법이제공된다.

Abstract translation: 提供了一种电路板，包括该电路板的显示装置以及制造电路板的方法。 电路板包括基底基板，设置在基底基板上的布线，设置在布线上的钝化层，设置在钝化层上的弹性凸块以及设置在弹性凸块上的导电层。 钝化层包括暴露布线的部分区域的第一开口和第二开口，并且第二开口布置在与第一开口相邻的区域中。