中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

366 records (took 0.021 seconds)

    An indicator display assembly for a vehicle rearview mirror
    91.
    发明公开
    An indicator display assembly for a vehicle rearview mirror 审中-公开
    BlinkeranzeigeanordnungfüreinenFahrzeugrückspiegel

    公开(公告)号：EP2088032A1

    公开(公告)日：2009-08-12

    申请号：EP09152073.4

    申请日：2009-02-04

    Applicant: MEKRA Lang GmbH & Co. KG

    Inventor： Boivin, Joseph Ivan Rodolph

    IPC: B60R1/12 ,  B60Q1/26

    CPC classification number: B60R1/1207 ,  B60Q1/2665 ,  H05K3/306 ,  H05K2201/10106 ,  H05K2201/10424 ,  H05K2201/10484 ,  H05K2201/2036

    Abstract: An integrated light-emitting diode (LED) indicator display assembly (10) having a carrier plate (12) including a plurality of LED mounting steps (18). Electrical contact leads (24) for LEDs carried on the mounting steps extend through openings (26) in the mounting steps and out the bottom side of the carrier plate for engaging a metal fret (30) to power the LED array. Preferably, a vibration dampening member (36) is positioned between the LED and the LED mounting step, and a protective covering (34) is applied over the metal fret along the bottom side of the carrier plate to enclose the metal fret and secures the metal fret in place.

    Abstract translation: 一种具有包括多个LED安装台阶（18）的承载板（12）的集成发光二极管（LED）指示显示组件（10）。 在安装步骤上携带的LED的电接触引线（24）延伸穿过安装步骤中的开口（26）并且穿过载体板的底侧，用于接合金属支架（30）以为LED阵列供电。 优选地，防振构件（36）位于LED和LED安装步骤之间，并且保护覆盖物（34）沿着承载板的底侧施加在金属架上，以包围金属构件并固定金属 担心到位

    Light emitting unit and lighting apparatus
    94.
    发明公开
    Light emitting unit and lighting apparatus 有权
    Lichtemittierender Baustein und Beleuchtungsvorrichtung

    公开(公告)号：EP1843403A2

    公开(公告)日：2007-10-10

    申请号：EP07105251.8

    申请日：2007-03-29

    Applicant: Nichia Corporation

    Inventor： Sumitani, Naofumi

    IPC: H01L33/00 ,  F21K7/00 ,  G02B6/42 ,  H01L25/075

    CPC classification number: H05K1/18 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49113 ,  H04N1/0083 ,  H04N1/02815 ,  H04N1/0282 ,  H05K3/308 ,  H05K2201/10106 ,  H05K2201/10484

    Abstract: A light emitting unit (10), comprises: a light emitting element (15a, 15b, 15c); a plurality of lead frames (11, 12a, 12b, 12c) to which said light emitting element (15a, 15b, 15c) is electrically connected; and a package (13) in which said lead frames (11, 12a, 12b, 12c) are inserted so that at least one end thereof protrudes, and on which a light emitting window (14) is arranged for receiving luminous light from the light emitting element (15a, 15b, 15c), wherein at least the distal ends at said one end of the lead frames (11, 12a, 12b, 12e) are inclined with respect to the light emitting window (14).

    Abstract translation: 发光单元（10）包括：发光元件（15a，15b，15c）; 所述发光元件（15a，15b，15c）电连接到的多个引线框架（11,12a，12b，12c） 以及其中插入所述引线框架（11,12a，12b，12c）的封装（13），使得其至少一个端部突出，并且其上布置有用于接收来自所述光的发光的发光窗口（14） 所述引线框架（11,12a，12b，12e）的所述一端的至少前端相对于所述发光窗（14）倾斜。

    Package for integrated circuit chips
    96.
    发明公开
    Package for integrated circuit chips 失效
    Packungenfürgestapelte integrierte Schaltungschips。

    公开(公告)号：EP0575806A2

    公开(公告)日：1993-12-29

    申请号：EP93109124.3

    申请日：1993-06-07

    Applicant: International Business Machines Corporation

    Inventor： Cipolla, Thomas Mario ,  Coteus, Paul William ,  Damianakis, Ioannis ,  Johnson, Glen Walden ,  Matthew, Linda Carolyn ,  Mok, Lawrence Shungwei ,  Ledermann, Peter Gerard

    IPC: H01L25/065

    CPC classification number: H05K3/363 ,  H01L24/01 ,  H01L25/0652 ,  H01L25/0657 ,  H01L2225/06551 ,  H01L2225/06596 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/366 ,  H05K3/4007 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09172 ,  H05K2201/09909 ,  H05K2201/10484 ,  H05K2201/1059 ,  H05K2201/10681 ,  H05K2201/10984 ,  H01L2924/00

    Abstract: This invention relates to three dimensional packaging of integrated circuit chips (306) into stacks to form cube structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate (300) having a plurality of conductors (316) one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures (318) can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contains solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate (302) surface or the pin-like structures can be adapted for insertion into apertures (320) in a second substrate. The second substrate provides a means for electrically interconnecting a plurality of these cubes. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cube.

    Abstract translation: 本发明涉及集成电路芯片三维封装成堆叠以形成立方体结构。 在堆叠中的相邻芯片之间，设置有电互连装置，其是具有多个导体的第一基板，其多个导体电连接到芯片接触位置，并且其另一端延伸到芯片堆叠的一侧， 形成多个针状电互连组件。 销状结构可以由在该侧面延伸的至少一个侧面上具有电导体的第一基板的突起形成。 或者，销状结构可以由导体形成，该导体从第一衬底的边缘的两侧悬臂相对，两侧的导体对准并间隔开第一衬底厚度。 这些空间包含焊料并形成焊料加载的针状结构。 针状结构可以直接焊接到第二衬底表面上的导体上，或者针状结构可以适于插入到第二衬底中的孔中。 第二基板提供用于电连接多个这些立方体的装置。 优选地，第一和第二基底是电路化柔性聚合物膜。 第二基板设置在诸如PC板的第三基板上，其间具有弹性材料，其允许将散热器压紧成与立方体的相对侧紧密接触。

    AIRCRAFT LED LIGHT UNIT
    98.
    发明公开
    AIRCRAFT LED LIGHT UNIT 审中-公开
    FLUGZEUG-LED-BELEUCHTUNGSEINHEIT

    公开(公告)号：EP3119168A1

    公开(公告)日：2017-01-18

    申请号：EP15177327.2

    申请日：2015-07-17

    Applicant: Goodrich Lighting Systems GmbH

    Inventor： JHA, Anil Kumar ,  MENNE, Norbert ,  SCHREWE, Elmer ,  TRINSCHEK, Robert ,  HESSLING VON HEIMENDAHL, André

    IPC: H05K1/05

    CPC classification number: B64D47/02 ,  F21V23/04 ,  H05K1/053 ,  H05K1/056 ,  H05K1/181 ,  H05K3/3431 ,  H05K2201/10106 ,  H05K2201/10484 ,  Y02P70/611

    Abstract: An aircraft LED light unit (1, 10) comprises at least one printed circuit board (2, 2-1-2-4) which comprises at least one metal core layer (21) and at least one dielectric layer (22), and at least one LED (3, 3-1-3-3, 3-111-3-43n) disposed on the printed circuit board and which comprises an anode (31) and a cathode (32) for electrically coupling to a power source (12). One of the anode and cathode (31, 32) of the at least one LED is connected to an electrical conductor (4) which is disposed on the dielectric layer (22) and is coupled to a first terminal of the power source (12), wherein the dielectric layer (22) electrically isolates the electrical conductor (4) from the metal core layer (21), and the other one of the anode and cathode (31, 32) of the at least one LED is connected to the metal core layer (21) of the at least one printed circuit board, wherein the metal core layer (21) is coupled to a second terminal of the power source (12).

    Abstract translation: 飞机LED灯单元（1,10）包括至少一个包括至少一个金属芯层（21）和至少一个电介质层（22）的印刷电路板（2-1-1-4），以及 设置在印刷电路板上的至少一个LED（3,3-1-3-3,3.111-3-43n），其包括用于电耦合到电源的阳极（31）和阴极（32） （12）。 所述至少一个LED的阳极和阴极（31,32）中的一个连接到布置在电介质层（22）上并耦合到电源（12）的第一端子的电导体（4） ，其中介电层（22）将电导体（4）与金属芯层（21）电隔离，并且至少一个LED的阳极和阴极（31,32）中的另一个连接到金属 所述至少一个印刷电路板的芯层（21），其中所述金属芯层（21）耦合到所述电源（12）的第二端子。

Patent Agency Ranking