公开(公告)号：EP2361005A1

公开(公告)日：2011-08-24

申请号：EP09831829.8

申请日：2009-11-30

Applicant: Murata Manufacturing Co. Ltd.

Inventor： HARA Koichi

IPC: H05K7/20 ,  H01L23/36 ,  H05K9/00

CPC classification number: H01L23/3675 ,  H01L23/433 ,  H01L23/552 ,  H01L24/50 ,  H01L25/16 ,  H05K1/0203 ,  H05K3/0061 ,  H05K2201/09745 ,  H05K2201/10409 ,  H05K2201/1056 ,  H05K2203/1572

Abstract: A plurality of electronic components 1 and 2 including at least one heat-generating electronic component 1 and constituting an electronic circuit are spaced from each other on a circuit board 4. Regions of one or both sides of the circuit board 4, including regions around the plurality of electronic components 1 and 2, are covered with a heat-dissipating member 3. A surface of the heat-dissipating member 3 facing the circuit board 4 has irregularities. An end surface of a protrusion 5 in the facing surface of the heat-dissipating member 3 is in contact with a circuit board surface between the electronic components 1 and 2, directly or with a heat-dissipating sheet 7 interposed therebetween. A wall surface of a recess 6 in the facing surface of the heat-dissipating member 3 is in surface-contact with the heat-generating electronic component 1 within the recess 6, directly or with the heat-dissipating sheet 7 interposed therebetween. Thus, heat from the heat-generating electronic component 1 and heat from the circuit board 4 heated by the heat from the heat-generating electronic component 1 are dissipated outside through the heat-dissipating member 3.

Abstract translation: 包括至少一个发热电子部件1并构成电子电路的多个电子部件1和2在电路板4上彼此间隔开。电路板4的一侧或两侧的区域包括围绕 多个电子部件1和2被散热构件3覆盖。散热构件3的面向电路板4的表面具有不规则性。 散热构件3的相对表面中的突起5的端面与电子部件1和2之间的电路板表面直接接触或者与散热片7之间插入。 散热构件3的相对表面中的凹部6的壁表面与凹部6内的发热电子部件1直接或与散热片7相互间的表面接触。 因此，来自发热电子部件1的热量和来自发热电子部件1的加热的电路基板4的热量通过散热部件3向外部散发。

公开(公告)号：EP2220678A2

公开(公告)日：2010-08-25

申请号：EP08756454.8

申请日：2008-05-29

Applicant: Occam Portfolio LLC

Inventor： FJELSTAD, Joseph C.

IPC: H01L23/48 ,  H05K3/32

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.

公开(公告)号：EP1565045B1

公开(公告)日：2010-08-25

申请号：EP04425094.2

申请日：2004-02-12

Applicant: Askoll Holding S.r.l.

Inventor： Marioni, Elio

IPC: H05K3/34 ,  H05K1/14 ,  H01L23/495 ,  H01L23/40

CPC classification number: H05K1/0209 ,  H05K1/145 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10757 ,  Y10T29/4913

公开(公告)号：EP2003942A2

公开(公告)日：2008-12-17

申请号：EP08156905.5

申请日：2008-05-26

Applicant: Delphi Technologies, Inc.

Inventor： Sozansky, Wayne A.

IPC: H05K3/30 ,  H05K7/20

CPC classification number: H05K7/20509 ,  H01L23/42 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K3/306 ,  H05K3/3447 ,  H05K3/3468 ,  H05K2201/1056 ,  Y10T29/4913 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49149 ,  H01L2924/00

Abstract: An improved process for assembling a plurality of power packages and a thermal heat sink to a printed circuit board involves securing the power packages to the heat sink before soldering the electrical leads of the power packages to the printed circuit board. The improved process allows the electrical leads of the power packages to move freely in lead holes in the printed circuit board as intimate planar surface to planar surface contact between the heat sink and the power packages is achieved, thereby eliminating or at least substantially reducing lead bending that occurs in conventional processes wherein attachment of the heat sink to the power packages occurs after the leads of the power packages have been soldered to the printed circuit board.

Abstract translation: 将多个功率封装和热散热器组装到印刷电路板的改进方法包括在将功率封装的电引线焊接到印刷电路板之前将功率封装固定到散热器。 改进的过程允许功率封装的电引线在印刷电路板的引线孔中自由移动，因为在散热器和功率封装之间的平坦的平面表面接触到平坦的表面接触，从而消除或至少基本上减少引线弯曲 这在常规工艺中发生，其中在功率封装的引线已经被焊接到印刷电路板之后发生散热器附接到功率封装。

公开(公告)号：EP1667226A3

公开(公告)日：2008-10-22

申请号：EP05077632.7

申请日：2005-11-18

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Zimmerman, David W. ,  Chengalva, Suresh K.

IPC: H01L23/36 ,  H05K7/20

CPC classification number: H05K1/021 ,  H01L23/13 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/0061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09745 ,  H05K2201/1056 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (40,50) having a laminate construction of multiple layers (12), such as a LTCC ceramic substrate (10), with conductor lines (30) between adjacent pairs of layers (12). A heat sink (22) is bonded to a first surface (26) of the substrate (10), and a cavity (24) is defined by and between the heat sink (22) and the substrate (10) such that a base wall (28) of the cavity (24) is defined by one of the layers (12) with conductor lines (30) thereof being present on the base wall (28). A surface-mount circuit device (14) is received within the cavity (24), mounted to the base wall (28), and electrically connected to the conductor lines (30) on the base wall (28). The device (14) is received within the cavity (24) such that a surface of the device (14) contacts a surface region of the heat sink (22). The surface of the device (14) is bonded to the surface region of the heat sink (22) to provide a substantially direct thermal path from the device (14) to the heat sink (22).

公开(公告)号：EP0717443A4

公开(公告)日：1997-12-17

申请号：EP95923573

申请日：1995-07-03

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： YASUHO TAKEO ,  IWATA MASAO ,  KATSURAGAWA RYOICHI ,  MATSUNAGA HAYAMI ,  SUEHIRO YOSHIKAZU ,  YOKOTA YASUHIKO

IPC: H01L25/18 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/36 ,  H05K7/10 ,  H05K7/20 ,  H01L25/10

CPC classification number: H05K7/1092 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0209 ,  H05K1/0263 ,  H05K1/056 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/09781 ,  H05K2201/10318 ,  H05K2201/1056 ,  H05K2201/10689 ,  H05K2201/2036 ,  H01L2924/00

Abstract: An integrated circuit device which has an excellent heat radiating property and is used for such consumer products as electronic equipment, electric equipment, communication equipment, and measurement control equipment, etc. A power source (4) and a plurality of pin terminals (5) are mounted on a metal plate (1). A cache controller (10), a cache memory section (11), a data buffer (LSI) section (14), a (CPU) chip (8), and a connector (12) are mounted on a multiplayer circuit wiring board (7). The plate (1) mounted with the power source (4) is attached to the rear surface of the board (7) through the pin terminals (5). Therefore, an integrated circuit device such that the degree of integration is improved and heat radiating parts have excellent heat radiating properties is provided.

公开(公告)号：EP0632685A2

公开(公告)日：1995-01-04

申请号：EP94108592.0

申请日：1994-06-01

Applicant: International Business Machines Corporation

Inventor： Cutting, Lawrence Richard ,  Gaynes, Michael Anthony ,  Johnson, Eric Arthur ,  Milkovich, Cynthia Susan ,  Perkins, Jeffrey Scott ,  Pierson, Mark Vincent ,  Poetzinger, Steven Eugene ,  Zalesinski, Jerzy

IPC: H05K7/20 ,  H05K1/00

CPC classification number: H05K7/20454 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/3672 ,  H01L23/5387 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01322 ,  H05K1/021 ,  H05K1/0298 ,  H05K1/182 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/1216 ,  H05K3/3415 ,  H05K3/3452 ,  H05K3/4691 ,  H05K2201/0154 ,  H05K2201/09063 ,  H05K2201/096 ,  H05K2201/09745 ,  H05K2201/1056 ,  H05K2201/2009 ,  H05K2203/1394 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Disclosed are multi-layer substrates for flexible circuit boards and flexible circuit board assemblies and their methods of manufacture.
More particularly multi-layer flexible circuit board substrates are described for attaching components including chips and heat spreaders to form a three-dimensional circuit board assembly.

Abstract translation: 公开的是用于柔性电路板和柔性电路板组件和它们的制造方法的多层基板。 更具体地多层柔性电路板基板中描述用于附连包括芯片和散热器，以形成一个三维电路板组件的组件。

公开(公告)号：NL2000264C

公开(公告)日：2011-05-18

申请号：NL2000264

申请日：2006-10-09

Applicant: SAMSUNG ELECTRO MECH

Inventor： YUN HYEONG WON ,  LEE HYUN HO

IPC: G02F1/13357 ,  F21S2/00 ,  F21V29/00 ,  F21Y101/02 ,  H01L33/00 ,  H01L33/44 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64

CPC classification number: H05K1/021 ,  G02F1/133603 ,  G02F1/133608 ,  G02F2001/133628 ,  H01L2224/48091 ,  H05K1/182 ,  H05K2201/10106 ,  H05K2201/1056 ,  H01L2924/00014

公开(公告)号：KR101642560B1

公开(公告)日：2016-07-25

申请号：KR1020140054047

申请日：2014-05-07

Applicant: 삼성전기주식회사

Inventor： 최승용

IPC: H01L23/60 ,  H01L23/28 ,  H01L23/12

CPC classification number: H05K1/181 ,  H01L21/50 ,  H01L21/561 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/023 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/1056 ,  H05K2201/2018 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  H01L2224/81 ,  H01L2924/00012

Abstract: 본발명은기판의양면에전자부품들을실장하여집적도를높일수 있는전자소자모듈에관한것으로, 일면에적어도하나의전자소자가실장된제1 기판; 상기제1 기판의일면에접합되며적어도하나의상기전자소자가수용되는공간인소자수용부를적어도하나구비하는제2 기판; 및상기소자수용부에배치되어적어도하나의상기전자소자를내부에수용하는차폐부재;를포함한다.

Abstract translation: 电子设备模块包括具有安装在其一个表面上的至少一个或多个电子设备的第一基板，结合到第一基板的一个表面上的第二基板，并且包括至少一个装置容纳部件，该装置容纳部件具有电子装置 以及设置在所述设备容纳部分中并且容纳其中的至少一个或多个电子设备的屏蔽构件。

公开(公告)号：KR101066189B1

公开(公告)日：2011-09-21

申请号：KR1020050011741

申请日：2005-02-12

Applicant: 아스콜 홀딩 에스.알.엘.

Inventor： 마리오니,엘리오

IPC: H05K1/18

CPC classification number: H05K1/0209 ,  H05K1/145 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10757 ,  Y10T29/4913

Abstract: 본 발명은, 패키지 형태의 분리형 전자 소자에 관한 것으로서, 상기 전자 소자는, 전원 전자 회로, 실질적으로 평행육면체인 몸체 또는 케이싱(2), 및 인쇄회로기판(4) 상에서의 전기적 연결을 위해 상기 몸체(2)로부터 돌출되어 있으며 상기 몸체 내에서 상기 전자 회로와 연결되어 있는 전자 연결 핀(3)을 포함한다. 상기 몸체(2)는, 상기 몸체(2)로부터 만들어지는 하나 이상의 면을 가지면서 평면(P) 상에 위치하는 열 발산 헤더(5)를 가진다. 상기 핀(3)은, 첫 부분이 상기 평면(P)에 평행하게 연장되는 제1 섹션을 가지도록 상기 몸체(2)로부터 돌출되어 있다. 상기 핀(3) 중에서 한 쌍의 핀(7, 8)은, 열 발산 중간 다이(9)에 용접되는 단계 동안 전자 소자(1)를 더욱 안전하게 지지할 수 있도록, 상기 제1 섹션에 후속하여 상기 평면(P)에 대하여 평행한 U자 형상의 절곡부를 가지고 있다.