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1.发明申请
公开(公告)号：WO2009009639A2
公开(公告)日：2009-01-15
申请号：PCT/US2008/069600
申请日：2008-07-10
Applicant: OCCAM PORTFOLIO LLC , FJELSTAD, Joseph C.
Inventor： FJELSTAD, Joseph C.
CPC classification number: H05K1/188 , H01L23/5389 , H01L24/19 , H01L24/48 , H01L24/73 , H01L24/82 , H01L2224/04105 , H01L2224/24195 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01029 , H01L2924/01055 , H01L2924/01078 , H01L2924/07811 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/19105 , H05K1/185 , H05K3/06 , H05K3/061 , H05K3/284 , H05K3/323 , H05K2201/0355 , H05K2203/1469 , Y10T29/4913 , Y10T29/49146 , Y10T29/49169 , Y10T428/24612 , H01L2924/00015 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.
Abstract translation: 一种用于制造与此相对应的电子部件和组件的组件的方法，其中电子部件具有部件端子。 提供具有第一侧和第二侧的导电孔。 然后组件端子用各向异性导体连接到穹顶的第一侧。 一种模式适用于所述穹隆的第二面。 并且基于图案去除穹隆的部分，使得所述穹形的剩余部分形成将元件端子互连的电路。
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2.发明申请
公开(公告)号：WO2008150898A2
公开(公告)日：2008-12-11
申请号：PCT/US2008/065131
申请日：2008-05-29
Applicant: OCCAM PORTFOLIO LLC , FJELSTAD, Joseph C.
Inventor： FJELSTAD, Joseph C.
CPC classification number: H05K1/144 , H01L24/73 , H01L24/82 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15184 , H01L2924/3025 , H05K1/0207 , H05K1/185 , H05K3/284 , H05K3/4664 , H05K2201/042 , H05K2201/043 , H05K2201/10189 , H05K2201/10318 , H05K2201/10386 , H05K2201/1056 , H05K2203/1316 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.
Abstract translation: 本发明提供电子组件400及其制造方法800,900,10001200,1400,1500,1600,1700。组件400不使用焊料。 具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。该组件被电绝缘材料908封装，电绝缘材料908具有穿过衬底形成或钻孔1000的通孔420,1002。 808到组件引线412.然后组件被电镀1200，并且重复进行封装和钻孔工艺1500以构建所需的层422,1502,1702。组件可以配合1800.在配合的组件内，物品可以被插入，包括销 2202a，2202b和2202c，夹层互连设备2204，散热器2402以及散热器和散热器2602组合。边缘卡连接器2802可以附接到配合的组件。
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公开(公告)号：EP2220678A2
公开(公告)日：2010-08-25
申请号：EP08756454.8
申请日：2008-05-29
Applicant: Occam Portfolio LLC
Inventor： FJELSTAD, Joseph C.
CPC classification number: H05K1/144 , H01L24/73 , H01L24/82 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15184 , H01L2924/3025 , H05K1/0207 , H05K1/185 , H05K3/284 , H05K3/4664 , H05K2201/042 , H05K2201/043 , H05K2201/10189 , H05K2201/10318 , H05K2201/10386 , H05K2201/1056 , H05K2203/1316 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.
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公开(公告)号：WO2009117027A1
公开(公告)日：2009-09-24
申请号：PCT/US2008/086479
申请日：2008-12-11
Applicant: OCCAM PORTFOLIO LLC , FJELSTAD, Joseph C. , GAMINI, Nader
Inventor： FJELSTAD, Joseph C. , GAMINI, Nader
CPC classification number: H05K1/185 , H01L25/105 , H01L25/16 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H01L2924/14 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/3025 , H05K1/023 , H05K3/284 , H05K3/4664 , H05K2201/10515 , H05K2201/10628 , H05K2201/10636 , H05K2201/10689 , H05K2201/10704 , H05K2201/10719 , H05K2201/10734 , H05K2203/1469 , Y02P70/611 , H01L2924/00
Abstract: An apparatus is disclosed that improves density of electrical components in a circuit assembly. Electrical components 202, 204 are stacked so that they overlap each other and are encapsulated in an electronic insulating material 104. The resulting subassembly may be integrated onto a printed circuit board or into a reverse-interconnection process assembly.
Abstract translation: 公开了一种提高电路组件中的电气部件的密度的装置。 电气部件202,204被堆叠成使得它们彼此重叠并且被封装在电子绝缘材料104中。所得到的子组件可以集成到印刷电路板或反向互连工艺组件中。
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Patent Agency Ranking
公开(公告)号：WO2008138015A2
公开(公告)日：2008-11-13
申请号：PCT/US2008/063130
申请日：2008-05-08
Applicant: OCCAM PORTFOLIO LLC , FJELSTAD, Joseph C.
Inventor： FJELSTAD, Joseph C.
CPC classification number: H05K3/32 , F21K9/00 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00011 , H01L2924/00014 , H01L2924/01015 , H01L2924/01047 , H01L2924/14 , H01L2924/3025 , H05K3/202 , H05K3/4644 , H05K3/4664 , H05K2201/09509 , H05K2201/10106 , H05K2203/1469 , H01L2924/00 , H01L2924/01005 , H01L2924/00012 , H01L2224/45099
Abstract: An electrical device in the form of a light emitting diode (LED) assembly. A plurality of LEDs are provided, wherein each has an anode and a cathode. A base holds this plurality of LEDs in a substantially fixed relationship. One or more anode conductors then each connect electrically to one or more of the LED anodes in a manner characterized by not including any solder material. Similarly, one or more cathode conductors each connect electrically to one or more of the LED cathodes in a manner characterized by not including any solder material.
Abstract translation: 发光二极管（LED）组件形式的电器件。 提供了多个LED，其中每个都具有阳极和阴极。 基座以大致固定的关系保持该多个LED。 然后，一个或多个阳极导体以特征在于不包括任何焊料材料的方式电连接到一个或多个LED阳极。 类似地，一个或多个阴极导体各自以特征在于不包括任何焊料材料的方式电连接到一个或多个LED阴极。
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公开(公告)号：WO2010045594A3
公开(公告)日：2010-04-22
申请号：PCT/US2009/061063
申请日：2009-10-16
Applicant: OCCAM PORTFOLIO LLC , FJELSTAD, Joseph C.
Inventor： FJELSTAD, Joseph C.
IPC: H01L21/60
Abstract: The present invention provides an electronic assembly (400) and a method for its manufacture (800), (900, 1000 1200, 1400, 1500, and 1700). The assembly (400) uses no solder. Components (406) or component packages (402, 802, 804, 806) with I/O leads (412) are placed (800) onto a planar substrate (808). The assembly is encapsulated (900) with electrically insulating material (908) with vias (420, 1002) formed or drilled (1000) through the substrate (808) to the components' leads (412). Then the assembly is plated (1200) and the encapsulation and drilling process (1500) repeated to build up desired layers (422, 1502, 1702). The planar substrate (808) may be a flexible substrate (2016) allowing bending of an assembly (2000) to fit into various enclosures.
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公开(公告)号：WO2009018586A3
公开(公告)日：2009-02-05
申请号：PCT/US2008/076436
申请日：2008-09-15
Applicant: OCCAM PORTFOLIO LLC , FJELSTAD, Joseph C.
Inventor： FJELSTAD, Joseph C.
IPC: H05K1/18
Abstract: An electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. The planar substrate 808 may be a flexible substrate 2016 allowing bending of an assembly 2000 to fit into various enclosures.
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8.发明公开
公开(公告)号：EP2353179A2
公开(公告)日：2011-08-10
申请号：EP09821348.1
申请日：2009-10-16
Applicant: Occam Portfolio LLC
Inventor： FJELSTAD, Joseph C.
IPC: H01L21/60
CPC classification number: H05K1/189 , H01L21/568 , H01L24/31 , H01L24/48 , H01L2224/32245 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01013 , H01L2924/01029 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H05K3/284 , H05K3/32 , H05K2201/09481 , H05K2203/1316 , H05K2203/1469 , Y10T156/10 , Y10T156/1057 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: The present invention provides an electronic assembly (400) and a method for its manufacture (800), (900, 1000 1200, 1400, 1500, and 1700). The assembly (400) uses no solder. Components (406) or component packages (402, 802, 804, 806) with I/O leads (412) are placed (800) onto a planar substrate (808). The assembly is encapsulated (900) with electrically insulating material (908) with vias (420, 1002) formed or drilled (1000) through the substrate (808) to the components' leads (412). Then the assembly is plated (1200) and the encapsulation and drilling process (1500) repeated to build up desired layers (422, 1502, 1702). The planar substrate (808) may be a flexible substrate (2016) allowing bending of an assembly (2000) to fit into various enclosures.
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公开(公告)号：EP2208223A2
公开(公告)日：2010-07-21
申请号：EP08781591.6
申请日：2008-07-10
Applicant: Occam Portfolio LLC
Inventor： FJELSTAD, Joseph C.
CPC classification number: H05K1/188 , H01L23/5389 , H01L24/19 , H01L24/48 , H01L24/73 , H01L24/82 , H01L2224/04105 , H01L2224/24195 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/00014 , H01L2924/01029 , H01L2924/01055 , H01L2924/01078 , H01L2924/07811 , H01L2924/12041 , H01L2924/15311 , H01L2924/181 , H01L2924/19043 , H01L2924/19105 , H05K1/185 , H05K3/06 , H05K3/061 , H05K3/284 , H05K3/323 , H05K2201/0355 , H05K2203/1469 , Y10T29/4913 , Y10T29/49146 , Y10T29/49169 , Y10T428/24612 , H01L2924/00015 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: A method for producing an assembly of electronic components and assemblies in accord with this, wherein the electronic components have component terminals. A conductive firmament having a first side and a second side is provided. Then the component terminals are connected to the first side of the firmament with an anisotropic conductor. A pattern is applied to the second side of said firmament. And portions of the firmament are removed based on the pattern, such that remaining portions of said firmament form the electrical circuit interconnecting the component terminals.
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