公开(公告)号：EP2600469A2

公开(公告)日：2013-06-05

申请号：EP12192499.7

申请日：2012-11-14

Applicant: DAI-ICHI SEIKO CO., LTD.

Inventor： Takeshi, Hirakawa

IPC: H01R12/73 ,  H01R12/79 ,  H01R12/78 ,  H01R13/627

CPC classification number: H01R12/73 ,  H01R12/78 ,  H01R12/79 ,  H01R13/627 ,  H01R13/639 ,  H02K7/08 ,  H02K7/09 ,  H02K15/14 ,  H05K1/182 ,  H05K3/361 ,  H05K2201/0949 ,  H05K2201/10189 ,  H05K2201/2018

Abstract: A circuit-terminal connecting device comprising a first connector (12) having a first housing (15) fixed to a main circuit board (11) and first contacts (16) supported by the first hous i ng (15) to be connected with first circuit-terminals provided on the main circuit board (11) and a second connector (14; 40) having a second housing (17; 41) attached to a flat circuit member (13) and second contacts (18; 42) supported by the second housing (17; 41) to be connected with second circuit-terminals (20) provided on the flat circuit member (13). The first housing (15) of the first connector (12) fits into a hole (22; 44) formed in the second housing (17; 41) of the second connector (14; 40) so as to create an electrical piling connection between the main circuit board (11) and the flat circuit member (13) wherein the flat circuit member (13) is laid on top of the main circuit board (11) and the first circuit-terminals are electrically connected with the second circuit-terminals (20) through the first and second connectors (12, 14; 40).

公开(公告)号：EP1901110A3

公开(公告)日：2008-05-07

申请号：EP07016885.1

申请日：2007-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang, Hyun-min

IPC: G02F1/13 ,  H05K1/14 ,  G02F1/13357

CPC classification number: G02F1/13452 ,  G02F1/133608 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/118 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/09354 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09681 ,  H05K2201/10136

Abstract: A display device (1) includes a display panel (10) provided with an electrode pad, a light source (50) to emit light to the display panel, a mold frame (60) to support the light source; a bottom chassis (90) to accommodate the mold frame, a driving part (20) to apply a driving signal to the display panel connected to the electrode pad, and a driving circuit part that controls the driving part. The driving circuit part includes a first driving circuit board (31) connected to the driving part and on which circuit components are mounted toward the mold frame, and a second driving circuit board (33) connected to the first driving circuit board. The display device further includes a flexible circuit board (100) to connect the first driving circuit board and the second driving circuit board.

公开(公告)号：EP1342292B1

公开(公告)日：2008-05-07

申请号：EP01964215.6

申请日：2001-08-20

Applicant: Power-One, Inc.

Inventor： ROY, Apurba ,  BRKOVIC, Milivoje, Slobodan

IPC: H01R12/04 ,  H05K1/14 ,  H05K3/34

CPC classification number: H01R43/0256 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/0949 ,  H05K2201/09954 ,  H05K2201/10303 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A circuit module (11) is provided with a plurality of dual capacity connector pads (13), each pad holding a miniature surface mount connector (15) and/or a connection pin (17). The preferred I-channel surface mount connector is sufficiently small that the module can be connected by either surface mount connector (15) or pin (17) to the same region of the circuit module.

公开(公告)号：EP1901110A2

公开(公告)日：2008-03-19

申请号：EP07016885.1

申请日：2007-08-29

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jang, Hyun-min

IPC: G02F1/13 ,  H05K1/14 ,  G02F1/13357

CPC classification number: G02F1/13452 ,  G02F1/133608 ,  H05K1/0218 ,  H05K1/0224 ,  H05K1/118 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/09354 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09681 ,  H05K2201/10136

Abstract: A display device (1) includes a display panel (10) provided with an electrode pad, a light source (50) to emit light to the display panel, a mold frame (60) to support the light source; a bottom chassis (90) to accommodate the mold frame, a driving part (20) to apply a driving signal to the display panel connected to the electrode pad, and a driving circuit part that controls the driving part. The driving circuit part includes a first driving circuit board (31) connected to the driving part and on which circuit components are mounted toward the mold frame, and a second driving circuit board (33) connected to the first driving circuit board. The display device further includes a flexible circuit board (100) to connect the first driving circuit board and the second driving circuit board.

Abstract translation: 本发明的显示装置（1）具有：具备电极焊盘的显示面板（10）;向显示面板射出光的光源（50）;支撑光源的模框（60） 用于容纳模制框架的底架（90），用于向连接到电极焊盘的显示面板施加驱动信号的驱动部件（20）以及控制驱动部件的驱动电路部件。 驱动电路部分包括连接到驱动部分的第一驱动电路板（31）以及连接到第一驱动电路板的第二驱动电路板（33），电路元件朝向模制框架安装在第一驱动电路板（31）上。 显示装置还包括用于连接第一驱动电路板和第二驱动电路板的柔性电路板（100）。

公开(公告)号：EP1866961A2

公开(公告)日：2007-12-19

申请号：EP06738702.7

申请日：2006-03-15

Applicant: Medconx, Inc.

Inventor： KENT, Harold, B. ,  LEVANTE, James, J. ,  FINE, Aaron, T. ,  LAYTON, Joseph, R.

IPC: H01L23/28

CPC classification number: H05K3/3494 ,  H01L23/13 ,  H01L24/02 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L24/85 ,  H01L2224/04042 ,  H01L2224/45015 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/19043 ,  H01R43/0256 ,  H05K1/116 ,  H05K1/184 ,  H05K3/3405 ,  H05K3/3442 ,  H05K3/3447 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/09845 ,  H05K2201/10446 ,  H05K2201/10636 ,  H05K2203/0195 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2924/2075 ,  H01L2924/00014 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/00015

Abstract: A micro solder pot includes a dielectric substrate having at least one hole formed therein, a conductive coating coupled to the interior of the hole, and at least one heat transfer pad spaced from the hole in thermal communication with the conductive coating of the hole. When the heat transfer pad is exposed to a heat source, the conductive coating inside the hole is heated. The micro solder pot may also include a thermally activated conductive material disposed within the hole. When the heat transfer pad is exposed to a heat source, the thermally activated conductive material becomes liquidus such that a component can be inserted into the liquidus material. When the heat source is removed, the thermally activated conductive material cools to couple the component to the conductive coating in the hole.

公开(公告)号：EP1470744A2

公开(公告)日：2004-10-27

申请号：EP02806761.9

申请日：2002-10-09

Applicant: MOLEX INCORPORATED

Inventor： MCGRATH, James, L. ,  CAPADONA, James, P. ,  MCGOWAN, Daniel, B. ,  PANELLA, Augusto, P.

IPC: H05K1/02

CPC classification number: H05K1/117 ,  H01R12/721 ,  H01R13/6585 ,  H05K1/0219 ,  H05K2201/093 ,  H05K2201/0949 ,  H05K2201/0969 ,  H05K2201/09709 ,  H05K2201/09727

Abstract: Circuit boards to which such high speed differential signal connectors are mounted are disclosed and they have a particular pattern of termination traces, commonly taking the form of plated vias extending through the circuit board. These vias are arranged in a triangular pattern and the ground reference plane of the circuit board is provided with voids, one void being associated and encompassing a pair of the differential signal vias of a single terminal triplet. This reduces the capacitance of the signal vias and thereby increases the impedance of the circuit board within the launch area to lessen impedance discontinuities in the connector-circuit board interface.

公开(公告)号：EP1342292A1

公开(公告)日：2003-09-10

申请号：EP01964215.6

申请日：2001-08-20

Applicant: DI/DT, Inc.

Inventor： ROY, Apurba ,  BRKOVIC, Milivoje, Slobodan

IPC: H01R9/09 ,  H05K1/14 ,  H05K3/34

CPC classification number: H01R43/0256 ,  H01R12/52 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/0949 ,  H05K2201/09954 ,  H05K2201/10303 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A circuit module (11) is provided with a plurality of dual capacity connector pads (13), each pad holding a miniature surface mount connector (15) and/or a connection pin (17). The preferred I-channel surface mount connector is sufficiently small that the module can be connected by either surface mount connector (15) or pin (17) to the same region of the circuit module.

公开(公告)号：EP0970522A1

公开(公告)日：2000-01-12

申请号：EP98964132.9

申请日：1998-12-18

Applicant: MOLEX INCORPORATED

Inventor： NODA, Atsuhito ,  OKANO, Masato ,  FUJII, Hiroyuki

IPC: H01L23/498 ,  H05K3/34

CPC classification number: H05K1/0212 ,  G01R1/07307 ,  G01R31/2886 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/141 ,  H05K1/167 ,  H05K3/3436 ,  H05K3/3494 ,  H05K2201/049 ,  H05K2201/09263 ,  H05K2201/0949 ,  H05K2201/09772 ,  H05K2201/10378 ,  H05K2203/1115 ,  H05K2203/162 ,  Y02P70/613

Abstract: An improved connector assembly (1) particularly useful for testing semiconductor devices of ball grid array ('BGA') structure (10) with a plurality of solder balls (11) formed on the surface thereof. The balls (11) are placed into contact with opposing conductive portions (3a) of the connector assembly. A heat generating member (7), such as a wire, is disposed proximate to the connector assembly conductive portions (3a) and may be selectively energized to generate heat to partially melt the solder balls (11). Reliable connections are effected in this manner.

公开(公告)号：EP2341583B1

公开(公告)日：2017-05-31

申请号：EP09821841.5

申请日：2009-04-24

Applicant: Asahi Denka Kenkyusho Co., Ltd.

Inventor： MIZOGUCHI, Masanori

IPC: H01R12/52 ,  H01R12/71 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05K3/326 ,  H01R12/718 ,  H05K1/118 ,  H05K1/147 ,  H05K3/306 ,  H05K3/363 ,  H05K3/365 ,  H05K2201/0367 ,  H05K2201/091 ,  H05K2201/0949 ,  H05K2201/10378 ,  H05K2201/1059

公开(公告)号：EP2726925A4

公开(公告)日：2015-05-20

申请号：EP12803948

申请日：2012-06-27

Applicant: FINISAR CORP

Inventor： ZHAO YAN YANG ,  HUEBNER BERND ,  DU TENGDA ,  LEE YUHENG

IPC: G02B6/38 ,  G02B6/42 ,  G02B6/46 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: G02B6/4279 ,  G01J1/0425 ,  G02B6/4246 ,  G02B6/428 ,  G02B6/4292 ,  H05K1/0219 ,  H05K1/0224 ,  H05K1/0243 ,  H05K1/0274 ,  H05K1/0284 ,  H05K1/0298 ,  H05K1/115 ,  H05K1/117 ,  H05K1/147 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/09672 ,  H05K2201/10121

Abstract: Multichannel RF Feedthroughs. In some examples, a multichannel RF feedthrough includes an internal portion and an external portion. The internal portion includes a top surface on which first and second sets of traces are formed. Each set of traces is configured as an electrical communication channel to carry electrical data signals. The external portion includes a bottom surface on which the first set of traces is formed and a top surface on which the second set of traces is formed. A set of vias connects the first set of traces between the top surface of the internal portion and the bottom surface of the external portion.