公开(公告)号：EP0768813B1

公开(公告)日：2004-01-02

申请号：EP96402167.9

申请日：1996-10-11

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Tsuji, Hitoshi ,  Nishi, Koji

IPC: H05K1/02

CPC classification number: H05K1/0265 ,  H05K1/0206 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09572 ,  H05K2201/09672 ,  H05K2201/09781 ,  H05K2201/0979 ,  Y10S428/901 ,  Y10T428/24917

公开(公告)号：EP0941021A1

公开(公告)日：1999-09-08

申请号：EP98500066.0

申请日：1998-03-06

Applicant: Easy Hole International, Ltd.

Inventor： Llongueras Arola, Juan

IPC: H05K3/42

CPC classification number: H05K3/428 ,  H05K3/3452 ,  H05K3/3468 ,  H05K2201/09572 ,  H05K2203/044

Abstract: Starting from the base material of a board (1) that has each of its two faces surfaced with copper coating (2), the circuit is defined by means of the partial elimination of the copper by chemical etching. Following this, the punching of the unit is undertaken in order to obtain the bore holes (5) through which the electrical connection between the two faces of the circuit will be preformed. This connection is performed by means of a chemical metallizing in which a metal layer (8) from a nickel-phosphorous base alloy is applied to the holes (5) and to the area surrounding them, leaving the board, after the application of a solder mask, identification ink and conductive inks, in a condition to pass under the soldering jet, which will fill the metallized bore holes (5) with a tin/lead mass.

Abstract translation: 从一个板（1）的基体材料开始并具有其两个面中的浮现与铜涂层（2），该电路是由通过化学蚀刻铜的部分消除的方式来定义。 在此之后，该单元的冲孔下采取，以便获得钻孔（5），通过该电路的两个面之间的电连接将被预先形成。 该连接通过在其中由镍 - 磷基合金的金属层（8）被施加到所述通孔的化学金属化的装置（5）和所述区域围绕它们，留下板，焊料的应用之后执行的 掩模，识别油墨和导电油墨，在条件中焊接射流下方通过的，而这些填充金属化钻孔（5）配有一个锡/铅的质量。

公开(公告)号：EP0376100A3

公开(公告)日：1991-07-31

申请号：EP89123316.5

申请日：1989-12-16

Applicant: Alcatel SEL Aktiengesellschaft

Inventor： Heidemann, Rolf, Dr. ,  Schlag, Erwin

IPC: H01L23/373 ,  H01L23/538

CPC classification number: H01L23/66 ,  H01L23/3677 ,  H01L24/48 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0206 ,  H05K1/0207 ,  H05K1/0231 ,  H05K1/0243 ,  H05K3/341 ,  H05K3/429 ,  H05K3/4611 ,  H05K2201/09572 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099

Abstract: Bekannt sind Leiterplatten, bei denen die Bauelemente durch eine federnde Montageplatte befestigt sind. Die Montageplatte dient außerdem als Strompfad und als Kühlblech. Für Hochfrequenzanwendungen ist eine solche Befestigung von Bauelementen nicht geeignet. Das Problem der Erfindung ist, Hochgeschwindigkeitschips (für Frequenzen über 1 GHz) die aufgrund der für solche hohen Frequenzen zu erfüllenden Anforderungen in kleine Mikrowellengehäuse eingebaut sind, so auf einer Platine zu montieren, daß ein mikrowellengerechter Anschluß und die erforderliche Wärmeabfuhr aus dem Bauelement mit einfachen Mitteln zu erreichen ist. Grundgedanke der Lösung ist, die metallische Grundfläche des Chip-Gehäuses (2) über Durchkontaktierungen mit den metallischen Schichten der als Multilayerplatine ausgebildeten Leiterplatte (1) zu verbinden. Dazu wird die Leiterplatte (1) mit durchgehenden Bohrungen (21) versehen, die in einer auf der Leiterplatte (1) angeordneten Montagefläche (20) münden und die in der Leiterplatte enthaltene flächige Leiterbahnen (13, 14) berühren. Der Gehäuseboden (4) wird auf die Montagefläche (20) aufgesetzt und die Bohrungen (21) mit einem schmelzflüssigen Lot gefüllt. Dadurch wird das Gehäuse (2) thermisch und elektrisch leitend mit den flächigen Leiterbahnen (13, 14) verbunden.

公开(公告)号：EP0059337B1

公开(公告)日：1986-08-13

申请号：EP82100843.0

申请日：1982-02-05

Applicant: International Business Machines Corporation

Inventor： Ecker, Mario Enrique ,  Olson, Leonard Theodore

IPC: H01L23/50 ,  H01L21/60 ,  H05K3/30

CPC classification number: H05K3/303 ,  H01L21/486 ,  H01L23/4985 ,  H01L23/5384 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/16152 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10659 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10727 ,  H05K2201/10878 ,  H05K2201/2036 ,  H05K2203/043 ,  Y02P70/613

公开(公告)号：EP0159771A3

公开(公告)日：1986-01-15

申请号：EP85300887

申请日：1985-02-11

Applicant: W.C. Heraeus GmbH

Inventor： Reynolds, Quentin Michael

IPC: H01C17/28 ,  H01C13/02 ,  H01C17/24

CPC classification number: H05K3/3442 ,  H01C1/144 ,  H01C17/006 ,  H01C17/242 ,  H01C17/28 ,  H05K2201/09181 ,  H05K2201/09572 ,  H05K2201/10636 ,  H05K2201/10984 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A method of forming chip resistors in which a resistive coating is applied to an insulating substrate which is subsequently divided up into single chip components includes the steps of providing end terminations forthe individual chip resistors before the sheet is divided up. This is achieved by forming a hole 13 in the substrate 11 at the position of each end termination and then coating the holes with an electrically conductive material 14 which electrically connects with the adjacent region of the resistive coating 12. In order to improve the solderability and the reliability of the end terminations the holes 13 may be filled with solder 15. The electrical value of the resistive element coating may then be adjusted to a precise value by trimming away some of the resistive element material with a laser. Finally, the substrate is divided up into the single chip resistor components.

公开(公告)号：EP0159771A2

公开(公告)日：1985-10-30

申请号：EP85300887.8

申请日：1985-02-11

Applicant: W.C. Heraeus GmbH

Inventor： Reynolds, Quentin Michael

IPC: H01C17/28 ,  H01C13/02 ,  H01C17/24

CPC classification number: H05K3/3442 ,  H01C1/144 ,  H01C17/006 ,  H01C17/242 ,  H01C17/28 ,  H05K2201/09181 ,  H05K2201/09572 ,  H05K2201/10636 ,  H05K2201/10984 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49099 ,  Y10T29/49101 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A method of forming chip resistors in which a resistive coating is applied to an insulating substrate which is subsequently divided up into single chip components includes the steps of providing end terminations forthe individual chip resistors before the sheet is divided up. This is achieved by forming a hole 13 in the substrate 11 at the position of each end termination and then coating the holes with an electrically conductive material 14 which electrically connects with the adjacent region of the resistive coating 12. In order to improve the solderability and the reliability of the end terminations the holes 13 may be filled with solder 15. The electrical value of the resistive element coating may then be adjusted to a precise value by trimming away some of the resistive element material with a laser. Finally, the substrate is divided up into the single chip resistor components.

公开(公告)号：EP0059337A3

公开(公告)日：1983-08-17

申请号：EP82100843

申请日：1982-02-05

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： ECKER, MARIO ENRIQUE ,  OLSON, LEONARD THEODORE

IPC: H01L23/32 ,  H01L21/48 ,  H01L23/12 ,  H01L23/498 ,  H01L23/52 ,  H01L23/538 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K3/30 ,  H05K3/34 ,  H05K3/36 ,  H01L23/50 ,  H01L21/60

CPC classification number: H05K3/303 ,  H01L21/486 ,  H01L23/4985 ,  H01L23/5384 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/16152 ,  H05K1/0206 ,  H05K1/113 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3452 ,  H05K3/3457 ,  H05K3/363 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09572 ,  H05K2201/10659 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10727 ,  H05K2201/10878 ,  H05K2201/2036 ,  H05K2203/043 ,  Y02P70/613

公开(公告)号：EP2883430A4

公开(公告)日：2016-05-11

申请号：EP12882879

申请日：2012-08-10

Applicant: ERICSSON TELEFON AB L M

Inventor： PEREZ-URIA IGOR ,  FERM PER ,  GUSTAFSON BENNY

IPC: H05K3/40

CPC classification number: H05K1/144 ,  H05K1/115 ,  H05K1/141 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3436 ,  H05K3/3494 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/4053 ,  H05K3/42 ,  H05K2201/0248 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2201/09572 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10878 ,  H05K2201/10916 ,  H05K2203/0338 ,  H05K2203/0455 ,  H05K2203/1105 ,  Y10T29/49124

公开(公告)号：EP1903839B1

公开(公告)日：2016-04-20

申请号：EP07018384.3

申请日：2007-09-19

Applicant: Sumitomo Wiring Systems, Ltd.

Inventor： Sugimura, Yoshiaki

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0206 ,  H05K3/341 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/10689 ,  H05K2201/10969 ,  H05K2203/043 ,  H05K2203/0455 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49144

公开(公告)号：EP1864326B1

公开(公告)日：2012-11-14

申请号：EP06725523.2

申请日：2006-04-03

Applicant: 3D Plus

Inventor： VAL, Christian

IPC: H01L23/498 ,  H05K3/34 ,  H01L25/16

CPC classification number: H01L23/4985 ,  H01L23/3114 ,  H01L23/49816 ,  H01L23/5387 ,  H01L25/105 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2924/0002 ,  H01L2924/19041 ,  H05K1/116 ,  H05K1/189 ,  H05K3/3436 ,  H05K2201/09572 ,  H05K2201/09663 ,  H05K2203/041 ,  H05K2203/0455 ,  Y02P70/613 ,  H01L2924/00