公开(公告)号：EP1102338A4

公开(公告)日：2004-09-08

申请号：EP99919606

申请日：1999-05-17

Applicant: TYCO ELECTRONICS RAYCHEM KK

Inventor： SATO TAKASHI ,  MIYASAKA NAOFUMI ,  HASUNUMA TAKASHI

IPC: H01C1/14 ,  H01M2/34 ,  H01M6/50 ,  H01M10/42 ,  H01M10/48 ,  H05K1/16 ,  H05K3/34

CPC classification number: H01M2/348 ,  H01C1/1406 ,  H01M10/4257 ,  H01M10/48 ,  H01M2200/10 ,  H01M2200/106 ,  H05K1/167 ,  H05K3/3442 ,  H05K2201/10643 ,  Y02P70/613

Abstract: A PTC device formed integrally on a PCB substrate, such a PCB substrate, a secondary battery protection circuit device comprising such PCB substrate provided with a circuit to control the voltage and current of secondary batteries, and a secondary battery assembly provided with said device. A PCB substrate 1 is provided with an electronic component 2 and a PTC device 3. The PTC device 3 has a construction having a PTC material 6 in the centre, which is provided with foils 71, 72 made of nickel foil on its top and bottom; an outlet electrode 4 is provided on the foil 71, and an outlet electrode 5, provided on the PCB substrate, is soldered below.

公开(公告)号：EP0917197A2

公开(公告)日：1999-05-19

申请号：EP98121227.7

申请日：1998-11-06

Applicant: NEC CORPORATION

Inventor： Furuya, Mitsuru ,  Myohga, Osamu ,  Okada, Yoshitsugu

IPC: H01L23/14

CPC classification number: H05K1/184 ,  H01L23/66 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/086 ,  H05K2201/10416 ,  H05K2201/10643 ,  H01L2924/00

Abstract: Holes are formed in a ceramic substrate before sintering, magnetic parts and dielectric parts are fitted in the holes and the substrate is sintered at a temperature equal to or lower than the sintering temperature of the magnetic parts. It is possible to obtain a very compact high frequency integrated circuit, particularly, a micro wave integrated circuit which can be utilized in a frequency band of several tens GHz, by using hard ferrite as a material of the magnetic parts and magnetizing them after the sintering.

Abstract translation: 在烧结之前，在陶瓷基板中形成孔，将磁性部件和电介质部件装配在孔中，并且将基板在等于或低于磁性部件的烧结温度的温度下烧结。 可以通过使用硬质铁氧体作为磁性部件的材料并且在烧结之后对它们进行磁化来获得非常紧凑的高频集成电路，特别是可以在几十GHz的频带中使用的微波集成电路 。

公开(公告)号：EP0811993A2

公开(公告)日：1997-12-10

申请号：EP97202527.4

申请日：1993-07-08

Applicant: RAYCHEM CORPORATION

Inventor： Graves, Gregory A. ,  Zhang, Michael ,  Chandler, Daniel ,  Chang, Chi-Ming ,  Fang, Shou-Mean

IPC: H01C1/14 ,  H05K1/18

CPC classification number: H01C7/005 ,  H01C1/14 ,  H01C1/1406 ,  H01C7/027 ,  H05K1/184 ,  H05K3/0097 ,  H05K3/3442 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/09954 ,  H05K2201/10022 ,  H05K2201/10469 ,  H05K2201/10643 ,  H05K2201/10666 ,  Y02P70/613

Abstract: An electrical device which comprises first and second laminar electrodes and a laminar PTC resistive element sandwiched between them, the device comprising

(a) a main portion which comprises a main part of the first electrode, a main part of the second electrode, and a main part of the resistive element; and
(b) a first connection leg which extends away from the main portion and which comprises a first leg part of the first electrode which is integral with the main part of the first electrode, and a first leg part of the resistive element which is integral with the main part of the resistive element.
Such devices can be secured to circuit boards in a variety of ways, and to elastically deformed terminals.

Abstract translation: 一种电气装置，包括第一和第二层状电极和夹在它们之间的层状PTC电阻元件，该装置包括（a）主要部分，其包括第一电极的主要部分，第二电极的主要部分和主体部分 电阻元件的一部分; 和（b）第一连接腿，其远离主要部分延伸并且包括与第一电极的主要部分成一体的第一电极的第一腿部和电阻元件的第一腿部， 与电阻元件的主要部分。 这样的装置可以以各种方式固定到电路板，并且可以弹性变形的端子。

公开(公告)号：EP0303272A2

公开(公告)日：1989-02-15

申请号：EP88113075.1

申请日：1988-08-11

Applicant: SIEMENS AKTIENGESELLSCHAFT

Inventor： Wehnelt, Ulrich, Dipl.-Phys.

IPC: H01L33/00 ,  H05K3/34 ,  H01L25/04

CPC classification number: H05K3/3442 ,  H01L23/4985 ,  H01L25/0753 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/183 ,  H05K1/184 ,  H05K1/189 ,  H05K3/326 ,  H05K2201/0129 ,  H05K2201/09036 ,  H05K2201/091 ,  H05K2201/10106 ,  H05K2201/10454 ,  H05K2201/1059 ,  H05K2201/10643 ,  H05K2203/1105 ,  H05K2203/1189 ,  Y02P70/613 ,  H01L2924/00

Abstract: Es soll eine einfache automatisierbare und wärmestabile Halb­leiterkontaktierung für lineare und flächige SMD-Bauteile, ins­besondere LED-Anordnungen verwirklicht werden. Hierzu werden auf eine mit Leiterbahnen beschichtete Trägerfolie SMD-Bauteile auf­gesetzt, wobei die Leiterbahnen zur einfacheren Kontaktierung durch Aufschmelzen entweder ganz oder teilweise aus lötbarem Material bestehen.

Abstract translation: 要实现用于线性和面积型SMD组件，特别是LED布置的简单的可自动化和热稳定的半导体接触。 为此，SMD组件放置在涂有导体轨道的载体箔上，导体轨迹全部或部分由可焊接材料组成，以通过熔化更简单地建立接触。

公开(公告)号：EP0005265A3

公开(公告)日：1979-11-28

申请号：EP79101335

申请日：1979-05-02

Applicant: Siemens Aktiengesellschaft

Inventor： Schade, Reinhart

IPC: H05K03/00 ,  H05K03/30 ,  H01L41/04

CPC classification number: H01L24/33 ,  H01L24/83 ,  H01L41/29 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/07802 ,  H05K3/202 ,  H05K3/305 ,  H05K3/325 ,  H05K2201/0382 ,  H05K2201/10287 ,  H05K2201/10643 ,  H05K2201/10977 ,  H05K2203/1189 ,  Y02P70/613 ,  Y10T156/1039 ,  H01L2924/3512 ,  H01L2924/00

公开(公告)号：US20160181480A1

公开(公告)日：2016-06-23

申请号：US14988537

申请日：2016-01-05

Applicant: Bridgelux, Inc.

Inventor： Brian Cumpston

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/64 ,  H01L25/16 ,  H01L33/56

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L25/165 ,  H01L25/167 ,  H01L33/20 ,  H01L33/507 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/184 ,  H05K2201/10106 ,  H05K2201/10643 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an expensive reflective aluminum substrate. The LED packaging device includes a highly reflective substrate disposed in a hole in a printed circuit board. The substrate has a reflectivity greater than 97% and includes an insulating layer and a reflective layer disposed above a thicker aluminum layer. An LED die is disposed on the top surface of the substrate. The PCB has a layer of glass fiber in resin and a metal layer. The lower surface of the PCB and the bottom surface of the substrate are substantially coplanar. The metal layer of the PCB is electrically coupled to the LED die only through bond wires. Electronic circuitry is disposed on the upper surface of the PCB and is used to control light emitted from the LED die.

Abstract translation: 用于封装LED裸片的低成本设备提供了优异的反射率和导热性，而不用昂贵的反射铝基板覆盖LED照明器的整个表面。 LED封装装置包括设置在印刷电路板的孔中的高反射性基板。 基板的反射率大于97％，并且包括设置在较厚铝层上方的绝缘层和反射层。 LED芯片设置在基板的顶表面上。 PCB具有树脂中的玻璃纤维层和金属层。 PCB的下表面和衬底的底表面基本上共面。 PCB的金属层仅通过接合线电耦合到LED管芯。 电子电路设置在PCB的上表面上，用于控制从LED管芯发出的光。

公开(公告)号：US09252337B1

公开(公告)日：2016-02-02

申请号：US14579937

申请日：2014-12-22

Applicant: Bridgelux, Inc.

Inventor： Brian Cumpston

IPC: H01L27/15 ,  H01L29/88 ,  H01L33/48 ,  H01L33/50 ,  H01L33/64 ,  H01L33/56 ,  H01L33/62 ,  H01L33/60 ,  H01L25/16 ,  H05K1/18 ,  H05K1/02 ,  H01L33/58 ,  H01L33/20

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L25/165 ,  H01L25/167 ,  H01L33/20 ,  H01L33/507 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49107 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/181 ,  H05K1/0274 ,  H05K1/184 ,  H05K2201/10106 ,  H05K2201/10643 ,  H05K2203/049 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A low-cost device for packaging LED dies provides superior reflectivity and thermal conductivity without covering entire surfaces of an LED luminaire with an expensive reflective aluminum substrate. The LED packaging device includes a highly reflective substrate disposed in a hole in a printed circuit board. The substrate has a reflectivity greater than 97% and includes an insulating layer and a reflective layer disposed above a thicker aluminum layer. An LED die is disposed on the top surface of the substrate. The PCB has a layer of glass fiber in resin and a metal layer. The lower surface of the PCB and the bottom surface of the substrate are substantially coplanar. The metal layer of the PCB is electrically coupled to the LED die only through bond wires. Electronic circuitry is disposed on the upper surface of the PCB and is used to control light emitted from the LED die.

Abstract translation: 用于封装LED裸片的低成本设备提供了优异的反射率和导热性，而不用昂贵的反射铝基板覆盖LED照明器的整个表面。 LED封装装置包括设置在印刷电路板的孔中的高反射性基板。 基板的反射率大于97％，并且包括设置在较厚铝层上方的绝缘层和反射层。 LED芯片设置在基板的顶表面上。 PCB具有树脂中的玻璃纤维层和金属层。 PCB的下表面和衬底的底表面基本上共面。 PCB的金属层仅通过接合线电耦合到LED管芯。 电子电路设置在PCB的上表面上，用于控制从LED管芯发出的光。

公开(公告)号：US08324727B2

公开(公告)日：2012-12-04

申请号：US12720110

申请日：2010-03-09

Applicant: Joseph C. Fjelstad ,  Kevin P. Grundy ,  Para K. Segaram ,  William F. Wiedemann ,  Thomas J. Obenhuber ,  Inessa Obenhuber, legal representative

Inventor： Joseph C. Fjelstad ,  Kevin P. Grundy ,  Para K. Segaram ,  William F. Wiedemann ,  Thomas J. Obenhuber

IPC: H01L23/34

CPC classification number: H01C7/003 ,  H01C13/02 ,  H01G4/33 ,  H01L23/49816 ,  H01L23/49822 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48235 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/0246 ,  H05K1/186 ,  H05K3/4602 ,  H05K2201/09536 ,  H05K2201/10643 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Disclosed are low profile discrete electronic component structures that are suitable for placement and use in a vertical interconnection mode either within an electronic interconnection substrate, between interconnection substrate and electronic component or within an IC package.

Abstract translation: 公开了适用于在电子互连衬底内，互连衬底和电子部件之间或IC封装内的垂直互连模式下放置和使用的薄型离散电子部件结构。

公开(公告)号：US20120039053A1

公开(公告)日：2012-02-16

申请号：US13283655

申请日：2011-10-28

Applicant: David S. Slaton ,  David L. McDonald ,  Shreenath S. Perlaguri

Inventor： David S. Slaton ,  David L. McDonald ,  Shreenath S. Perlaguri

IPC: H05K5/00 ,  H05K1/11 ,  H05K7/00 ,  H05K3/30

CPC classification number: H01R13/2442 ,  H01M2/1044 ,  H05K1/182 ,  H05K3/301 ,  H05K2201/10037 ,  H05K2201/10325 ,  H05K2201/10454 ,  H05K2201/10643 ,  Y10T29/49108 ,  Y10T29/4913 ,  Y10T29/49153 ,  Y10T29/49174 ,  Y10T29/49176 ,  Y10T29/49204

Abstract: A method for coupling a battery within an embedded system is described. The method includes creating a hole extending through a printed circuit board (PCB), inserting a portion of the battery into the hole, and electrically coupling the battery to at least one contact.

Abstract translation: 描述了一种用于在嵌入式系统内耦合电池的方法。 该方法包括创建延伸穿过印刷电路板（PCB）的孔，将电池的一部分插入到孔中，以及将电池电耦合到至少一个触点。

公开(公告)号：US20110180312A1

公开(公告)日：2011-07-28

申请号：US13064541

申请日：2011-03-30

Applicant: Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

Inventor： Han Kim ,  Je-Gwang Yoo ,  Mi-Ja Han ,  Dae-Hyun Park

IPC: H05K1/18

CPC classification number: H05K1/0231 ,  H01L2224/16225 ,  H05K1/0236 ,  H05K1/165 ,  H05K1/185 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/10636 ,  H05K2201/10643 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: A printed circuit board having an embedded chip capacitor includes a first conductive layer; a second conductive layer, placed away from the first conductive layer; a chip capacitor, having a first electrode connected to the first conductive layer through being seated in a cavity formed between the first conductive layer and the second conductive layer; a filled material, filled in a space excluding a space occupied by the chip capacitor in the cavity; and a via, penetrating the filled material and connecting the second conductive layer to the second electrode of the chip capacitor.

Abstract translation: 具有嵌入式芯片电容器的印刷电路板包括：第一导电层; 远离所述第一导电层放置的第二导电层; 芯片电容器，其具有通过位于形成在第一导电层和第二导电层之间的空腔中而连接到第一导电层的第一电极; 填充材料，填充在空腔内不包括由片状电容器占据的空间的空间中; 以及通孔，穿透填充材料并将第二导电层连接到片式电容器的第二电极。