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    ELECTRICAL ASSEMBLY WITH COMPLIANT PINS FOR HEAT DISSIPATION
    112.
    发明申请
    ELECTRICAL ASSEMBLY WITH COMPLIANT PINS FOR HEAT DISSIPATION 审中-公开
    具有用于散热的合适引脚的电气组件

    公开(公告)号：WO2013148001A1

    公开(公告)日：2013-10-03

    申请号：PCT/US2013/025082

    申请日：2013-02-07

    Applicant: DEERE & COMPANY

    Inventor： DUPPONG, Jeffrey, S.

    IPC: H01R12/00

    CPC classification number: H05K1/0204 ,  H05K1/0206 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/10303

    Abstract: An electrical assembly (11) comprises a substrate (49) having a dielectric layer (45) and one or more electrically conductive traces (46, 48) overlying the dielectric layer (45). An electrical component (44) is mounted on a first side (146) of the substrate (49). The electrical component (44) is capable of generating heat. A plurality of conductive through holes (47) in the substrate (49) are located around a perimeter of the electrical component (44). The conductive through holes (47) are connected to a conductive trace (46 or 48) for heat dissipation. A cooling cavity (26) has bores (28) that face a second side of the substrate opposite the first side. A plurality of respective compliant pins (32) are inserted into corresponding conductive through holes (47) and the bores (28), wherein a generally exposed portion of the compliant pin (32) is exposed to air or a coolant liquid within the cooling cavity (26).

    Abstract translation: 电气组件（11）包括具有介电层（45）和覆盖在电介质层（45）上的一个或多个导电迹线（46,48）的衬底（49）。 电气部件（44）安装在基板（49）的第一侧（146）上。 电气部件（44）能够产生热量。 基板（49）中的多个导电通孔（47）位于电气部件（44）的周边周围。 导电通孔（47）连接到用于散热的导电迹线（46或48）。 冷却腔（26）具有面对基板的与第一侧相对的第二侧的孔（28）。 多个相应的柔性销（32）插入对应的导电通孔（47）和孔（28）中，其中柔性销（32）的大体暴露部分暴露于空气或冷却腔内的冷却剂液体 （26）。

    THERMAL MANAGEMENT SYSTEM FOR ELECTRICAL COMPONENTS AND METHOD OF PRODUCING SAME
    113.
    发明申请
    THERMAL MANAGEMENT SYSTEM FOR ELECTRICAL COMPONENTS AND METHOD OF PRODUCING SAME 审中-公开
    电气部件的热管理系统及其生产方法

    公开(公告)号：WO2011097462A2

    公开(公告)日：2011-08-11

    申请号：PCT/US2011/023724

    申请日：2011-02-04

    Applicant: KODADEK, III, Robert, E.

    Inventor： KODADEK, III, Robert, E.

    IPC: H05K7/20 ,  H01L33/64

    CPC classification number: F21V29/67 ,  F21V29/02 ,  F21V29/673 ,  F21Y2115/10 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/0272 ,  H05K2201/064 ,  H05K2201/066 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10545

    Abstract: A thermal management system for an electrical component includes a printed circuit board (PCB) capable of receiving the electrical component on a first side of the PCB. An elongate member has one end attached to a second side of the PCB, and another end disposed away from the PCB. The elongate member also has an open interior that facilitates fluid communication between the two ends. One of the ends defines an at least partially closed boundary on the PCB. The PCB includes an aperture disposed therethrough proximate the boundary such that fluid communication is facilitated between the first side of the PCB and the second side of the PCB, and along at least a portion of the elongate member.

    Abstract translation: 用于电气部件的热管理系统包括能够接收PCB的第一侧上的电气部件的印刷电路板（PCB）。 细长构件具有连接到PCB的第二侧的一端，以及远离PCB设置的另一端。 细长构件还具有有利于两端之间的流体连通的开放内部。 端部中的一个限定了PCB上的至少部分闭合的边界。 PCB包括邻近边界设置穿过的孔，使得在PCB的第一侧和PCB的第二侧之间以及沿着细长构件的至少一部分便于流体连通。

    ENCAPSULATED MULTI-PHASE ELECTRONICS HEAT SINK
    114.
    发明申请
    ENCAPSULATED MULTI-PHASE ELECTRONICS HEAT SINK 审中-公开
    封装多相电子散热器

    公开(公告)号：WO2007145741A2

    公开(公告)日：2007-12-21

    申请号：PCT/US2007011088

    申请日：2007-05-08

    Applicant: BOEING CO ,  MINDOCK ERIC S ,  SCOTT JOHN R

    Inventor： MINDOCK ERIC S ,  SCOTT JOHN R

    CPC classification number: H05K1/0203 ,  H01L23/427 ,  H01L2924/0002 ,  H05K2201/064 ,  H05K2201/10371 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/083 ,  H01L2924/00

    Abstract: An apparatus and method for cooling electronics is disclosed- An encapsulated inert non- conductive fluid is used to transfer heat directly from an electrical circuit including a die on a substrate to an external heatsink. The top of a flip chip die (e.g. a ceramic column grid array flip chip) may be enclosed with a metallic cover. The metallic cover is sealed to an outer frame, which in turn is sealed to metallization on the top of the flip chip through a flexure, minimizing mechanical load imparted to the flip chip. This forms a hermetic cavity enclosing the die. This hermetic cavity is partially filled with an inert non conductive fluid, which vaporizes when heated. Condensation occurs on the inner surface of the metal cover where the heat may be conducted into the outer frame for removal (e.g. rejection from the spacecraft).

    Abstract translation: 公开了用于冷却电子器件的装置和方法 - 封装的惰性非导电流体用于将热量直接从包括基板上的管芯的电路传递到外部散热器。 倒装晶片管芯的顶部（例如，陶瓷柱栅格阵列倒装芯片）可以用金属盖封装。 金属盖被密封到外框架上，外框架通过挠曲件而被密封到倒装芯片的顶部上的金属化，从而使施加到倒装芯片的机械载荷最小化。 这形成封闭模具的密封腔。 该密封腔部分地填充有惰性非导电流体，其在加热时蒸发。 在金属盖的内表面上发生冷凝，其中热量可以传导到外框架中以便移除（例如从航天器排出）。

    WIRE-PRINTED CIRCUIT BOARD OR CARD COMPRISING CONDUCTORS WITH A RECTANGULAR OR SQUARE CROSS-SECTION
    115.
    发明申请
    WIRE-PRINTED CIRCUIT BOARD OR CARD COMPRISING CONDUCTORS WITH A RECTANGULAR OR SQUARE CROSS-SECTION 审中-公开
    WIRE DESCRIBED PCB或电路板带有引线的矩形或正方形截面

    公开(公告)号：WO2006077163A3

    公开(公告)日：2007-02-15

    申请号：PCT/EP2006000612

    申请日：2006-01-24

    Applicant: JUMA PCB GMBH ,  WOELFEL MARKUS

    Inventor： WOELFEL MARKUS

    IPC: H05K1/02 ,  H05K3/10 ,  H05K3/22

    CPC classification number: H05K3/103 ,  H05K1/0272 ,  H05K3/222 ,  H05K2201/064 ,  H05K2201/098 ,  H05K2201/10257 ,  H05K2201/1028 ,  H05K2201/10287

    Abstract: The invention relates to a wire-printed circuit board or card (1) comprising conductors (6) that run on and/or in the circuit board or card between connection points (4). The aim of the invention is to improve a circuit board of this type. To achieve this, at least one of the conductors (6) has a rectangular or square cross-section. In addition, at least some of the conductors have a hollow cross-section, in which a coolant or heating agent circulates.

    Abstract translation: 本发明涉及的线描述的印刷电路板或板（1）上和/或在连接点之间的印刷电路板或卡（4）延伸的线（6）。 为了改善这样的电路板，它提供了引线（6）中的至少一个具有矩形或正方形横截面。 还可以设想的是，至少一些引线的中空横截面，其中autweisen的循环的冷却剂或加热装置。

    SPECIFIC MICROSIEVE, SPECIFIC COMPOSITE BODY
    118.
    发明申请
    SPECIFIC MICROSIEVE, SPECIFIC COMPOSITE BODY 审中-公开
    特殊微结构，特殊复合体

    公开(公告)号：WO1992015408A1

    公开(公告)日：1992-09-17

    申请号：PCT/CH1992000035

    申请日：1992-02-21

    Applicant: DYCONEX PATENTE AG HEINZE & CO ,  SCHMIDT, Walter ,  MARTINELLI, Marco ,  FREI, Alexandra

    Inventor： DYCONEX PATENTE AG HEINZE & CO

    IPC: B07B01/46

    CPC classification number: B07B1/4618 ,  B01D39/1692 ,  B01D67/0034 ,  B01D69/12 ,  B01D2323/345 ,  B07B1/4663 ,  G02B6/122 ,  G02B6/4228 ,  G02B6/423 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0041 ,  H05K3/42 ,  H05K2201/0166 ,  H05K2201/0394 ,  H05K2201/064 ,  H05K2201/09509 ,  H05K2203/0554

    Abstract: In order to produce a specific microsieve having a large number of precisely arranged passages of whatever form, a plastic foil (1) is coated with a layer of etch-resistant material (2, 2'). Recesses (4, 4') are etched in this layer (2, 2') at the locations where passages are to be formed. In a further process step, the passages (5) are produced by a plasma etching process. In addition, ducts (K, L) are inserted into the coating layer (2, 2') either as channels (K) or as solid paths. Several microsieves (S1, S2) are superimposed to form a specific composite body, oriented in such a way that the ducts (5, K, L) are cross-linked in the x, y and z directions. Examples of applications are fluid-conducting diaphragms, electroconductive multilayers and cross-linked light-guide microsystems.

    Abstract translation: 为了生产具有任何形式的大量精确布置的通道的特定微量筛，塑料箔（1）涂覆有一层抗蚀材料（2,2'）。 在要形成通道的位置，在该层（2,2'）中蚀刻凹槽（4,4'）。 在另外的工艺步骤中，通过等离子体蚀刻工艺制造通道（5）。 此外，管道（K，L）作为通道（K）或固体路径插入到涂层（2,2'）中。 叠加几个微通道（S1，S2）以形成一个特定的复合体，以使得管道（5，K，L）在x，y和z方向上交联的方式定向。 应用实例是导流隔膜，导电多层和交联光导微系统。

    LIQUID COOLED METAL CORE PRINTED CIRCUIT BOARD
    120.
    发明公开
    LIQUID COOLED METAL CORE PRINTED CIRCUIT BOARD 审中-公开
    液体冷却金属芯印刷电路板

    公开(公告)号：EP3195711A1

    公开(公告)日：2017-07-26

    申请号：EP15842904.3

    申请日：2015-09-15

    Applicant: D'Onofrio, Nicholas, Michael

    Inventor： D'Onofrio, Nicholas, Michael

    IPC: H05K7/20

    CPC classification number: H05K7/20218 ,  H05K1/0209 ,  H05K1/05 ,  H05K3/0061 ,  H05K2201/064 ,  H05K2201/10409 ,  H05K2201/10969

    Abstract: The present disclosure further contemplates a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board. In one example the present disclosure contemplates a direct liquid cooled MCPCB system that may include a liquid cavity creating component coupled to the base plate of a MCPCB allowing a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB. The direct liquid cooled MCPCB system may minimize thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems.

    Abstract translation: 本公开还设想一种系统和方法，其通过循环液体冷却剂来冷却金属芯印刷电路板，以使其接触金属芯印刷电路板的基底金属。 在一个示例中，本公开设想了一种直接液体冷却的MCPCB系统，其可以包括耦合到MCPCB的基板的液体腔产生部件，其允许液体冷却剂与MCPCB的基板接触以冷却MCPCB。 直接液体冷却的MCPCB系统可以使电气部件和冷却液之间的热瓶颈最小化，同时减少以前的液体冷却电子系统中所需的部件的数量。

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