公开(公告)号：EP0692137B1

公开(公告)日：2002-04-10

申请号：EP95907808.0

申请日：1995-01-26

Applicant: LOCTITE (IRELAND) LIMITED

Inventor： McARDLE, Ciaran, Bernard ,  BURKE, Joseph

IPC: H01F1/44 ,  H01R4/04

CPC classification number: H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R4/04 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347 ,  H01L2924/00

Abstract: The invention provides a composition (3) comprising: (i) a ferrofluid comprising a colloidal suspension (4) of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles (5) having substantially uniform sizes and shapes, dispersed in the ferrofluid. Various types of substantially non-magnetic electrically-conductive particles (5) are described. Application of a substantially uniform magnetic field by magnet means (8) to the composition (3) causes the electrically-conductive particles (5) to form a regular pattern (9). The composition is used for providing anisotropic conductive pathways (9a, 9b) between two sets of conductors (2a, 2b; 7a, 7b) in the electronics industry. The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles. The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

公开(公告)号：EP1051265A1

公开(公告)日：2000-11-15

申请号：EP99905459.6

申请日：1999-01-29

Applicant: LOCTITE CORPORATION

Inventor： MCARDLE, Ciaran, B. ,  BARNES, Rory, B.

IPC: B05D1/36 ,  B05D3/02 ,  B05D5/12 ,  B05D7/00 ,  B32B5/16 ,  B32B9/00 ,  B32B15/04 ,  B32B27/00 ,  B32B27/06 ,  B32B27/08 ,  B32B27/38 ,  B32B31/00 ,  C08F2/46 ,  C08F2/48 ,  H01F1/00

CPC classification number: B05D3/207 ,  B05D3/067 ,  B05D7/00 ,  C23C24/08 ,  C23C24/10 ,  C23C26/00 ,  C23C26/02 ,  H01F41/16 ,  H01F41/18 ,  H01F41/34 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/0425 ,  H05K2203/104

Abstract: The present invention provides a variety of interrelated methods of coating non-random and ordered arrays of particles, as well as films containing such arrays. The present invention also relates to the coated non-random and ordered arrays of particles and films prepared therefrom. The coated non-random and ordered arrays are obtained by the use of ferrofluid compositions which may be curable. The arrays and films may contain electrically-conductive particles useful in electronic applications for effecting contact between conductors.

公开(公告)号：EP0687137A3

公开(公告)日：1996-09-11

申请号：EP95303635.7

申请日：1995-05-30

Applicant: AT&T Corp.

Inventor： Jin, Sungho ,  McCormack, Mark Thomas

IPC: H05K3/34 ,  B23K35/02

CPC classification number: B23K35/0222 ,  B23K35/0227 ,  B23K35/0244 ,  H01L2924/0002 ,  H05K3/3436 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0235 ,  H05K2203/0769 ,  H05K2203/104 ,  Y02P70/613 ,  H01L2924/00

Abstract: Electronic devices having at least two components (53,55) with mating contact pads (52,54) are provided with high-aspect-ratio solder joints between the mating pads. These joints are formed by placing a composite solder medium (51) containing solder wires (56) in an electrically insulating matrix (57) such that at least two solder wires (56) are in contact with the mating pads (52,54), and fusing the wires (56) to the pads. The insulating matrix (57) with remainder of solder wires (56) is then optionally removed from between the said at least two components (53,55). The composite solder medium (51) is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to their diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.

公开(公告)号：EP0492492A3

公开(公告)日：1993-02-03

申请号：EP91121924.4

申请日：1991-12-20

Applicant: THE WHITAKER CORPORATION

Inventor： Henschen, Homer, Ernst ,  McKee, Michael, John ,  Pawlikowski, Joseph, Michael ,  Schaeffer, Richard, Lloyd ,  Scholz, James, Paul ,  Shaffer, David, Todd ,  Sharpe, Alexander, Michael

IPC: H01R43/02

CPC classification number: H01R43/02 ,  B23K3/0475 ,  H01R43/0242 ,  H01R43/16 ,  H05K1/0212 ,  H05K3/3494 ,  H05K2201/083 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10924 ,  H05K2203/107 ,  H05K2203/1115

Abstract: A connector (10) having one or more arrays of elongate cantilever beam arms (22) of contacts can have contact sections (26) on free ends thereof soldered to respective traces of a circuit element, by securing a lead frame (50) to the free ends which includes a corresponding plurality of fingers (56) extending from a carrier strip (52). On the finger ends are affixed preforms of solder; on the carrier strip (52) is defined a thin magnetic layer, transforming the brass carrier strip into a Curie point heater. When the carrier strip is subjected to RF current, it generates thermal energy which melts the solder preforms to join the fingers first to the contact sections (26) of the connector contacts, and in a remote location later subjected to RF current to reflow the solder preform to join contact sections (26) to the circuit element traces.

公开(公告)号：EP0206619B1

公开(公告)日：1993-01-20

申请号：EP86304393.1

申请日：1986-06-09

Applicant: METCAL INC.

Inventor： Kent, Harold B.

IPC: H05K3/34 ,  H01R9/07 ,  H05K1/02

CPC classification number: H05K3/363 ,  H05K1/0212 ,  H05K1/0242 ,  H05K3/28 ,  H05K3/3494 ,  H05K3/36 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/083 ,  H05K2201/10727 ,  H05K2203/1115 ,  H05K2203/1581

公开(公告)号：EP0492492A2

公开(公告)日：1992-07-01

申请号：EP91121924.4

申请日：1991-12-20

Applicant: THE WHITAKER CORPORATION

Inventor： Henschen, Homer, Ernst ,  McKee, Michael, John ,  Pawlikowski, Joseph, Michael ,  Schaeffer, Richard, Lloyd ,  Scholz, James, Paul ,  Shaffer, David, Todd ,  Sharpe, Alexander, Michael

IPC: H01R43/02

CPC classification number: H01R43/02 ,  B23K3/0475 ,  H01R43/0242 ,  H01R43/16 ,  H05K1/0212 ,  H05K3/3494 ,  H05K2201/083 ,  H05K2201/09709 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/10446 ,  H05K2201/10924 ,  H05K2203/107 ,  H05K2203/1115

Abstract: A connector (10) having one or more arrays of elongate cantilever beam arms (22) of contacts can have contact sections (26) on free ends thereof soldered to respective traces of a circuit element, by securing a lead frame (50) to the free ends which includes a corresponding plurality of fingers (56) extending from a carrier strip (52). On the finger ends are affixed preforms of solder; on the carrier strip (52) is defined a thin magnetic layer, transforming the brass carrier strip into a Curie point heater. When the carrier strip is subjected to RF current, it generates thermal energy which melts the solder preforms to join the fingers first to the contact sections (26) of the connector contacts, and in a remote location later subjected to RF current to reflow the solder preform to join contact sections (26) to the circuit element traces.

Abstract translation: 具有在其焊接到respectivement一个电路元件的痕迹的自由端接触的细长悬臂梁臂（22）的一个或多个阵列可以具有接触部分（26）的连接器（10），由固定的引线框（50）连接到 其自由端包括从载体带（52）延伸的指状物（56）的对应的多个。 在手指端部的焊料预型件贴; 在载体带（52）被定义的薄磁性层，将所述黄铜载条到居里点加热器。 当载体带材经受RF电流，它产生理事会热能熔化焊料预型件，首先加入的手指与连接器接触的接触部分（26），并在以后进行的RF电流的远程位置以回流焊料 预制品加入接触部分（26）连接到电路元件的痕迹。

公开(公告)号：EP0371646A1

公开(公告)日：1990-06-06

申请号：EP89311663.2

申请日：1989-11-10

Applicant: THE WHITAKER CORPORATION

Inventor： Henschen, Homer Ernst ,  McKee, Michael John ,  Pawlikowski, Joseph Michael

IPC: B23K3/04 ,  H05B3/12 ,  H01R43/02

CPC classification number: H05K1/0212 ,  B23K3/0475 ,  H01R43/0242 ,  H05B3/12 ,  H05K1/0242 ,  H05K1/117 ,  H05K3/244 ,  H05K3/3494 ,  H05K3/363 ,  H05K3/4015 ,  H05K2201/083 ,  H05K2201/1028 ,  H05K2201/10924 ,  H05K2203/1115

Abstract: Spaced contact pads (23) on a printed circuit board (19) are soldered to respective spaced contacts (21) in a cable or connector assembly by means of respective spaced connecting members (15) interposed between contacts (21) to be soldered. The connecting members (15) are typically electrically and thermally conductive finger-like projections formed as part of a heater body (10) and are readily severable from the heater body (10) after soldering to thereby remain part of the final solder connection. A prescribed amount of fusible material (e.g., solder) is pre-deposited on the connecting members (15) or contacts (21) and is melted when the heater is actuated. The heater body (10) may be a self-regulating heater in the form of a copper substrate (11) having a thin surface layer (13) of magnetically permeable, high resistance alloy. An alternating current of constant amplitude and high frequency is passed through the heater body (10) and is concentrated in the surface layer at temperatures below the surface layer Curie temperature. At higher temperatures the current is distributed through the lower resistance substrate (11) to limit further heating. During the time interval required for the surface layer to reach its Curie temperature, the resistive power dissipation creates sufficient thermal energy to melt the pre-deposited solder. The connecting members (15) are positioned and configured as necessary to reach their respective connection sites.

Abstract translation: 印刷电路板（19）上的间隔接触焊盘（23）通过介于待焊接的触头（21）之间的相应间隔开的连接构件（15）焊接到电缆或连接器组件中的相应间隔的触点（21）。 连接构件（15）通常是导电和导热的指状突起，其形成为加热器主体（10）的一部分，并且在焊接之后容易地与加热器主体（10）分离，从而保持部分最终焊接连接。 预定量的可熔材料（例如焊料）预先沉积在连接构件（15）或触点（21）上，并在加热器被致动时熔化。 加热器主体（10）可以是具有透磁性高电阻合金薄表面层（13）的铜基板（11）形式的自调节加热器。 恒定振幅和高频的交流电流通过加热器主体（10），并且在低于表面层居里温度的温度下集中在表面层中。 在较高的温度下，电流分布通过下电阻衬底（11）以限制进一步的加热。 在表面层达到居里温度所需的时间间隔期间，电阻耗散产生足够的热能来熔化预沉积的焊料。 连接构件（15）根据需要定位和配置以到达它们各自的连接位置。

公开(公告)号：EP0206620A3

公开(公告)日：1988-06-22

申请号：EP86304394

申请日：1986-06-09

Applicant: METCAL INC.

Inventor： Krumme, John F. ,  Cowell, Mark J.

IPC: H02G05/02 ,  H01R43/02

CPC classification number: H02G5/02 ,  H01R43/02 ,  H01R43/0242 ,  H05K1/0212 ,  H05K1/0242 ,  H05K3/3421 ,  H05K3/3494 ,  H05K2201/083 ,  H05K2201/10272 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2203/104 ,  H05K2203/1115

Abstract: A self-heating and self-soldering bus bar for use in many applications. The pins of the bus bar are quickly and directly heated to a predetermined autoregulated temperature without significantly raising the temperature of the body of the bus. Thusly a bus bar may be mounted while maintaining thermal balance and mechanical integrity of all wotk pieces. The present invention avoids the problems normally associated with excess thermal expansion experienced when a bus bar is heated incidental to the heating of its contact points. A majority of this incidental heating is eliminated by direct quick heating of the mounting pins.

公开(公告)号：KR1020170065603A

公开(公告)日：2017-06-13

申请号：KR1020177011626

申请日：2015-10-01

Applicant: 로저스코포레이션

Inventor： 펜스,크리스티 ,  스프렌탈,칼 ,  세추마다반,무랄리

IPC: H05K1/02 ,  H05K1/03 ,  H01F1/055 ,  H01F1/34 ,  H01F1/36 ,  H01F1/37 ,  H01F10/28 ,  H01Q1/38 ,  H01Q1/48

CPC classification number: H01Q1/38 ,  H01F1/0551 ,  H01F1/344 ,  H01F1/37 ,  H01F10/205 ,  H01F10/28 ,  H01Q1/48 ,  H01Q15/004 ,  H05K1/024 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/083 ,  H01F1/36

Abstract: 자기유전기판은제 1 유전층, 상기제 1 유전층으로부터이격된제 2 유전층및 상기제 1 유전층및 상기제 2 유전층의사이에및 이들에밀착하여배치된하나이상의자성보강층을포함한다.

Abstract translation: 磁性介电基板包括第一介电层，与第一介电层间隔开的第二介电层以及设置在第一介电层与第二介电层之间且紧密接触的至少一个磁性加强层。

公开(公告)号：KR101611815B1

公开(公告)日：2016-04-12

申请号：KR1020147026065

申请日：2013-02-28

Applicant: 가부시키가이샤 니혼 마이크로닉스

Inventor： 이노우에,타쯔오 ,  수가이,타카야스 ,  쿠도,토시유키 ,  오모리,토시노리

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K1/0298 ,  H05K1/0233 ,  H05K1/0242 ,  H05K1/025 ,  H05K1/09 ,  H05K3/46 ,  H05K2201/0154 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/0776 ,  H05K2201/0792 ,  H05K2201/083 ,  Y10T29/49155

Abstract: 본발명은, 특성임피던스의조정이용이하고협피치화에도대응가능한다층배선기판과그 제조방법및 프로브카드를제공하는것을과제로하고, 기판위에복수의배선층이절연층을끼우고적층되어있는다층배선기판에있어서, 상기배선층에형성되는배선이제1층과제2층으로이루어지는 2층구조의배선이고, 상기제1층이제1 도전성재료로구성되고, 상기제2층이상기제1 도전성재료보다도비투자율이큰 제2 도전성재료로구성되어있고, 상기 2층구조로함으로써, 상기 2층구조의배선과동일한두께의배선을상기제1 도전성재료만으로구성한경우보다도, 상기배선의특성임피던스가 50옴에가까운값으로조정되어있는다층배선기판과그 제조방법및 프로브카드를제공함으로써그 과제를해결한다.

Abstract translation: 多层布线基板包括层叠在基板上的布线层，每层之间具有绝缘层。 形成在布线层中的导线由第一层和第二层构成，以形成双层结构。 第一层由第一导电材料制成，第二层由具有10以上且大于第一导电材料的相对导磁率的第二导电材料制成。 电线的特性阻抗被调节到比具有与双层结构的导线相同厚度的导线的接近50欧姆的值，并且仅由第一导电材料制成。