公开(公告)号：US5328752A

公开(公告)日：1994-07-12

申请号：US948334

申请日：1992-09-21

Applicant: Keita Miyazato

Inventor： Keita Miyazato

IPC: B29C67/00 ,  G03F7/00 ,  H05K3/00 ,  B32B9/00

CPC classification number: B29C67/007 ,  G03F7/0035 ,  G03F7/0037 ,  H05K3/0023 ,  H05K2201/0195 ,  H05K2201/09836 ,  Y10S428/901 ,  Y10T428/24917

Abstract: The instant invention discloses a process for producing a substrate for use in printed circuit which comprises: a vessel for containing a photo-curable resin; a masking means positioned above and in close proximity to the resin surface; a planar light for irradiating through the mask a thin layer of the photo-curable resin, means for moving the thin-layered cured product in the vertical direction, means for coating additional uncured resin on the cured product and irradiating the same to form a newly formed thin-layered cured product thereon, and means for successively coating and forming additional thin-layers of cured products. The second aspect of this invention relates to a substrate for use in printed circuit boards produced by the above-mentioned process and apparatus.

Abstract translation: 本发明公开了一种制造用于印刷电路的基板的方法，该方法包括：用于容纳光固化树脂的容器; 位于树脂表面上方且紧邻树脂表面的掩蔽装置; 用于通过掩模照射光固化树脂的薄层的平面光，用于在垂直方向上移动薄层固化产物的装置，用于在固化产物上涂覆另外的未固化树脂并将其照射以形成新的 在其上形成的薄层固化产物，以及用于连续地涂覆和形成附加的固化产物薄层的装置。 本发明的第二方面涉及一种用于通过上述方法和装置制造的印刷电路板的基板。

公开(公告)号：EP2566298A4

公开(公告)日：2015-12-16

申请号：EP11775043

申请日：2011-04-27

Applicant: LUMIOTEC INC

Inventor： KAGOTANI AKIHITO ,  ARISAWA MAKOTO ,  KAMADA HIDEKI

IPC: H05B33/06 ,  B32B17/10 ,  F21V29/74 ,  H01L51/52 ,  H05B33/04 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36

CPC classification number: H05B33/06 ,  B32B17/10036 ,  B32B17/10541 ,  F21V29/74 ,  F21V29/89 ,  F21Y2105/00 ,  F21Y2115/20 ,  H01L51/5203 ,  H01L51/524 ,  H01L51/5253 ,  H01L51/529 ,  H01L2251/5361 ,  H05B33/02 ,  H05B33/04 ,  H05K1/14 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/041 ,  H05K2201/09027 ,  H05K2201/09836 ,  H05K2201/10128

Abstract: Disclosed is an organic EL illumination device-which is provided with: an organic EL element (13) on a glass substrate (10); and a plurality of anode terminal electrodes (11) and cathode terminal electrodes (12) for evenly supplying current to the aforementioned organic EL element (13) on the aforementioned glass substrate (10)-wherein the organic EL illumination device is provided with a wiring board (1) to which a circuit having anode wiring (1a) corresponding to the position of each of the aforementioned anode terminal electrodes (11), and a circuit having cathode wiring (1b) corresponding to the position of each of the aforementioned cathode terminal electrodes (12) are formed.

公开(公告)号：EP2763514A1

公开(公告)日：2014-08-06

申请号：EP14166887.1

申请日：2010-12-24

Applicant: Fujikura Ltd.

Inventor： Yamamoto, Satoshi ,  Suzuki, Takanao ,  Matsuyama, Masami

IPC: H05K1/11 ,  H01L23/12 ,  H05K3/40

CPC classification number: H05K3/0029 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/115 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09827 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2203/025 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method of manufacturing an interposer substrate that is provided with a planar substrate, and with a through hole interconnection that is formed by filling a through hole that connects together a first main surface and a second main surface of the substrate with a conductor. The through hole has a first aperture portion in the first main surface, and has a second aperture portion in the second main surface. The through hole is formed by irradiating the area of the substrate with laser light, so that when the through hole is viewed in a vertical cross-sectional view of the substrate, the through hole has a trapezoidal shape. The side faces of the trapezoid are not parallel to each other and are both inclined towards the same side.

Abstract translation: 一种制造具有平面基板的内插基板的制造方法，其特征在于，具有通过用导体填充将所述基板的第一主面与所述第二主面连接在一起的通孔而形成的贯通孔互连。 通孔在第一主表面具有第一开口部分，并且在第二主表面中具有第二开口部分。 通孔是通过用激光照射基板的区域而形成的，使得当在基板的垂直截面图中观察通孔时，通孔具有梯形形状。 梯形的侧面彼此不平行，并且朝向同一侧倾斜。

公开(公告)号：EP2298048B1

公开(公告)日：2014-03-19

申请号：EP09772960.2

申请日：2009-06-23

Applicant: Koninklijke Philips N.V.

Inventor： ELZINGA, Marcus, J., G.

IPC: H05K3/34 ,  H01L33/48

CPC classification number: H01L33/486 ,  F21K9/00 ,  F21Y2115/10 ,  H01L2924/0002 ,  H05K3/3494 ,  H05K2201/09063 ,  H05K2201/09754 ,  H05K2201/09836 ,  H05K2201/10106 ,  H05K2201/10962 ,  H05K2203/107 ,  H01L2924/00

公开(公告)号：EP2628065A1

公开(公告)日：2013-08-21

申请号：EP10778850.7

申请日：2010-10-13

Applicant: Sony Ericsson Mobile Communications AB

Inventor： MORÄN, Jonas ,  KLEVERMAN, Mats

IPC: G06F3/02 ,  H03K17/96 ,  H05K3/42

CPC classification number: G06F3/0202 ,  H03K17/9645 ,  H05K1/0275 ,  H05K1/053 ,  H05K1/115 ,  H05K1/116 ,  H05K1/162 ,  H05K1/167 ,  H05K3/0026 ,  H05K3/4015 ,  H05K3/4046 ,  H05K3/445 ,  H05K2201/0108 ,  H05K2201/0376 ,  H05K2201/09545 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/0999 ,  H05K2201/10121 ,  H05K2201/10151 ,  H05K2203/107

Abstract: An electronic device comprises a housing having an outer face and an inner face. A key is provided on the housing, which comprises a micro hole formed in the housing and a conductive material extending within the micro hole to the outer face of the housing. A sensor is coupled to the conductive material to detect whether an object is brought into contact or out of contact with the micro hole at the outer face.

Abstract translation: 一种电子设备，包括具有外表面和上内面的壳体。 一个关键的设置在外壳，它包括一个微孔在壳体和导电材料的微孔到所述外壳的外表面内延伸而形成上。 传感器被耦合到所述导电材料以检测被接触或不与在外表面上的微孔接触的是否为对象。

公开(公告)号：EP2426714A1

公开(公告)日：2012-03-07

申请号：EP10769514.0

申请日：2010-04-28

Applicant: Fujikura, Ltd.

Inventor： YAMAMOTO, Satoshi ,  HASHIMOTO, Hirokazu

IPC: H01L25/065 ,  H01L23/473 ,  H01L25/07 ,  H01L25/18 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/181 ,  H01L23/3128 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/06 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05555 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/1579 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0272 ,  H05K1/115 ,  H05K2201/09836 ,  H05K2201/10545 ,  Y02P70/611 ,  Y10T29/49124 ,  H01L2924/00

Abstract: A device mounting structure including: a interposer substrate that includes a substrate and a plurality of through-hole interconnection that are formed within a plurality of through holes that penetrate the substrate from a first principal surface that is one principal surface of the substrate to a second principal surface that is the other principal surface; a first device that includes a plurality of electrodes, with the electrodes arranged so as to face the first principal surface; and a second device that includes a plurality of electrodes whose arrangement is different from the arrangement of the electrodes of the first device, with the electrodes arranged so as to face the second principal surface, wherein each through-hole interconnection includes a first conductive portion that is provided at a position on the first principal surface corresponding to the electrode of the first device, and a second conductive portion that is provided at a position on the second principal surface corresponding to the electrode of the second device, each electrode of the first device is electrically connected with the first conductive portion, and each electrode of the second device is electrically connected with the second conductive portion.

Abstract translation: 1。一种器件安装结构，包括：中介层基板，其包括基板和多个通孔互连，所述多个通孔互连形成在多个通孔中，所述多个通孔从基板的一个主表面的第一主表面穿透到基板的第二表面 主表面是另一主表面; 第一装置，其包括多个电极，并且所述电极被布置成面向所述第一主表面; 以及第二器件，所述第二器件包括多个电极，所述多个电极的布置与所述第一器件的所述电极的布置不同，所述电极布置成面向所述第二主表面，其中每个所述通孔互连包括第一导电部分，所述第一导电部分 设置在与所述第一设备的电极对应的所述第一主面上的位置处，以及设置在所述第二主面上与所述第二设备的电极对应的位置处的第二导电部分，所述第一设备 与所述第一导电部分电连接，并且所述第二器件的每个电极与所述第二导电部分电连接。

公开(公告)号：EP2195830A2

公开(公告)日：2010-06-16

申请号：EP08807647.6

申请日：2008-09-12

Applicant: NXP B.V.

Inventor： WYLAND, Christopher

IPC: H01L21/48 ,  H01L23/538 ,  H01L23/473

CPC classification number: H05K3/00 ,  B33Y80/00 ,  H01L21/4846 ,  H01L23/473 ,  H01L23/5389 ,  H01L24/82 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2224/24227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01066 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/0237 ,  H05K1/185 ,  H05K3/0005 ,  H05K3/0082 ,  H05K3/1241 ,  H05K3/4644 ,  H05K3/4664 ,  H05K2201/09836 ,  Y02P80/30 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A method of implementing arbitrary structures to provide electrical interconnection and mechanical fixturing for integrated circuits is provided. According to exemplary embodiments of the invention said arbitrary structures are manufactured using three dimensional manufacturing processes employing only additive steps for all materials within the arbitrary structure. Accordingly the arbitrary structure is provided in a single step incorporating mechanical, electrical, and thermal elements as required by the design incorporating simultaneously dielectric and metallic materials. The arbitrary structures may be manufactured directly in association with the integrated circuits or separately for subsequent assembly to the integrated circuits. Arbitrary structures ranging from a fraction of to all of the structural and electrical elements required for packaging the integrated circuit(s) being provided by the arbitrary structures according to the design boundary established.

Abstract translation: 提供实现任意结构来提供电互连和机械固定用于集成电路的方法。 。根据本发明的示例性实施例所述的任意结构使用三维制造工艺仅采用对于任意结构之内的所有材料添加剂步骤制造。 因此，任意的结构在单个步骤中所要求的设计掺入同时电介质和金属材料结合的机械，电气和热元件提供。 任意结构可以直接在协会组件继集成电路制造用的集成电路或单独。 通过gemäß既定设计边界任意结构设置范围从几分之一到所有用于封装集成电路（多个）所需的结构和电气元件的任意结构。

公开(公告)号：EP1894277A1

公开(公告)日：2008-03-05

申请号：EP06785328.3

申请日：2006-06-22

Applicant: 3M Innovative Properties Company

Inventor： MEREDITH, Kevin R., 3M Center ,  BARR, Alexander W., 3M Center ,  FELDMAN, Steven, 3M Center

IPC: H01R12/00 ,  H05K1/00

CPC classification number: H01R12/714 ,  H01R12/52 ,  H01R12/718 ,  H05K1/184 ,  H05K3/325 ,  H05K3/368 ,  H05K2201/09645 ,  H05K2201/09836 ,  H05K2201/10189 ,  H05K2201/1059

Abstract: An electrical interconnection system includes a printed circuit board having a receiving cavity therein. At least one circuit trace is located on a side wall of the cavity. An electrical connector is configured for insertion into the receiving cavity. The electrical connector has an electrical contact positioned to contact the at least one circuit trace when inserted into the receiving cavity.

公开(公告)号：EP0956538B1

公开(公告)日：2002-05-15

申请号：EP98908041.1

申请日：1998-02-02

Applicant: Giesecke & Devrient GmbH

Inventor： TARANTINO, Thomas ,  HAGHIRI-TEHRANI, Yahya

IPC: G06K19/077

CPC classification number: G06K19/0775 ,  G06K19/07749 ,  H05K1/0268 ,  H05K1/183 ,  H05K3/0044 ,  H05K3/28 ,  H05K3/305 ,  H05K3/321 ,  H05K3/4007 ,  H05K2201/09836 ,  H05K2203/0207 ,  H05K2203/0228

Abstract: The present invention pertains to a data medium in the form of a chipcard comprising the card body (1) fitted with an antenna (3), a chip module (2) containing an integrated circuit (10) and located in a recess (5) provided in the card body (1). The electric connection between the antenna (3) and the chip module (2) passes through lows (11) in the antenna (3) connections (4). When manufacturing the inventive data medium, a cavity (5) is engineered inside the body card (1) in which the antenna is at least partially embedded. The chip module (2) is placed into said cavity (5) and glued to the card body, for example with a thermoactivable glue (6), thereby establishing an electric connection between the chip module (2) and the antenna (3) inasmuch, for instance, as a conductive glue is used for anticipated application to the free antenna (3) connections (4). In the preferred embodiment the chip removal is carried out so as to form an oblique cutout.

公开(公告)号：EP0600051B1

公开(公告)日：1999-05-12

申请号：EP93909754.9

申请日：1993-06-09

Applicant: DYCONEX PATENTE AG

Inventor： SCHMIDT, Walter ,  MARTINELLI, Marco

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4655 ,  H05K1/0287 ,  H05K1/0289 ,  H05K1/0393 ,  H05K1/05 ,  H05K1/115 ,  H05K3/0041 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/0097 ,  H05K3/386 ,  H05K3/4084 ,  H05K3/42 ,  H05K3/427 ,  H05K3/429 ,  H05K3/4635 ,  H05K3/4641 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/066 ,  H05K2201/0909 ,  H05K2201/09327 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/09572 ,  H05K2201/09609 ,  H05K2201/09627 ,  H05K2201/09781 ,  H05K2201/09836 ,  H05K2201/09945 ,  H05K2201/10666 ,  H05K2203/0554 ,  H05K2203/0746 ,  H05K2203/1184 ,  H05K2203/1545 ,  H05K2203/1572 ,  Y10S428/901 ,  Y10T428/24917

Abstract: The initial intention in the semi-finished product of the invention is to provide a functional separation between the requirement for mechanical strength and the previously concomitant requirement, for completing a circuit, in order to bring the pure circuit connection, especially for signals, 'closer' to the electrical and technical properties of chips. To do this, the layout miniaturisation is optimised without regard for the mechanical strength of the substrate. Instead of a printed circuit board (MCM), a semi-finished product which can be developed into a printed circuit board is made. The semi-finished product of the invention consists of an extremely thin film (8) with a plurality of extremely small holes (14) made simultaneously by an etching process. The hole diameters can be reduced by almost an order of magnitude (down to 20 νm), facilitating, for instance, definite sub-100 νm technology. Such a semi-finished product (19) does not act as a mechanical support but is designed only for signal conduction. The semi-finished product (19) which carries the densely packed wiring pattern, is bonded to a not densely packed power supply plane (22) acting as the service plane and the printed circuit board thus made is finally secured to a mechanical support (20).