公开(公告)号：EP1558064A4

公开(公告)日：2007-05-30

申请号：EP03809438

申请日：2003-09-26

Applicant: MATSUSHITA ELECTRIC WORKS LTD

Inventor： KUMAGAI JUN ,  KISHIMOTO AKIHIRO ,  KONISHI HIROFUMI

IPC: H02M1/00 ,  H02M1/42 ,  H02M7/5387 ,  H05B41/288 ,  H05K1/02 ,  H05K3/30 ,  H05K3/36 ,  H05B41/24 ,  F21V23/00 ,  H01F38/08 ,  H02M7/48 ,  H05B41/231 ,  H05K1/14

CPC classification number: H02M1/4208 ,  H02M7/53871 ,  H05B41/2883 ,  H05B41/2888 ,  H05K1/0254 ,  H05K3/301 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09063 ,  H05K2201/09645 ,  H05K2201/09972 ,  H05K2201/10196 ,  H05K2201/10204 ,  Y02B20/202 ,  Y02B20/204 ,  Y02B70/126

Abstract: A full bridge circuit composed of four switching elements (Q1 to Q4) is alternated with a high switching frequency and a series-connected resonance circuit (5) composed of an inductor (L2) and a capacitor (C2) is made to resonate for a switching frequency of the full bridge circuit multiplied by an integer (for example, frequency multiplied by three), thereby generating a high voltage pulse for start. After a high-pressure discharge lamp (DL) is started, the full bridge circuit is alternated with a low switching frequency so as to operate as a step-down chopper for inverting the output polarity, thereby stably supplying rectangular wave voltage of low frequency to the high-pressure discharge lamp (DL) via a filter circuit composed of an inductor (L1) and a capacitor (C1).

公开(公告)号：EP1653794A1

公开(公告)日：2006-05-03

申请号：EP05077405.8

申请日：2005-10-19

Applicant: Delphi Technologies, Inc.

Inventor： Sanftleben, Henry M. ,  Hutchins, Rebecca A. ,  Lawrence, Erin M. ,  Chandler, Brian Lee

IPC: H05K13/08 ,  H05K1/02 ,  G01N21/956 ,  G01R31/309 ,  G06T7/00

CPC classification number: G01N21/95684 ,  G01R31/2812 ,  G01R31/309 ,  G06T7/0008 ,  G06T7/001 ,  G06T2207/30152 ,  H05K1/0269 ,  H05K3/3484 ,  H05K2201/10204

Abstract: A technique (200) for optical inspection verification implements a number of steps. Initially, a simulated solder paste material, including a solder powder and an organic resin, is provided (202). Next, the simulated solder paste material is printed in a desired pattern on a base material (206) to provide a reference test board (101). Then, the test board (101) is cured to stabilize the simulated solder paste material. Next, the test board (101) is utilized to train the optical inspection system to reject defective product.

Abstract translation: 用于光学检查验证的技术（200）实现了许多步骤。 首先，提供包括焊料粉末和有机树脂的模拟焊膏材料（202）。 接下来，将模拟的焊膏材料以所需的图案印刷在基材（206）上，以提供参考测试板（101）。 然后，使测试板（101）固化以使模拟的焊膏材料稳定。 接下来，使用测试板（101）来训练光学检查系统以拒绝有缺陷的产品。

公开(公告)号：EP1182919A2

公开(公告)日：2002-02-27

申请号：EP01119985.8

申请日：2001-08-18

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Uchiyama, Hiroshi ,  Hachimura, Tetsutarou ,  Okuda, Osamu ,  Yoshida, noriaki

IPC: H05K13/08

CPC classification number: H05K3/0008 ,  H05K1/0269 ,  H05K3/303 ,  H05K13/08 ,  H05K2201/09918 ,  H05K2201/10204

Abstract: An offset measuring board is formed of a rectangular metal plate which can be positioned to a component mounting position by a positioning device and which has at least in proximity to one corner portion thereof a recognition through hole, as a recognition mark, having a black bottom face within a recessed portion.

Abstract translation: 孔，以抵消测量板上形成的矩形金属板，其可通过定位装置被定位成一个部件安装位置和其具有至少在靠近一个角部上通过的识别，作为识别标志，具有黑色底 面对的凹部内。

公开(公告)号：EP0989794A2

公开(公告)日：2000-03-29

申请号：EP99307258.6

申请日：1999-09-14

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Roy, Apurba

IPC: H05K7/20

CPC classification number: H05K7/20509 ,  H05K1/0209 ,  H05K3/341 ,  H05K2201/09781 ,  H05K2201/10204

Abstract: In accordance with the invention, a plurality of high thermal conductivity bodies are bonded to relatively hot spots of a component-populated substrate surface to provide thermal conduction from the surface to an overlying thermal plane. The high conductivity bodies can be configured for pick-and-place application and self-aligned in solder bonding. Receiving solder pads on the substrate facilitate low thermal resistance solder bonding and self-alignment. In a preferred embodiment the bodies are rectangular parallelpipeds with bifurcated bonding surfaces.

Abstract translation: 根据本发明，多个高导热体被结合到组分填充的衬底表面的相对热点上以提供从表面到上覆热平面的热传导。 高导电体可以配置用于拾取和放置应用，并在焊接中自对准。 接收衬底上的焊盘有助于低热阻焊接和自对准。 在优选实施例中，主体是具有分叉结合表面的矩形平行镊子。

公开(公告)号：EP2624673B1

公开(公告)日：2017-12-06

申请号：EP10857881.6

申请日：2010-10-01

Applicant: Meiko Electronics Co., Ltd.

Inventor： TODA, Mitsuaki ,  IMAMURA, Yoshio ,  HASEGAWA, Takuya

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/182 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/32 ,  H05K2201/09918 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.

公开(公告)号：EP2624673A4

公开(公告)日：2014-12-03

申请号：EP10857881

申请日：2010-10-01

Applicant: MEIKO ELECTRONICS CO LTD

Inventor： TODA MITSUAKI ,  IMAMURA YOSHIO ,  HASEGAWA TAKUYA

IPC: H05K1/18 ,  H05K1/02

CPC classification number: H05K1/182 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/32 ,  H05K2201/09918 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.

公开(公告)号：EP2624673A1

公开(公告)日：2013-08-07

申请号：EP10857881.6

申请日：2010-10-01

Applicant: Meiko Electronics Co., Ltd.

Inventor： TODA, Mitsuaki ,  IMAMURA, Yoshio ,  HASEGAWA, Takuya

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K1/182 ,  H05K1/0269 ,  H05K1/188 ,  H05K3/32 ,  H05K2201/09918 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T29/4913

Abstract: A component-embedded substrate includes an electrically insulating base (11) of resin, an electric or electronic embedded component (8) and a dummy embedded component (7) both embedded in the insulating base (11), a conductor pattern (18) formed on at least one side of the insulating base (11) and connected directly to or indirectly via a connection layer (6) to the embedded component (8) and the dummy embedded component (7), and a mark (10) formed on a surface of the dummy embedded component (7) and used as a reference when the conductor pattern (18) is formed, whereby positional accuracy of the conductor pattern (18) relative to the embedded component (8) can be improved.

Abstract translation: 甲元器件内置基板包括在电绝缘树脂的基体（11）电气或电子部件内置（8）和一个虚设嵌入式组件（7）两个埋设于绝缘基座（11），导体图案（18）而形成 在绝缘基体（11）的至少一侧，并且直接连接到地或间接地经由到嵌入式组件的连接层（6）（8）和形成在所述虚设部件嵌入式（7），和标记（10） 虚设嵌入式组件（7）的表面，并用作参考当导体图案（18）形成，由此，导体图案的位置精度（18）相对于所述嵌入式组件（8）可以得到改善。

公开(公告)号：EP2283717B1

公开(公告)日：2012-03-28

申请号：EP09757212.7

申请日：2009-05-28

Applicant: Sartorius Weighing Technology GmbH

Inventor： WEITEMEIER, Swen ,  OLDENDORF, Christian

IPC: H05K1/02 ,  G01R31/3163

CPC classification number: G01R31/2815 ,  G01R31/2839 ,  G06F21/86 ,  H05K1/0275 ,  H05K2201/10151 ,  H05K2201/10204

Abstract: The invention relates to an electronic device comprising a circuit board (10), with a set of input contacts (IN/COM), a set of output contacts (OUT/COM) and an electrical circuit (18) connected between the input contacts (IN/COM) and the output contacts (OUT/COM) and a controller. The invention is characterised in that the controller carries out a real-time test of the circuit board by means of a test signal introduced into the electrical circuit, the electrical circuit (18) being designed as a passive source-specific, or individual circuit board network with at least one element with a capacitive action, wherein the capacitive element is a conductor surface (221) forming a capacitor in the assembled state with a corresponding conductor surface (222' '), on the device, connected to the electrical circuit (18) by means of a contact element in the assembled state, such that the capacitive value of the element with a capacitive action in the assembled state is different from the capacitive value thereof in the disassembled state.

公开(公告)号：EP2280593A1

公开(公告)日：2011-02-02

申请号：EP10171258.6

申请日：2010-07-29

Applicant: Rockwell Automation Technologies, Inc.

Inventor： Peterson, Corey A.

IPC: H05K3/34

CPC classification number: H05K3/3489 ,  B23K3/082 ,  H05K2201/10204 ,  H05K2203/0169 ,  H05K2203/162

Abstract: A fluxometer system and method is provided. The fluxometer comprises a frame, a simulated circuit board disposed in the frame and having a plurality of holes formed therein extending generally transverse to a plane of the board and a cover. The cover is received on the frame over the simulated circuit board and includes several protrusions simulating leads that extend into the holes of the simulated circuit board. The fluxometer further includes an indicator sheet disposed between the simulated circuit board and the cover, the protrusions extending through the indicator sheet.

Abstract translation: 提供了流量计系统和方法。 流量计包括框架，设置在框架中的模拟电路板，并且具有形成在其中的多个孔，其大致横向于板的平面和盖。 覆盖物被接收在模拟电路板上的框架上，并且包括模拟延伸到模拟电路板的孔中的引线的几个突起。 流量计还包括设置在模拟电路板和盖之间的指示片，突出部延伸穿过指示片。

公开(公告)号：EP2276329A1

公开(公告)日：2011-01-19

申请号：EP09165670.2

申请日：2009-07-16

Applicant: ABB Research Ltd.

Inventor： Coppola, Luisa ,  Fabbri, Matteo ,  Schmidt, Roland ,  Cottet, Didier

IPC: H05K1/02

CPC classification number: H05K1/0209 ,  H05K2201/066 ,  H05K2201/09736 ,  H05K2201/09781 ,  H05K2201/10204

Abstract: The invention relates to an electronic circuit board comprising at least one conductor path (6, 6') and at least one component (3) which is one of an electronic component, electric component and heat emitting component and which is connected to said conductor path (6, 6'). At least one thermal capacitor (4) is thermally connected to said conductor (6) in vicinity to said at least one component (3), wherein the at least one thermal capacitor (4) is suitable for transmitting and/or buffering thermal energy of the at least one component.

Abstract translation: 本发明涉及一种电子电路板，其包括至少一个导体路径（6,6'）和至少一个组件（3），该组件（3）是电子部件，电气部件和发热部件之一，并且连接到所述导体路径 （6,6'）。 至少一个热电容器（4）在所述至少一个部件（3）附近热连接到所述导体（6），其中所述至少一个热电容器（4）适于传输和/或缓冲 该至少一个部件。