公开(公告)号：EP1687114A4

公开(公告)日：2008-10-29

申请号：EP04781932

申请日：2004-08-23

Applicant: MOTOROLA INC

Inventor： WEIGLER WILLIAM C ,  BABULA ROBERT ,  HERBOLD JAMES E ,  GALL THOMAS P ,  SHARKEY STEVEN G

IPC: B23K1/00 ,  B23K1/018 ,  H01L21/48 ,  H05K3/34 ,  H05K3/42 ,  H05K13/04

CPC classification number: H05K3/3457 ,  B23K1/018 ,  B23K2201/42 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/11334 ,  H01L2224/13025 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/0101 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H05K3/42 ,  H05K2201/10204 ,  H05K2203/046 ,  H01L2224/29099 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A method for vertical removal of excess solder from a circuit substrate includes the use of a sacrificial circuit substrate (60) with a plurality of pads and vias that are solder-wettable. The pads and vias of the sacrificial circuit substrate are placed (64) in vertical proximity to the excess solder of the circuit substrate. The excess solder is heated (66) until it is liquid, wherein the excess solder is wicked (68) vertically onto the pads and into the vias of the sacrificial circuit substrate. Thereafter, the sacrificial circuit substrate is lifted (70) from the proximity of the circuit substrate while the solder is in a liquid, taking the excess solder with it but leaving a predetermined amount on the circuit substrate.

公开(公告)号：EP1098368A4

公开(公告)日：2007-08-15

申请号：EP00915469

申请日：2000-04-11

Applicant: MATSUSHITA ELECTRIC IND CO LTD

Inventor： KIMURA SUZUSHI ,  HIMORI TSUYOSHI ,  HASHIMOTO KOJI

IPC: H01L23/538 ,  H01L25/16 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46 ,  H01L25/00 ,  H01L21/56 ,  H01L23/12 ,  H05K3/00

CPC classification number: H05K1/184 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4046 ,  H05K3/4602 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10204 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  H05K2203/161 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49172

Abstract: A module component in which chip parts are embedded in a circuit board and a method of manufacturing of the same. The module component can have desired circuit characteristics and functions stably even if the size of a part is miniaturized, is produced with high efficiency, and suitable for mechanical mounting. Since a desired circuit is formed by arranging a prescribed number of parts according to a prescribed rule, no heat treatment of embedded parts is required when making a module. Since each chip part has values conforming to the specifications, the circuit characteristic, functions and dimensional accuracy or the like can be stably obtained as designed. Since the chip parts are arranged according to the prescribed rule, insertion of the chip parts can be easily automated and speeded up, and miniaturization of the chip parts is coped with sufficiently. Moreover, the circuit structure can be changed flexibly and easily only by changing the insertion positions and types of chip parts.

公开(公告)号：EP1709675A1

公开(公告)日：2006-10-11

申请号：EP04809243.1

申请日：2004-12-21

Applicant: Agency for Science, Technology and Research ,  The National University of Singapore ,  GEORGIA TECH RESEARCH CORPORATION

Inventor： WONG, Ee, Hua ,  RAJOO, Ranjan ,  TEO, Poi, Siong

IPC: H01L21/60 ,  H05K3/34 ,  B23K1/00

CPC classification number: H01L24/11 ,  H01L2224/13099 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01054 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/0379 ,  H05K2201/10204 ,  H05K2203/0338 ,  H05K2203/0465 ,  Y02P70/613 ,  H01L2924/00

Abstract: We disclose a technique to generate stretched solder columns (bumps) at the wafer level, suitable for wafer level packaging. This is accomplished through use of using two wafers-the standard (functional) wafer that contains the integrated circuits and a master (dummy) wafer on whose surface is provided an array of solder bumps that is the mirror image of that on the functional wafer. After suitable alignment, both sets of solder bumps are melted and then slowly brought together till they merge. Then, as they cool, they are slowly pulled apart thereby stretching the merged solder columns. Once the latter have fully solidified, they are separated from the master wafer only.

Abstract translation: 我们公开了一种在晶圆级产生拉伸焊锡柱（凸块）的技术，适用于晶圆级封装。 这是通过使用两个晶圆来实现的 - 包含集成电路的标准（功能）晶圆和在其表面上提供焊料凸点阵列的主（假）晶圆，其是功能晶圆上镜像的镜像。 在适当的对准之后，两组焊料块被熔化，然后缓慢地放在一起直到它们合并。 然后，当它们冷却时，它们慢慢拉开，从而拉伸合并的焊锡柱。 一旦后者完全固化，它们只与主晶圆分离。

公开(公告)号：EP0989794A3

公开(公告)日：2000-11-15

申请号：EP99307258.6

申请日：1999-09-14

Applicant: LUCENT TECHNOLOGIES INC.

Inventor： Roy, Apurba

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20509 ,  H05K1/0209 ,  H05K3/341 ,  H05K2201/09781 ,  H05K2201/10204

Abstract: In accordance with the invention, a plurality of high thermal conductivity bodies are bonded to relatively hot spots of a component-populated substrate surface to provide thermal conduction from the surface to an overlying thermal plane. The high conductivity bodies can be configured for pick-and-place application and self-aligned in solder bonding. Receiving solder pads on the substrate facilitate low thermal resistance solder bonding and self-alignment. In a preferred embodiment the bodies are rectangular parallelpipeds with bifurcated bonding surfaces.

公开(公告)号：EP0990201A1

公开(公告)日：2000-04-05

申请号：EP98932790.3

申请日：1998-06-19

Applicant: ViA, Inc.

Inventor： CARROLL, David, W. ,  TRAVIS, Terry, L.

IPC: G06F1/00 ,  H05K1/14 ,  H05K5/00

CPC classification number: H05K1/028 ,  H05K2201/0133 ,  H05K2201/09109 ,  H05K2201/10204 ,  H05K2201/10598 ,  H05K2201/2027

Abstract: An assembly (5) and method for extending the durability and life span of flexible circuitry by limiting the bend radius of the flexible circuitry and distributing the flexure point about an extended portion of the circuitry. An assembly (5) comprises one or more flex limiting members (10, 20, 30, 40) associated with and integrated between the layers of flexible circuitry laminate. A fastener (60) is affixed to the flexible circuitry laminate, operatively coupling the one or more flex-limiting members (10, 20, 30, 40) in position adjacent the flexible circuitry laminate. The flex-limiting member (10, 20, 30, 40) limits flexure of the circuitry, during each individual bend, to or below a predetermined angle, thereby decreasing the rate of failure in the circuitry, for example via short circuit, as a result of repeated or excessive bending.

公开(公告)号：EP0391057A3

公开(公告)日：1992-04-15

申请号：EP90103424.9

申请日：1990-02-22

Applicant: MOTOROLA INC.

Inventor： Craft, Scott

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/373

CPC classification number: H05K1/0209 ,  H01L23/36 ,  H01L23/3731 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: Printed circuit board electronic assemblies (76) having improved thermal dissipation capabilities are obtained by adding electrically insulating but thermally conductive heat shunt components (80-85,90) to the circuit board (56) along with the regular electronic components (14-23). The heat shunt components (80-85,90) have a shape so that they may be placed on the printed circuit boards by the same assembly equipment used for the other electronic components (14-23). A typical heat shunt (80,90) component is a small parallelepiped of a highly thermally conducting electrically insulating dielectric (92), such as for example, alumina, beryllia, sapphire or aluminum nitride. It desirably has spaced-apart metal attachment lands (94,96) on one face (95) and an optional continuous metal layer (98) on the opposite face (97). In a typical application, one end (94) is soldered to the contact pad (66,68) where a power dissipating component (12) is also attached, and the other end (96) is soldered to a nearby ground lead (26′).

Abstract translation: 通过将电绝缘但导热的热分流组件（80-85,90）与常规电子部件（14-23）一起添加到电路板（56），获得具有改善的散热能力的印刷电路板电子组件（76） 。 热分流元件（80-85,90）具有这样的形状，使得它们可以通过与其它电子部件（14-23）相同的组装设备放置在印刷电路板上。 典型的热分流（80,90）组件是高导热电绝缘电介质（92）的小平行六面体，例如氧化铝，氧化铍，蓝宝石或氮化铝。 理想地，在相对面（97）上的一个面（95）和可选的连续金属层（98）上具有间隔开的金属附接平台（94,96）。 在典型的应用中，一端（94）被焊接到接触焊盘（66,68），其中功率消散部件（12）也被连接，另一端（96）被焊接到附近的接地引线（26分钟） ）。

公开(公告)号：EP0391057A2

公开(公告)日：1990-10-10

申请号：EP90103424.9

申请日：1990-02-22

Applicant: MOTOROLA INC.

Inventor： Craft, Scott

IPC: H05K7/20 ,  H01L23/36 ,  H01L23/373

CPC classification number: H05K1/0209 ,  H01L23/36 ,  H01L23/3731 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K7/20 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: Printed circuit board electronic assemblies (76) having improved thermal dissipation capabilities are obtained by adding electrically insulating but thermally conductive heat shunt components (80-85,90) to the circuit board (56) along with the regular electronic components (14-23). The heat shunt components (80-85,90) have a shape so that they may be placed on the printed circuit boards by the same assembly equipment used for the other electronic components (14-23).
A typical heat shunt (80,90) component is a small parallelepiped of a highly thermally conducting electrically insulating dielectric (92), such as for example, alumina, beryllia, sapphire or aluminum nitride. It desirably has spaced-apart metal attachment lands (94,96) on one face (95) and an optional continuous metal layer (98) on the opposite face (97).
In a typical application, one end (94) is soldered to the contact pad (66,68) where a power dissipating component (12) is also attached, and the other end (96) is soldered to a nearby ground lead (26′).

Abstract translation: 通过将电绝缘但导热的热分流组件（80-85,90）与常规电子部件（14-23）一起添加到电路板（56），获得具有改善的散热能力的印刷电路板电子组件（76） 。 热分流元件（80-85,90）具有这样的形状，使得它们可以通过与其它电子部件（14-23）相同的组装设备放置在印刷电路板上。 典型的热分流（80,90）组件是高导热电绝缘电介质（92）的小平行六面体，例如氧化铝，氧化铍，蓝宝石或氮化铝。 理想地，在相对面（97）上的一个面（95）和可选的连续金属层（98）上具有间隔开的金属附接平台（94,96）。 在典型的应用中，一端（94）被焊接到接触焊盘（66,68），其中功率消散部件（12）也被连接，另一端（96）被焊接到附近的接地引线（26分钟） ）。

公开(公告)号：EP2894953A4

公开(公告)日：2016-07-13

申请号：EP12884029

申请日：2012-09-10

Applicant: MEIKO ELECTRONICS CO LTD

Inventor： MATSUMOTO TOHRU ,  AOKI KENTARO ,  TODA MITSUAKI

IPC: H05K3/46 ,  H05K3/00

CPC classification number: H05K1/03 ,  B32B37/02 ,  B32B37/06 ,  B32B38/004 ,  B32B2307/202 ,  B32B2307/206 ,  B32B2457/08 ,  H05K1/188 ,  H05K3/0097 ,  H05K2201/10204 ,  H05K2201/10636 ,  H05K2203/063 ,  Y02P70/611 ,  Y10T156/1052 ,  Y10T428/22

公开(公告)号：EP2600700A1

公开(公告)日：2013-06-05

申请号：EP11401654.6

申请日：2011-12-02

Applicant: ADVA Optical Networking SE

Inventor： Wald, Toni ,  Liborius, Sven

IPC: H05K1/02 ,  H05K3/34

CPC classification number: H05K1/0209 ,  H05K1/0207 ,  H05K3/341 ,  H05K2201/066 ,  H05K2201/10204

Abstract: The invention relates to a method of cooling electronic circuit boards using surface mounted devices (SMD), the method comprising the steps of: after or during the board layout, filling empty spaces V1, V2, V3, V4, V5, V6, V7, V8, V9, V10 with at a number of heat sink devices 1, 2, 3, 4, 5 near a thermal hot spot and connecting the number of heat sink devices 1, 2, 3, 4, 5 to a thermally conducting path 25, 27, 29, 31, 33, 35 of the board N, respectively. Further, the invention relates to a heat sink device 1, 2, 3, 4, 5 adapted to implement the method according to the invention.

Abstract translation: 本发明涉及一种使用表面贴装装置（SMD）冷却电子电路板的方法，所述方法包括以下步骤：在板布局之后或期间，填充空空间V1，V2，V3，V4，V5，V6，V7， V8，V9，V10，其中多个散热装置1,2,3,4,5在热热点附近并将多个散热装置1,2,3,4,5连接到导热路径25 ，N号分别为27,29,31,33,35。 此外，本发明涉及适于实现根据本发明的方法的散热设备1,2,3,4,5。

公开(公告)号：EP2307895B1

公开(公告)日：2012-03-14

申请号：EP09757872.8

申请日：2009-06-03

Applicant: Eles Semiconductor Equipment S.P.A.

Inventor： DI LELLO, Stefano

IPC: G01R31/319 ,  G01R31/28 ,  H05K3/32 ,  H05K3/40 ,  H05K3/00

CPC classification number: G01R31/2891 ,  G01R1/0483 ,  G01R3/00 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10204 ,  H05K2201/10393 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0108 ,  H05K2203/162

Abstract: A test board (115;115') is proposed for testing electronic devices (105;105'), each one of them having a plurality of terminals (220;220') for electrically contacting the electronic device. The test board includes a support substrate (205;205'). A set of banks of electrically conductive receptacles (210;210') are arranged on the substrate each one for resting a corresponding electronic device; each receptacle (250,255;250',255') is adapted to receive a terminal of the corresponding electronic device. Locking means (225) are further arranged on the substrate for mechanically locking the electronic devices on the test board. The test board further includes assembly means (230-245) for mounting the locking means on the substrate independently of the receptacles.